Anisotropic Thermal Expansion Coefficients of CeCu2Single Crystal under High Pressure

1992 ◽  
Vol 61 (8) ◽  
pp. 2624-2627 ◽  
Author(s):  
Yoshiya Uwatoko ◽  
Gendo Oomi ◽  
Izuru Umehara ◽  
Yoshichika Ōnuki
Keyword(s):  
High Pressure ◽  
Thermal Expansion ◽  
Anisotropic Thermal Expansion ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

Variations of lattice constants and thermal expansion coefficients of indium at high pressure and high temperature

2018 ◽  
Vol 38 (4) ◽  
pp. 406-413 ◽  
Author(s):  
Yusaku Takubo ◽  
Hidenori Terasaki ◽  
Tadashi Kondo ◽  
Shingo Mitai ◽  
Seiji Kamada ◽  
...  
Keyword(s):  
High Pressure ◽  
Thermal Expansion ◽  
High Temperature ◽  
Lattice Constants ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

scholarly journals Extraordinary anisotropic thermal expansion in photosalient crystals

IUCrJ ◽  
2020 ◽  
Vol 7 (1) ◽  
pp. 83-89 ◽  
Author(s):  
Khushboo Yadava ◽  
Gianpiero Gallo ◽  
Sebastian Bette ◽  
Caroline Evania Mulijanto ◽  
Durga Prasad Karothu ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Solid State ◽  
Metal Complexes ◽  
Single Crystals ◽  
Room Temperature ◽  
Volumetric Thermal Expansion ◽  
Anisotropic Thermal Expansion ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients ◽  
Multifunctional Properties

Although a plethora of metal complexes have been characterized, those having multifunctional properties are very rare. This article reports three isotypical complexes, namely [Cu(benzoate)L 2], where L = 4-styrylpyridine (4spy) (1), 2′-fluoro-4-styrylpyridine (2F-4spy) (2) and 3′-fluoro-4-styrylpyridine (3F-4spy) (3), which show photosalient behavior (photoinduced crystal mobility) while they undergo [2+2] cycloaddition. These crystals also exhibit anisotropic thermal expansion when heated from room temperature to 200°C. The overall thermal expansion of the crystals is impressive, with the largest volumetric thermal expansion coefficients for 1, 2 and 3 of 241.8, 233.1 and 285.7 × 10−6 K−1, respectively, values that are comparable to only a handful of other reported materials known to undergo colossal thermal expansion. As a result of the expansion, their single crystals occasionally move by rolling. Altogether, these materials exhibit unusual and hitherto untapped solid-state properties.

X-ray diffraction study of anisotropic thermal expansion in ZrMo2O8

1999 ◽  
Vol 32 (5) ◽  
pp. 1010-1011 ◽  
Author(s):  
R. Mittal ◽  
S. L. Chaplot ◽  
N. P. Lalla ◽  
R. K. Mishra
Keyword(s):  
Thermal Expansion ◽  
Diffraction Study ◽  
X Ray Diffraction ◽  
Temperature Dependent ◽  
X Ray ◽  
Cell Parameters ◽  
Anisotropic Thermal Expansion ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients ◽  
Trigonal Phase

Temperature-dependent X-ray diffraction measurements are reported for ZrMo2O8in the trigonal phase from 80 to 925 K. The measurements reveal highly anisotropic thermal expansion coefficients with average values of −3.9 × 10−6and 52 × 10−6 K−1for theaandccell parameters, respectively.

scholarly journals A system with adjustable positive or negative thermal expansion

2007 ◽  
Vol 463 (2082) ◽  
pp. 1585-1596 ◽  
Author(s):  
Joseph N Grima ◽  
Pierre S Farrugia ◽  
Ruben Gatt ◽  
Victor Zammit
Keyword(s):  
Thermal Expansion ◽  
Thermal Properties ◽  
Negative Thermal Expansion ◽  
Two Dimensional ◽  
Practical Applications ◽  
Anisotropic Thermal Expansion ◽  
Thermal Expansion Coefficients ◽  
Expansion Coefficients

We analyse the anisotropic thermal expansion properties of a two-dimensional structurally rigid construct made from rods of different materials connected together through hinges to form triangular units. In particular, we show that this system may be made to exhibit negative thermal expansion coefficients along certain directions or thermal expansion coefficients that are even more positive than any of the component materials. The end product is a multifunctional system with tunable thermal properties that can be tailor-made for particular practical applications.

Influence of Cr deficiency on sintering, thermal expansion and electrical properties of La0.75Sr0.25Cr1−xO3−δ as a SOFC interconnect material

2016 ◽  
Vol 30 (11) ◽  
pp. 1650127 ◽  
Author(s):  
Yi Ren ◽  
Wen Ma ◽  
Xiaoying Li ◽  
Jun Wang ◽  
Yu Bai ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Electrical Properties ◽  
Perovskite Phase ◽  
Ignition Process ◽  
Thermal Expansion Coefficients ◽  
Auto Ignition ◽  
Pure Perovskite Phase ◽  
Maximum Conductivity ◽  
Expansion Coefficients ◽  
Interconnect Material

The SOFC interconnect materials La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] [Formula: see text]–[Formula: see text] were prepared using an auto-ignition process. The influences of Cr deficiency on their sintering, thermal expansion and electrical properties were investigated. All the samples were pure perovskite phase after sintering at 1400[Formula: see text]C for 4 h. The cell volume of La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] decreased with increasing Cr deficient content. The relative density of the sintered bulk samples increased from 93.2% [Formula: see text] to a maximum value of 94.7% [Formula: see text] and then decreased to 87.7% [Formula: see text]. The thermal expansion coefficients of the sintered bulk samples were in the range of [Formula: see text]–[Formula: see text] (30–1000[Formula: see text]C), which are compatible with that of YSZ. Among the investigated samples, the sample with 0.02 Cr deficiency had a maximum conductivity of 40.4 Scm[Formula: see text] and the lowest Seebeck coefficient of 154.8 [Formula: see text]VK[Formula: see text] at 850[Formula: see text]C in pure He. The experimental results indicate that La[Formula: see text]Sr[Formula: see text]Cr[Formula: see text]O[Formula: see text] has the best properties and is much suitable for SOFC interconnect material application.

Novel Silicon-Elastomers for Advanced Soft Lithography

2006 ◽  
Vol 947 ◽  
Author(s):  
Kyung Choi
Keyword(s):  
Thermal Expansion ◽  
High Resolution ◽  
Soft Lithography ◽  
Materials Properties ◽  
Nano Scale ◽  
Thermal Expansion Coefficients ◽  
High Thermal Expansion ◽  
Expansion Coefficients

ABSTRACTHigh resolution pattern transfers in the nano-scale regime have been considerable challenges in ‘soft lithography’ to achieve nanodevices with enhanced performances. In this technology, the resolution of pattern integrations is significantly rely on the materials' properties of polydimethylsiloxane (PDMS) stamps. Since commercial PDMS stamps have shown limitations in nano-scale resolution soft lithography due to their low physical toughness and high thermal expansion coefficients, we developed stiffer, photocured PDMS silicon elastomers designed, specifically for nano-sized soft lithography and photopatternable nanofabrications.

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