POWER ESTIMATION AND POWER OPTIMAL COMMUNICATION IN DEEP SUBMICRON BUSES: ANALYTICAL MODELS AND STATISTICAL MEASURES

2002 ◽  
Vol 11 (06) ◽  
pp. 637-658 ◽  
Author(s):  
PAUL P. SOTIRIADIS ◽  
ANANTHA CHANDRAKASAN
Keyword(s):  
Analytical Model ◽  
Power Dissipation ◽  
Digital Circuits ◽  
Power Estimation ◽  
Deep Submicron ◽  
Analytical Models ◽  
Energy Estimation ◽  
Statistical Measures ◽  
Efficiency Measures ◽  
Distribution Of Power

Reduction of power dissipation in digital circuits is a subject of research in industry and academia. A major component of power dissipation in modern microprocessors is due to their large interconnect networks which are responsible for the distribution of power and clocks as well as for the intra-chip communication. Communication is realized by data and address buses. In this paper we (i) discuss an analytical model for energy estimation in deep submicron buses, (ii) present statistical energy measures based on the analytical model, (iii) derive the energy limits of communication through buses, (iv) and introduce energy efficiency measures of communication.

scholarly journals Novel Structure and Thermal Design and Analysis for CubeSats in Formation Flying

Aerospace ◽  
2021 ◽  
Vol 8 (6) ◽  
pp. 150
Author(s):  
Yeon-Kyu Park ◽  
Geuk-Nam Kim ◽  
Sang-Young Park
Keyword(s):  
Analytical Model ◽  
Formation Flying ◽  
Thermal Environment ◽  
Thermal Analyses ◽  
Thermal Design ◽  
Analytical Models ◽  
Test Results ◽  
Solar Panels ◽  
Novel Structure ◽  
Micro Propulsion

The CANYVAL-C (CubeSat Astronomy by NASA and Yonsei using a virtual telescope alignment for coronagraph) is a space science demonstration mission that involves taking several images of the solar corona with two CubeSats—1U CubeSat (Timon) and 2U CubeSat (Pumbaa)—in formation flying. In this study, we developed and evaluated structural and thermal designs of the CubeSats Timon and Pumbaa through finite element analyses, considering the nonlinearity effects of the nylon wire of the deployable solar panels installed in Pumbaa. On-orbit thermal analyses were performed with an accurate analytical model for a visible camera on Timon and a micro propulsion system on Pumbaa, which has a narrow operating temperature range. Finally, the analytical models were correlated for enhancing the reliability of the numerical analysis. The test results indicated that the CubeSats are structurally safe with respect to the launch environment and can activate each component under the space thermal environment. The natural frequency of the nylon wire for the deployable solar panels was found to increase significantly as the wire was tightened strongly. The conditions of the thermal vacuum and cycling testing were implemented in the thermal analytical model, which reduced the differences between the analysis and testing.

Triple-bit method for power estimation of nonlinear digital circuits in FPGAs

2010 ◽  
Vol 46 (13) ◽  
pp. 903 ◽  
Author(s):  
B. Jovanovic ◽  
R. Jevtic ◽  
C. Carreras
Keyword(s):  
Digital Circuits ◽  
Power Estimation

The effects of geometric offsets on the dynamic responses of a Scott—Russell amplifying mechanism with flexible hinges

2009 ◽  
Vol 223 (10) ◽  
pp. 2413-2423 ◽  
Author(s):  
C-M Chen ◽  
R-F Fung
Keyword(s):  
Numerical Simulations ◽  
Analytical Model ◽  
Dynamic Responses ◽  
Analytical Models ◽  
Dynamic Equations ◽  
Magnification Factor ◽  
Flexure Hinges ◽  
Magnification Factors ◽  
Straight Line ◽  
Deviation Factor

The dynamic equations of a micro-positioning Scott—Russell (SR) mechanism associated with two flexible hinges and an offset are developed to calculate output responses. Both rigid and flexible hinges are considered to explore the results. The main features in the kinematics of the SR mechanism are its displacement amplification and straight-line motion, which are widely needed in practical industries. The manufacturing inaccuracy of the SR mechanism definitely causes geometric offsets of flexure hinges, and affects displacement amplification and straight-line output motion. Analytical models based on kinematics and Hamilton's principle are derived to explore the variation of linearity ratio, magnification factor, and deviation factor due to various offsets and link lengths. From numerical simulations for the SR mechanism with various offsets of flexible hinges in the conditions of different link lengths, it is found that offsets of flexure hinges obviously affect the amplifying factor and linearity ratio, and appear to dominate the changes of magnification factors. Moreover, an analytical model is also used to predict magnification factors due to various offsets. Finally, some conclusions concerning the effects of offset on the performance of the SR mechanism are drawn.

Modeling of residual stresses by correlating surface topography in machining of AISI 52100 steel

2021 ◽  
pp. 1-26
Author(s):  
Chao Liu ◽  
Yan He ◽  
Yufeng Li ◽  
Yulin Wang ◽  
Shilong Wang ◽  
...  
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Cutting Force ◽  
Surface Topography ◽  
Analytical Model ◽  
Analytical Models ◽  
Workpiece Surface ◽  
Dynamic Cutting Force ◽  
Intermittent Cutting ◽  
Effect Of Surface

Abstract The residual stresses could affect the ability of components to bear loading conditions and also the performance. The researchers considered workpiece surface as a plane and ignored the effect of surface topography induced by the intermittent cutting process when modeling residual stresses. The aim of this research develops an analytical model to predict workpiece residual stresses during intermittent machining by correlating the effect of surface topography. The relative motions of tool and workpiece are analyzed for modeling thermal-mechanical and surface topography. The influence of dynamic cutting force and thermal on different positions of surface topography is also considered in analytical model. Then the residual stresses model with the surface topography effect can be developed in intermittent cutting. The analytical models of dynamic cutting force, surface topography and residual stresses are verified by the experiments. The variation trend of evaluated values of the residual stress of workpiece is basically consistent with that of measured values. The compressive residual stress of workpiece surface in highest point of the surface topography are higher than that in the lowest point.

Approximate Analytical Model for a First Level Package With Non-Uniformly Powered Die

2006 ◽  
Author(s):  
Abhijit Kaisare ◽  
Dereje Agonafer ◽  
A. Haji-Sheikh ◽  
Greg Chrysler ◽  
Ravi Mahajan
Keyword(s):  
Thermal Resistance ◽  
Analytical Model ◽  
Functional Integration ◽  
Thermal Design ◽  
Junction Temperature ◽  
Direct Result ◽  
Design Guideline ◽  
Functional Blocks ◽  
Distribution Of Power ◽  
Functional Components

Microprocessors continue to grow in capabilities, complexity and performance. Microprocessors typically integrate functional components such as logic and level two (L2) cache memory in their architecture. This functional integration of logic and memory results in improved performance of the microprocessor as the clock speed increases and the instruction execution time has decreased. However, the integration also introduces a layer of complexity to the thermal design and management of microprocessors. As a direct result of function integration, the power map on a microprocessor is typically highly non-uniform and the assumption of a uniform heat flux across the chip surface is not valid. The active side of the die is divided into several functional blocks with distinct power assigned to each functional block. Previous work [1,2] has been done to minimize the thermal resistance of the package by optimizing the distribution of the non-uniform powered functional blocks with different power matrices. This study further gives design guideline and key pointers to minimized thermal resistance for any number of functional blocks for a given non-uniformly powered microprocessor. In this paper, initially (Part I) temperature distribution of a typical package consisting of a uniformly powered die, heat spreader, TIM 1 & 2 and the base of the heat sink is calculated using an approximate analytical model. The results are then compared with a detailed numerical model and the agreement is within 5%. This study follows (Part II) with a thermal investigation of non-uniform powered functional blocks with a different power matrices with focus on distribution of power over die surface with an application of maximum, minimum and average uniform junction temperature over a given die area. This will help to predict the trend of the calculated distribution of power that will lead to the least thermal gradient over a given die area. This trend will further help to come up with design correlations for minimizing thermal resistance for any number of functional blocks for a given non-uniformly powered microprocessor numerically as well as analytically. The commercial finite element code ANSYS® is used for this analysis as a numerical tool.

scholarly journals Approximate Analytical Models of Shock-Wave Structure at Steady Mach Reflection

Fluids ◽  
2021 ◽  
Vol 6 (9) ◽  
pp. 305
Author(s):  
Mikhail V. Chernyshov ◽  
Karina E. Savelova ◽  
Anna S. Kapralova
Keyword(s):  
Experimental Data ◽  
Shock Wave ◽  
Comparative Analysis ◽  
Analytical Model ◽  
Mach Reflection ◽  
Supersonic Jet ◽  
Wave Structure ◽  
Analytical Models ◽  
Analytical Prediction ◽  
Shock Wave Structure

In this study, we obtain the comparative analysis of methods of quick approximate analytical prediction of Mach shock height in planar steady supersonic flows (for example, in supersonic jet flow and in narrowing channel between two wedges), that are developed since the 1980s and being actively modernized now. A new analytical model based on flow averaging downstream curved Mach shock is proposed, which seems more accurate than preceding models, comparing with numerical and experimental data.

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