FAILURE MODELING OF CONSTANT FRACTION DISCRIMINATOR USING PHYSICS OF FAILURE APPROACH

2013 ◽  
Vol 20 (03) ◽  
pp. 1340002 ◽  
Author(s):  
ADITHYA THADURI ◽  
A. K. VERMA ◽  
V. GOPIKA ◽  
RAJESH GOPINATH ◽  
UDAY KUMAR
Keyword(s):  
Failure Mechanisms ◽  
Reliability Prediction ◽  
Time To Failure ◽  
Point Location ◽  
Physics Of Failure ◽  
Failure Modeling ◽  
Constant Fraction Discriminator ◽  
Custom Made ◽  
Failure Point ◽  
Critical Components

Due to several advancements in the technology trends in electronics, the reliability prediction by the constant failure methods and standards no longer provide accurate time to failure. The physics of failure methodology provides a detailed insight on the operation, failure point location and causes of failure for old, existing and newly developed components with consideration of failure mechanisms. Since safety is a major criteria for the nuclear industries, the failure modeling of advanced custom made critical components that exists on signal conditioning module are need to be studied with higher confidence. One of the components, constant fraction discriminator, is the critical part at which the failure phenomenon and modeling by regression is studied in this paper using physics of failure methodology.

A New Reliability Prediction Method Based on Physics of Failure Method for Product Design and Manufacture

2012 ◽  
Vol 548 ◽  
pp. 521-526 ◽  
Author(s):  
Xing Hao Wang ◽  
Jiang Shao ◽  
Xiao Yu Liu
Keyword(s):  
Monte Carlo ◽  
Monte Carlo Calculation ◽  
Computational Cost ◽  
Prediction Method ◽  
New Method ◽  
Reliability Prediction ◽  
Time To Failure ◽  
Physics Of Failure ◽  
First Order ◽  
Environment Stress

Different from the reliability prediction method on handbook, the reliability prediction method based on Physics of Failure (PoF) model takes failure mechanism as theoretical basis, and combines the design in-formation with the environment stress of the product to predict the time to failure. When the uncertain of the parameters is considered to predict the reliability, Monte-Carlo calculation method is always used here. How-ever, the Monte-Carlo method needs large computational cost, especially for large and complicated electronic systems. A new reliability prediction method which combines the first order reliability with the reliability pre-diction method based on PoF model was proposed. The new method utilized the first order method to calculate the position of design point and reliability index, thus Monte-Carlo calculation process was avoided. Example calculation results showed that the new method improves the prediction efficiency without decreasing the accuracy of reliability, thus it is feasible for reliability prediction of electronic product in engineering.

TWO-STAGE DESIGN OF EXPERIMENTS APPROACH FOR PREDICTION OF RELIABILITY OF OPTOCOUPLERS

2012 ◽  
Vol 19 (02) ◽  
pp. 1250007 ◽  
Author(s):  
ADITHYA THADURI ◽  
A. K. VERMA ◽  
GOPIKA VINOD ◽  
M. G. RAJESH ◽  
UDAY KUMAR
Keyword(s):  
Design Of Experiments ◽  
Failure Mechanisms ◽  
Operating Conditions ◽  
Reliability Prediction ◽  
Wafer Level ◽  
Electrical Parameters ◽  
Process Technology ◽  
Stage Design ◽  
Physics Of Failure ◽  
Materials Used

Conventionally, reliability prediction of electronic components is carried out using standard handbooks such as MIL STD 217 plus, Telcordia, etc. But these methods fail to provide a realistic estimate of reliability for upcoming technologies. Currently, electronic reliability prediction is moving towards applying the Physics of Failure approach which considers information on process, technology, fabrication techniques, materials used, etc. Industries employ different technologies like CMOS, BJT and BICMOS for various applications. The possibility of chance of failure at interdependencies of materials, processes, and characteristics under operating conditions is the major concern which affects the performance of the devices. They are characterized by several failure mechanisms at various stages such as wafer level, interconnection, etc. For this, the dominant failure mechanisms and stress parameters needs to be identified. Optocouplers are used in input protection of several instrumentation systems providing safety under over-stress conditions. Hence, there is a need to study the reliability and safety aspects of optocouplers. Design of experiments is an efficient and prominent methodology for finding the reliability of the item, as the experiment provides a proof for the hypothesis under consideration. One of the important techniques involved is Taguchi method which is employed for finding the prominent failure mechanisms in semiconductor devices. By physics of failure approach, the factors that are affecting the performance on both environmental and electrical parameters with stress levels for optocouplers are identified. By constructing a 2-stage Taguchi array with these parameters where output parameters decides the effect of top two dominant failure mechanisms and their extent of chance of failure can be predicted. This analysis helps us in making the appropriate modifications considering both the failure mechanisms for the reliability growth of these devices. This paper highlights the application of design of experiments for finding the dominant failure mechanisms towards using physics of failure approach in electronic reliability prediction of optocouplers for application of instrumentation.

Physics of Failure as an Integrated Part of Design for Reliability

2004 ◽  
Vol 47 (1) ◽  
pp. 67-73 ◽  
Author(s):  
Ian Snook ◽  
Jane Marshall ◽  
Robert Newman
Keyword(s):  
Failure Mechanisms ◽  
Cost Savings ◽  
Assessment Model ◽  
Time To Failure ◽  
Physics Of Failure ◽  
Design For Reliability ◽  
Accurate Design ◽  
Electronics Reliability ◽  
United Kingdom Government ◽  
Effective Use

A study of the use of Physics of Failure (PoF) methods was undertaken as part of a collaboratively funded United Kingdom Government Department of Industry (UK DTI) project for developing a holistic methodology and assessment model for the enhancement of electronics reliability. Several case studies were conducted to review the use of PoF techniques. The study concluded PoF methods, and in particular life modeling, are essential tools in design for reliability. PoF analysis can also be used to establish reliability enhancement testing (RET) and environmental stress screening (ESS) conditions. A guide for the effective use and inclusion of the PoF methods in the product design and development process was developed and described. Use of the techniques facilitates accurate design right, thereby avoiding redesign and retest cycles, with consequent cost savings and reduced product development times. The PoF method has limitations. It is essentially a bottom-up approach assessing time to failure due to known failure mechanisms. Consequently, it is difficult to apply to full systems, has limitations in assessing failure rate prior to the onset of life-limiting wear out, and is dependent on identifying and having a validated model for all potential failure mechanisms.

STRESS FACTOR AND FAILURE ANALYSIS OF CONSTANT FRACTION DISCRIMINATOR USING DESIGN OF EXPERIMENTS

2013 ◽  
Vol 20 (03) ◽  
pp. 1340003 ◽  
Author(s):  
ADITHYA THADURI ◽  
A. K. VERMA ◽  
V. GOPIKA ◽  
RAJESH GOPINATH ◽  
UDAY KUMAR
Keyword(s):  
Design Of Experiments ◽  
Failure Analysis ◽  
Failure Modes ◽  
Time To Failure ◽  
Distribution Models ◽  
Physics Of Failure ◽  
Failure Characteristics ◽  
Constant Fraction Discriminator ◽  
The Impact ◽  
Stress Parameters

Reliability prediction using traditional approaches were implemented at earlier stages of electronics. But due to advancements in science and technology, the above models are outdated. The alternative approach, physics of failure provides exhaustive information on basic failure phenomenon with failure mechanisms, failure modes and failure analysis becomes prominent because this method depends on factors like materials, processes, technology, etc., of the component. Constant fraction discriminators which is important component in NFMS needs to study failure characteristics and this paper provides this information on failure characteristics using physics of failure approach. Apart from that, the combined physics of failure approach with the statistical methods such as design of experiments, accelerated testing and failure distribution models to quantify time to failure of this electronic component by radiation and temperature as stress parameters. The SEM analysis of the component is carried out by decapsulating the samples and studied the impact of stress parameters on the device layout.

Failure Mechanisms and Lifetime Simulation Method for Nano Scale CMOS Device

2011 ◽  
Vol 483 ◽  
pp. 740-744
Author(s):  
Ying Cheng ◽  
Rui Kang ◽  
Gan Ghua Zhang
Keyword(s):  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Simulation Method ◽  
Processing Parameters ◽  
Time To Failure ◽  
Carrier Injection ◽  
Element Analysis ◽  
Physics Of Failure ◽  
Nano Scale ◽  
Degradation Failure

In nano scale, the degradation failure mechanism for CMOS device such as hot-carrier injection, breakdown of thin oxides, electro-migration and NBTI (Negative Bias Temperature Instability) induced damage become a major reliability concern. Physics-of-Failure method is used in lifetime prediction of nano scale CMOS, which integrates loading condition, package, geometry and material with time-to-failure. Common lifetime models for these mechanisms are described and a method to estimate lifetime of nano-scale CMOS device, with simulation based on Physics-of-Failure. Through Failure Mode, Mechanism and Effect Analysis, failure mechanism and lifetime models are clarified and selected, as well as structure, material, processing parameters and environment conditions. Stress analysis, which includes electrical stress by EDA and thermal analysis by FEA (Finite Element Analysis) are carried out to acquire parameters in lifetime model. Damage accumulation algorism and competing theory are utilized to predict lifetime of the device. This method will help CMOS device design engineers better understand the failure mechanisms in nano-scale and take design-for-reliability measures.

scholarly journals Custom-Made Antibiotic Cement Nails in Orthopaedic Trauma: Review of Outcomes, New Approaches, and Perspectives

2015 ◽  
Vol 2015 ◽  
pp. 1-12 ◽  
Author(s):  
Marcin K. Wasko ◽  
Rafal Kaminski
Keyword(s):  
Failure Mechanisms ◽  
Medullary Canal ◽  
Bone Infection ◽  
Long Bone ◽  
Current Evidence ◽  
Orthopaedic Trauma ◽  
Antibiotic Cement ◽  
Custom Made ◽  
Trauma Surgeons ◽  
Technique Failure

Since the first description in 2002 by Paley and Herzenberg, antibiotic bone cement nails (ACNs) have become an effective tool in the orthopaedic trauma surgeons’ hands. They simultaneously elute high amounts of antibiotics into medullary canal dead space and provide limited stability to the debrided long bone. In this paper, we perform a systematic review of current evidence on ACNs in orthopaedic trauma and provide an up-to-date review of the indications, operative technique, failure mechanisms, complications, outcomes, and outlooks for the ACNs use in long bone infection.

scholarly journals Filling machine preventive maintenance using age replacement method in PT Lucas Djaja

2018 ◽  
Vol 154 ◽  
pp. 01056
Author(s):  
Fifi Herni Mustofa ◽  
Ria Ferdian Utomo ◽  
Kusmaningrum Soemadi
Keyword(s):  
Maintenance Cost ◽  
Time To Failure ◽  
High Failure Rate ◽  
Corrective Maintenance ◽  
Replacement Method ◽  
Critical Components ◽  
Age Replacement ◽  
Engine Maintenance ◽  
A Company ◽  
Mean Time

PT Lucas Djaja is a company engaged in the pharmaceutical industry which produce sterile drugs and non-sterile. Filling machine has a high failure rate and expensive corrective maintenance cost. PT Lucas Djaja has a policy to perform engine maintenance by way of corrective maintenance. The study focused on the critical components, namely bearing R2, bearing 625 and bearing 626. When the replacement of the failure done by the company is currently using the formula mean time to failure with the result of bearing R2 at point 165 days, bearing 625 at a point 205 days, and bearing 626 at a point 182 days. Solutions generated by using age replacement method with minimization of total maintenance cost given on the bearing R2 at a point 60 days, bearing 625 at the point of 80 days and bearing 626 at a point 40 days.

Reliability Analysis of High Gain Integrated DC–DC Topologies for Xenon Lamp Applications

2019 ◽  
Vol 28 (10) ◽  
pp. 1950168
Author(s):  
Divya Navamani ◽  
K. Vijayakumar ◽  
Jason Manoraj
Keyword(s):  
Reliability Analysis ◽  
Input Voltage ◽  
High Gain ◽  
Working Environment ◽  
Reliability Prediction ◽  
Xenon Lamp ◽  
Time To Failure ◽  
High Efficient ◽  
Switched Mode Power Supplies ◽  
Converter Topologies

Emerging switched-mode power supplies incorporated applications demand reliable, less volume and high efficient dc–dc converters. The persistent usage of the dc–dc converters in various applications makes their reliability a significant concern. Hence, this paper deals with a family of non-isolated high gain integrated dc–dc converter topologies derived from a quadratic converter. The reliability analysis is carried out using electronic equipment reliability handbook, MIL-HDBK-217F. For the first time, reliability prediction is done based on the working environment of the power electronic equipments. We developed the reliability prediction for the converters used in the lighting application such as automotive headlamp and aircraft landing lights. The mean time to failure for both the environment is calculated. The reliability comparison is carried out for the proposed topologies and the most reliable converter is chosen. Also, all the converter topologies are simulated using nL5 simulator to confirm their theoretical results. Finally, a laboratory prototype for 40 W with input voltage of 12 V is implemented for the most reliable topology to validate the steady-state analysis.

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