Transparent Ceramic Film Formation by Aerosol Deposition and Its Application to Optical Devices

2002 ◽  
Vol 75 (3) ◽  
pp. 111-116
Author(s):  
Toshiko MIZOKURO ◽  
Hiroyuki MOCHIZUKI ◽  
Noritaka YAMAMOTO ◽  
Takashi HIRAGA

2019 ◽  
Vol 15 (6) ◽  
pp. 760-768 ◽  
Author(s):  
Chuljun Lee ◽  
Myungjun Kim ◽  
Myung-Yeon Cho ◽  
Sang-Mo Koo ◽  
Jong-Min Oh ◽  
...  

1990 ◽  
Vol 206 ◽  
Author(s):  
Kamesh V. Gadepally ◽  
K. B. Tennal ◽  
R. M. Hawk ◽  
W. D. Brown

ABSTRACTAn electrostatic deposition process which utilizes charged particle motion in an electric field has been successfully developed as a method for depositing coatings of silicon films. Coatings have been deposited on conducting, Insulating, and semiconducting surfaces after making suitable changes in deposition parameters. This process along with parameters Important to the deposition process which Include particle charge and size characteristics are discussed. These coatings are subsequently heat treated. Experimental results for depositions on silicon substrates are presented. Characterization in terms of chemical, electrical and physical properties of the film are presented.


Author(s):  
Seunggon Choi ◽  
Ji-Ho Lim ◽  
Eun-Young Kang ◽  
Hyungsun Kim ◽  
Young-Min Kong ◽  
...  

2017 ◽  
Vol 10 (04) ◽  
pp. 1750045 ◽  
Author(s):  
Michael Schubert ◽  
Manuel Hahn ◽  
Jörg Exner ◽  
Jaroslaw Kita ◽  
Ralf Moos

The aerosol deposition (AD) method is a novel ceramic coating technique that allows manufacturing of dense ceramic films at room temperature directly from ceramic powders without any high temperature sintering steps and without expensive (ultra) high vacuum processes. The deposition mechanism can be separated into two stages: the creation of an anchor layering and the subsequent film formation. Step one involves an initial plastic deformation of the substrate surface by the first impacting particles. Especially in the first stage, substrate properties affect the deposition and determine the dominant bonding mechanism. Ductile substrates can be expected to give strong film anchoring, whereas high hardness substrates might require higher particle velocities to form adhering layers. In this study, the influence of the substrate hardness in combination with the surface roughness on the deposition was investigated. Four ceramic substrates (two types of Al2O3, sapphire, and LTCC) with different hardness and surface roughness were coated with Al2O3 in order to study the formation of an anchoring layer and their effect on the deposition rate. As a result, no anchoring layer was found on the hard ceramic substrates.


Author(s):  
Ernest L. Hall ◽  
J. B. Vander Sande

The present paper describes research on the mechanical properties and related dislocation structure of CdTe, a II-VI semiconductor compound with a wide range of uses in electrical and optical devices. At room temperature CdTe exhibits little plasticity and at the same time relatively low strength and hardness. The mechanical behavior of CdTe was examined at elevated temperatures with the goal of understanding plastic flow in this material and eventually improving the room temperature properties. Several samples of single crystal CdTe of identical size and crystallographic orientation were deformed in compression at 300°C to various levels of total strain. A resolved shear stress vs. compressive glide strain curve (Figure la) was derived from the results of the tests and the knowledge of the sample orientation.


Sign in / Sign up

Export Citation Format

Share Document