scholarly journals Novel Structure and Thermal Design and Analysis for CubeSats in Formation Flying

Aerospace ◽  
2021 ◽  
Vol 8 (6) ◽  
pp. 150
Author(s):  
Yeon-Kyu Park ◽  
Geuk-Nam Kim ◽  
Sang-Young Park
Keyword(s):  
Analytical Model ◽  
Formation Flying ◽  
Thermal Environment ◽  
Thermal Analyses ◽  
Thermal Design ◽  
Analytical Models ◽  
Test Results ◽  
Solar Panels ◽  
Novel Structure ◽  
Micro Propulsion

The CANYVAL-C (CubeSat Astronomy by NASA and Yonsei using a virtual telescope alignment for coronagraph) is a space science demonstration mission that involves taking several images of the solar corona with two CubeSats—1U CubeSat (Timon) and 2U CubeSat (Pumbaa)—in formation flying. In this study, we developed and evaluated structural and thermal designs of the CubeSats Timon and Pumbaa through finite element analyses, considering the nonlinearity effects of the nylon wire of the deployable solar panels installed in Pumbaa. On-orbit thermal analyses were performed with an accurate analytical model for a visible camera on Timon and a micro propulsion system on Pumbaa, which has a narrow operating temperature range. Finally, the analytical models were correlated for enhancing the reliability of the numerical analysis. The test results indicated that the CubeSats are structurally safe with respect to the launch environment and can activate each component under the space thermal environment. The natural frequency of the nylon wire for the deployable solar panels was found to increase significantly as the wire was tightened strongly. The conditions of the thermal vacuum and cycling testing were implemented in the thermal analytical model, which reduced the differences between the analysis and testing.

Development and test of a self-centering fluidic viscous damper

2020 ◽  
Vol 23 (13) ◽  
pp. 2835-2849
Author(s):  
Ruizhao Zhu ◽  
Tong Guo ◽  
Frank Mwangilwa
Keyword(s):  
Energy Dissipation ◽  
Numerical Model ◽  
Analytical Model ◽  
Fatigue Tests ◽  
The Self ◽  
Analytical Models ◽  
Viscous Damper ◽  
Test Results ◽  
Loading Tests ◽  
Reversed Loading

This research presents a novel self-centering fluidic viscous damper that incorporates preloaded ring springs to offer self-centering capability and a fluidic viscous damper for energy dissipation. A full-scale self-centering fluidic viscous damper was developed and subjected to low-cyclic reversed loading tests. The test results show the self-centering fluidic viscous damper has both displacement-dependent and velocity-dependent hysteric responses with self-centering capability. Fatigue tests further show that the self-centering fluidic viscous damper maintains a stable hysteretic response under reversed loading. An analytical model and a numerical model are developed for the proposed self-centering fluidic viscous damper and analyzed. Comparisons of test results and the numerical and analytical models show similar hysteric responses, thereby validating the accuracy of the numerical and analytical models to simulate the behavior of the proposed damper.

Development and Integration of a Semi-Analytical PCB Thermal Design Technique With an Infrared Thermal Imaging System

2001 ◽  
Author(s):  
Hyunjae Park ◽  
Nicholas Nigro ◽  
Neil Gollhardt ◽  
Ping Lee
Keyword(s):  
Analytical Model ◽  
Thermal Imaging ◽  
Printed Circuit Boards ◽  
Imaging System ◽  
Design Tool ◽  
Thermal Design ◽  
Analytical Models ◽  
Design Technique ◽  
Conduction Model ◽  
Thermal Imaging System

Abstract Traditionally, analytical models are developed to predict the thermal behavior of Printed Circuit Boards (PCBs). The predicted results are then verified with other analytical or experimental results prior to using the models in design. This is a time intensive process and the results predicted using these models may include limitation due to idealization. In order to overcome this disadvantage, a semi-analytical model is proposed in this study. The semi-analytical model uses analytic theory in conjunction with results obtained from an Infrared-Radiation Thermal Imaging System (IRTIS). The model is verified and updated, allowing the results to be immediately incorporated into PCB thermal design. The parameters in the semi-analytical model are determined by employing a least squares temperature curve fit for the first upstream heating component in conjunction with a simple conduction model for the PCB wall. The model was tested with a natural convection cooled PCB with three inline heating components. Temperature data for the first upstream component was measured with an IRTIS and fit to the semi-analytical model. The model predicted temperature results for all three heating components with good agreement. The PCB thermal design technique enables the IRTIS to be employed as a preliminary design tool that significantly reduces design iterations through the use of the semi-analytical model.

Thermal Analysis of Cooling System in a Gas Turbine Transition Piece

2011 ◽  
Author(s):  
Jun Su Park ◽  
Namgeon Yun ◽  
Hokyu Moon ◽  
Kyung Min Kim ◽  
Sin-Ho Kang ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Gas Turbine ◽  
Thermal Stresses ◽  
Cooling System ◽  
Structural Information ◽  
Thermal Analyses ◽  
Thermal Design ◽  
Transfer Coefficients ◽  
Transition Piece ◽  
Inlet Conditions

This paper presents thermal analyses of the cooling system of a transition piece, which is one of the primary hot components in a gas turbine engine. The thermal analyses include heat transfer distributions induced by heat and fluid flow, temperature, and thermal stresses. The purpose of this study is to provide basic thermal and structural information on transition piece, to facilitate their maintenance and repair. The study is carried out primarily by numerical methods, using the commercial software, Fluent and ANSYS. First, the combustion field in a combustion liner with nine fuel nozzles is analyzed to determine the inlet conditions of a transition piece. Using the results of this analysis, pressure distributions inside a transition piece are calculated. The outside of the transition piece in a dump diffuser system is also analyzed. Information on the pressure differences is then used to obtain data on cooling channel flow (one of the methods for cooling a transition piece). The cooling channels have exit holes that function as film-cooling holes. Thermal and flow analyses are carried out on the inside of a film-cooled transition piece. The results are used to investigate the adjacent temperatures and wall heat transfer coefficients inside the transition piece. Overall temperature and thermal stress distributions of the transition piece are obtained. These results will provide a direction to improve thermal design of transition piece.

The effects of geometric offsets on the dynamic responses of a Scott—Russell amplifying mechanism with flexible hinges

2009 ◽  
Vol 223 (10) ◽  
pp. 2413-2423 ◽  
Author(s):  
C-M Chen ◽  
R-F Fung
Keyword(s):  
Numerical Simulations ◽  
Analytical Model ◽  
Dynamic Responses ◽  
Analytical Models ◽  
Dynamic Equations ◽  
Magnification Factor ◽  
Flexure Hinges ◽  
Magnification Factors ◽  
Straight Line ◽  
Deviation Factor

The dynamic equations of a micro-positioning Scott—Russell (SR) mechanism associated with two flexible hinges and an offset are developed to calculate output responses. Both rigid and flexible hinges are considered to explore the results. The main features in the kinematics of the SR mechanism are its displacement amplification and straight-line motion, which are widely needed in practical industries. The manufacturing inaccuracy of the SR mechanism definitely causes geometric offsets of flexure hinges, and affects displacement amplification and straight-line output motion. Analytical models based on kinematics and Hamilton's principle are derived to explore the variation of linearity ratio, magnification factor, and deviation factor due to various offsets and link lengths. From numerical simulations for the SR mechanism with various offsets of flexible hinges in the conditions of different link lengths, it is found that offsets of flexure hinges obviously affect the amplifying factor and linearity ratio, and appear to dominate the changes of magnification factors. Moreover, an analytical model is also used to predict magnification factors due to various offsets. Finally, some conclusions concerning the effects of offset on the performance of the SR mechanism are drawn.

Dynamic – Thermal Analyses of a Structurally Reconfigured Electronics Package Onboard Mini Satellite

2014 ◽  
Vol 592-594 ◽  
pp. 2117-2121 ◽  
Author(s):  
P. Veeramuthuvel ◽  
S. Jayaraman ◽  
Shankar Krishnapillai ◽  
M. Annadurai ◽  
A.K. Sharma
Keyword(s):  
Finite Element ◽  
Printed Circuit Board ◽  
Thermal Environment ◽  
Thermal Analyses ◽  
Simulation Models ◽  
Element Model ◽  
Circuit Board ◽  
Element Analysis ◽  
Transfer Path ◽  
Vibration Responses

The electronics package in a spacecraft is subjected to a variety of dynamic loads during launch phase and suitable thermal environment for the mission life. The dynamic and thermal analyses performed for a structurally reconfigured electronics package. Two different simulation models are developed to carry out the analyses. This paper discusses in two parts, in part-1, the vibration responses are determined at various critical locations, including on the Printed Circuit Board (PCB) for the vibration loads specified by launch vehicle using Finite Element Analysis (FEA). The mechanical properties of PCB are determined from the test specimens, which are then incorporated in the finite element model. In part-2, the steady-state temperature distributions on the components and on the PCB are determined, to check the effectiveness of heat transfer path from the components to the base of the package and to verify the predicted values are within the acceptable temperature limits specified. The predicted temperature values are then compared with on-orbit observations.

Modeling of residual stresses by correlating surface topography in machining of AISI 52100 steel

2021 ◽  
pp. 1-26
Author(s):  
Chao Liu ◽  
Yan He ◽  
Yufeng Li ◽  
Yulin Wang ◽  
Shilong Wang ◽  
...  
Keyword(s):  
Residual Stress ◽  
Residual Stresses ◽  
Cutting Force ◽  
Surface Topography ◽  
Analytical Model ◽  
Analytical Models ◽  
Workpiece Surface ◽  
Dynamic Cutting Force ◽  
Intermittent Cutting ◽  
Effect Of Surface

Abstract The residual stresses could affect the ability of components to bear loading conditions and also the performance. The researchers considered workpiece surface as a plane and ignored the effect of surface topography induced by the intermittent cutting process when modeling residual stresses. The aim of this research develops an analytical model to predict workpiece residual stresses during intermittent machining by correlating the effect of surface topography. The relative motions of tool and workpiece are analyzed for modeling thermal-mechanical and surface topography. The influence of dynamic cutting force and thermal on different positions of surface topography is also considered in analytical model. Then the residual stresses model with the surface topography effect can be developed in intermittent cutting. The analytical models of dynamic cutting force, surface topography and residual stresses are verified by the experiments. The variation trend of evaluated values of the residual stress of workpiece is basically consistent with that of measured values. The compressive residual stress of workpiece surface in highest point of the surface topography are higher than that in the lowest point.

Approximate Analytical Model for a First Level Package With Non-Uniformly Powered Die

2006 ◽  
Author(s):  
Abhijit Kaisare ◽  
Dereje Agonafer ◽  
A. Haji-Sheikh ◽  
Greg Chrysler ◽  
Ravi Mahajan
Keyword(s):  
Thermal Resistance ◽  
Analytical Model ◽  
Functional Integration ◽  
Thermal Design ◽  
Junction Temperature ◽  
Direct Result ◽  
Design Guideline ◽  
Functional Blocks ◽  
Distribution Of Power ◽  
Functional Components

Microprocessors continue to grow in capabilities, complexity and performance. Microprocessors typically integrate functional components such as logic and level two (L2) cache memory in their architecture. This functional integration of logic and memory results in improved performance of the microprocessor as the clock speed increases and the instruction execution time has decreased. However, the integration also introduces a layer of complexity to the thermal design and management of microprocessors. As a direct result of function integration, the power map on a microprocessor is typically highly non-uniform and the assumption of a uniform heat flux across the chip surface is not valid. The active side of the die is divided into several functional blocks with distinct power assigned to each functional block. Previous work [1,2] has been done to minimize the thermal resistance of the package by optimizing the distribution of the non-uniform powered functional blocks with different power matrices. This study further gives design guideline and key pointers to minimized thermal resistance for any number of functional blocks for a given non-uniformly powered microprocessor. In this paper, initially (Part I) temperature distribution of a typical package consisting of a uniformly powered die, heat spreader, TIM 1 & 2 and the base of the heat sink is calculated using an approximate analytical model. The results are then compared with a detailed numerical model and the agreement is within 5%. This study follows (Part II) with a thermal investigation of non-uniform powered functional blocks with a different power matrices with focus on distribution of power over die surface with an application of maximum, minimum and average uniform junction temperature over a given die area. This will help to predict the trend of the calculated distribution of power that will lead to the least thermal gradient over a given die area. This trend will further help to come up with design correlations for minimizing thermal resistance for any number of functional blocks for a given non-uniformly powered microprocessor numerically as well as analytically. The commercial finite element code ANSYS® is used for this analysis as a numerical tool.

scholarly journals Approximate Analytical Models of Shock-Wave Structure at Steady Mach Reflection

Fluids ◽  
2021 ◽  
Vol 6 (9) ◽  
pp. 305
Author(s):  
Mikhail V. Chernyshov ◽  
Karina E. Savelova ◽  
Anna S. Kapralova
Keyword(s):  
Experimental Data ◽  
Shock Wave ◽  
Comparative Analysis ◽  
Analytical Model ◽  
Mach Reflection ◽  
Supersonic Jet ◽  
Wave Structure ◽  
Analytical Models ◽  
Analytical Prediction ◽  
Shock Wave Structure

In this study, we obtain the comparative analysis of methods of quick approximate analytical prediction of Mach shock height in planar steady supersonic flows (for example, in supersonic jet flow and in narrowing channel between two wedges), that are developed since the 1980s and being actively modernized now. A new analytical model based on flow averaging downstream curved Mach shock is proposed, which seems more accurate than preceding models, comparing with numerical and experimental data.

Updating of Non-Conservative Systems Using Inverse Methods

1997 ◽  
Author(s):  
Ladislav Starek ◽  
Milos Musil ◽  
Daniel J. Inman
Keyword(s):  
Analytical Model ◽  
Degrees Of Freedom ◽  
Ad Hoc ◽  
Natural Frequencies ◽  
Eigenvalue Problems ◽  
Model Updating ◽  
Analytical Models ◽  
Mode Shapes ◽  
Element Analysis ◽  
Modal Data

Abstract Several incompatibilities exist between analytical models and experimentally obtained data for many systems. In particular finite element analysis (FEA) modeling often produces analytical modal data that does not agree with measured modal data from experimental modal analysis (EMA). These two methods account for the majority of activity in vibration modeling used in industry. The existence of these discrepancies has spanned the discipline of model updating as summarized in the review articles by Inman (1990), Imregun (1991), and Friswell (1995). In this situation the analytical model is characterized by a large number of degrees of freedom (and hence modes), ad hoc damping mechanisms and real eigenvectors (mode shapes). The FEM model produces a mass, damping and stiffness matrix which is numerically solved for modal data consisting of natural frequencies, mode shapes and damping ratios. Common practice is to compare this analytically generated modal data with natural frequencies, mode shapes and damping ratios obtained from EMA. The EMA data is characterized by a small number of modes, incomplete and complex mode shapes and non proportional damping. It is very common in practice for this experimentally obtained modal data to be in minor disagreement with the analytically derived modal data. The point of view taken is that the analytical model is in error and must be refined or corrected based on experimented data. The approach proposed here is to use the results of inverse eigenvalue problems to develop methods for model updating for damped systems. The inverse problem has been addressed by Lancaster and Maroulas (1987), Starek and Inman (1992,1993,1994,1997) and is summarized for undamped systems in the text by Gladwell (1986). There are many sophisticated model updating methods available. The purpose of this paper is to introduce using inverse eigenvalues calculated as a possible approach to solving the model updating problem. The approach is new and as such many of the practical and important issues of noise, incomplete data, etc. are not yet resolved. Hence, the method introduced here is only useful for low order lumped parameter models of the type used for machines rather than structures. In particular, it will be assumed that the entries and geometry of the lumped components is also known.

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