SURFACE METALIZATION ON THE PHOTO-EMISSION, PHOTO-ABSORPTION AND CORE-LEVEL SHIFT OF NANOSOLID SILICON
Cu , Al , and Ti films of ~ 10 nm thickness were deposited on porous silicon (PS) at room temperature using Filtered Cathodic Vacuum Arc system and annealed at 800°C for 10 min in vacuum. The PS layers were obtained by anodization of Si wafer. X-ray photoelectron spectroscopy, photoluminescence (PL), photo-absorption (PA), and X-ray diffraction studies revealed that before annealing just Cu -deposited sample exhibited PL blueshift, PA redshift, and Si -2p level shift due to the Cu diffusion at the surface of PS. While after annealing, Cu - and Ti -deposited samples exhibited obvious PA redshift and Si -2p level shift, which arise from the crystal field variation due to the formation of Cu / Ti silicides at the surface as well as the conduction electronic transportation.