Capacitorless Dynamic Random Access Memory Cell with Highly Scalable Surrounding Gate Structure

2007 ◽  
Vol 46 (4B) ◽  
pp. 2143-2147 ◽  
Author(s):  
Hoon Jeong ◽  
Yeun Seung Lee ◽  
Sangwoo Kang ◽  
Il Han Park ◽  
Woo Young Choi ◽  
...  
Keyword(s):  
Random Access ◽  
Memory Cell ◽  
Random Access Memory ◽  
Dynamic Random Access Memory ◽  
Access Memory ◽  
Gate Structure ◽  
Surrounding Gate

A 1T Dynamic Random Access Memory Cell Based on Gated Thyristor with Surrounding Gate Structure for High Scalability

2018 ◽  
Vol 18 (9) ◽  
pp. 5919-5924
Author(s):  
Hyungjin Kim ◽  
Sihyun Kim ◽  
Hyun-Min Kim ◽  
Kitae Lee ◽  
Sangwan Kim ◽  
...  
Keyword(s):  
Random Access ◽  
Memory Cell ◽  
Random Access Memory ◽  
Dynamic Random Access Memory ◽  
Access Memory ◽  
Gate Structure ◽  
Surrounding Gate ◽  
High Scalability

Analysis of Grain Boundary Dependent Memory Characteristics in Poly-Si One-Transistor Dynamic Random-Access Memory

2021 ◽  
Vol 21 (8) ◽  
pp. 4216-4222
Author(s):  
Songyi Yoo ◽  
In-Man Kang ◽  
Sung-Jae Cho ◽  
Wookyung Sun ◽  
Hyungsoon Shin
Keyword(s):  
Strong Electric Field ◽  
Memory Performance ◽  
Random Access ◽  
Memory Cell ◽  
Random Access Memory ◽  
Dynamic Random Access Memory ◽  
Thin Body ◽  
Memory Cells ◽  
Access Memory ◽  
Memory Characteristics

A capacitorless one-transistor dynamic random-access memory cell with a polysilicon body (poly-Si 1T-DRAM) has a cost-effective fabrication process and allows a three-dimensional stacked architecture that increases the integration density of memory cells. Also, since this device uses grain boundaries (GBs) as a storage region, it can be operated as a memory cell even in a thin body device. GBs are important to the memory characteristics of poly-Si 1T-DRAM because the amount of trapped charge in the GBs determines the memory’s data state. In this paper, we report on a statistical analysis of the memory characteristics of poly-Si 1T-DRAM cells according to the number and location of GBs using TCAD simulation. As the number of GBs increases, the sensing margin and retention time of memory cells deteriorate due to increasing trapped electron charge. Also, “0” state current increases and memory performance degrades in cells where all GBs are adjacent to the source or drain junction side in a strong electric field. These results mean that in poly-Si 1T-DRAM design, the number and location of GBs in a channel should be considered for optimal memory performance.

The Application of Deep UV Phase Shifted-Single Layer Halftone Reticles to 256 Mbit Dynamic Random Access Memory Cell Patterns

1994 ◽  
Vol 33 (Part 1, No. 12B) ◽  
pp. 6823-6830 ◽  
Author(s):  
Kohji Hashimoto ◽  
Donald J. Samuels ◽  
Timothy R. Farrell ◽  
Dan Moy ◽  
Ronald M. Martino ◽  
...  
Keyword(s):  
Random Access ◽  
Single Layer ◽  
Memory Cell ◽  
Random Access Memory ◽  
Dynamic Random Access Memory ◽  
Access Memory ◽  
Cell Patterns ◽  
Deep Uv
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