Characterization of the Effect of High k Dielectric Process Conditions on the Performance of Flash Memory by a DOE Method

2010 ◽  
Vol 94 (1) ◽  
pp. 250-254 ◽  
Author(s):  
Shiow-Huey Chuang ◽  
Min-Lung Hsieh ◽  
Shih-Chieh Wu ◽  
Hong-Cai Lin ◽  
Tien-Sheng Chao ◽  
...  

2011 ◽  
Vol 32 (5) ◽  
pp. 686-688 ◽  
Author(s):  
Hyuk-Min Kwon ◽  
In-Shik Han ◽  
Jung-Deuk Bok ◽  
Sang-Uk Park ◽  
Yi-Jung Jung ◽  
...  

2004 ◽  
Vol 830 ◽  
Author(s):  
Ch. Sargentis ◽  
K. Giannakopoulos ◽  
A. Travlos ◽  
D. Tsamakis

ABSTRACTMOS memory devices containing semiconductor nanocrystals have drawn considerable attention recently, due to their advantages when compared to the conventional memories. Only little work has been done on memory devices containing metal nanoparticles.We describe the fabrication of a novel MOS device with embedded Pt nanoparticles in the HfO2 / SiO2 interface of a MOS device. Using as control oxide, a high-k dielectric, our device has a great degree of scalability. The fabricated nanoparticles are very small (about 5 nm) and have high density. High frequency C-V measurements demonstrate that this device operates as a memory device.


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