ZnO by Atomic Layer Deposition for Vertically Stacked Non-Volatile Memory Devices

2007 ◽  
Vol 46 (4B) ◽  
pp. 2523-2526 ◽  
Author(s):  
Cha-Hsin Lin ◽  
Ching-Chiun Wang ◽  
Pei-Jer Tzeng ◽  
Siddheswar Maikap ◽  
Heng-Yuan Lee ◽  
...  

2021 ◽  
pp. 1-1
Author(s):  
Jun-Dao Luo ◽  
Yu-Ying Lai ◽  
Kuo-Yu Hsiang ◽  
Chia-Feng Wu ◽  
Hao-Tung Chung ◽  
...  

2018 ◽  
Vol 386 ◽  
pp. 172-177
Author(s):  
Oleg M. Orlov

The properties and applications of materials with non-volatile memory based on HfO2 were briefly considered. In addition, an overview of the obtained results was given. On the basis of these results, the possibility of use of the structures TiN/ Hf0.5Zr0.5O2/ TiN/ SiO2/ Si and TiN/ HfxAl1-xOy/ Pt/ SiO2/ Si for the non-volatile memory of FeRAM and ReRAM types obtained by the atomic-layer deposition was shown. In addition, the scalability of these elements and opportunity to create promising submicron integrated circuits for ferroelectric and resistive memory were demonstrated.


2019 ◽  
Vol 34 (1) ◽  
pp. 473-478 ◽  
Author(s):  
Christoph Adelmann ◽  
Johan Swerts ◽  
Thierry Conard ◽  
Bert Brijs ◽  
Alexis Franquet ◽  
...  

RSC Advances ◽  
2017 ◽  
Vol 7 (88) ◽  
pp. 55750-55755 ◽  
Author(s):  
Hwanyeol Park ◽  
Sungwoo Lee ◽  
Ho Jun Kim ◽  
Euijoon Yoon ◽  
Gun-Do Lee

In the fabrication process of memory devices, a void-free tungsten (W) gate process with good conformability is very important for improving the conductivity of the W gate, leading to enhancement of device performance.


2014 ◽  
Vol 2 (17) ◽  
pp. 3204-3211 ◽  
Author(s):  
Raúl Zazpe ◽  
Mariana Ungureanu ◽  
Federico Golmar ◽  
Pablo Stoliar ◽  
Roger Llopis ◽  
...  

2019 ◽  
Vol 2 (11) ◽  
pp. 7449-7458 ◽  
Author(s):  
Wathsala L. I. Waduge ◽  
Yajin Chen ◽  
Peng Zuo ◽  
Navoda Jayakodiarachchi ◽  
Thomas F. Kuech ◽  
...  

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