Effects of Microwave Power on Thermal Annealing Behaviors of Hydrogenated Amorphous Silicon

2019 ◽  
Vol 33 (17) ◽  
pp. 65-69
Author(s):  
Ping-Jung Wu ◽  
I-Chen Chen ◽  
Chien-Chieh Lee ◽  
Jenq-Yang Chang ◽  
Tomi T. Li ◽  
...  

2005 ◽  
Vol 862 ◽  
Author(s):  
N. Wyrsch ◽  
C. Miazza ◽  
S. Dunand ◽  
C. Ballif ◽  
A. Shah ◽  
...  

AbstractRadiation tests of 32 μm thick hydrogenated amorphous silicon n-i-p diodes have been performed using a high energy 24 GeV proton beam up to fluences in excess of 1016 protons/cm2. The results are compared to irradiation of similar 1 μm and 32 μm thick n-i-p diodes using a proton beam of 280 keV at a fluence of 3x1013 protons/cm2. Even though both types of irradiation cause a significant drop in photoconductivity of thin or thick diodes, all samples survived the experiment and recover almost fully after a subsequent thermal annealing.


2010 ◽  
Vol 428-429 ◽  
pp. 444-446 ◽  
Author(s):  
Rui Min Jin ◽  
Ding Zhen Li ◽  
Lan Li Chen ◽  
Xin Feng Guo ◽  
Jing Xiao Lu

Amorphous silicon films prepared by PECVD on silex glass substrate has been crystallized by rapid thermal annealing (RTA), From the Raman spectra and scanning electronic microscope (SEM), it was found that the Raman spectra wa best crystallized at 950°C for 5 min. The thin film made by RTA was smoothly and perfect structure.


1985 ◽  
Vol 47 (3) ◽  
pp. 236-238 ◽  
Author(s):  
L. S. Hung ◽  
E. F. Kennedy ◽  
C. J. Palmstro/m ◽  
J. O. Olowolafe ◽  
J. W. Mayer ◽  
...  

2015 ◽  
Vol 656-657 ◽  
pp. 92-100
Author(s):  
Li Cheng Hu ◽  
Yong Shiang Li ◽  
Chien Chieh Lee ◽  
Jeng Yang Cheng ◽  
I Chen Chen ◽  
...  

The uniformity improvement of high deposition rate in hydrogenated amorphous silicon (a-Si:H) film deposited by electron cyclotron resonance chemical vapor deposition (ECR-CVD) is very essential for a large substrate in PV solar industry. In order to improve the uniformity in depositing thin film in large area, the auxiliary magnetic coils were designed and installed in ECR-CVD to modify the distribution of magnetic field. In addition, the dependence of the other ECR-CVD processing parameters such as resonance position, microwave power, working pressure, and substrate temperature were investigated. The results indicated that more uniform a-Si:H film could be obtained when working pressure was decreased. By using finite element analysis, it was found that location of turbo pump would impact gas flow field and this effect would become more significant at high pressure. Increasing microwave power, increasing horizontal gradient of the magnetic field to the substrate, and forming Cusp magnetic field could enhance ECR-CVD deposition uniformity greatly. However, the plasma location and substrate temperature were not major factors affecting a-Si:H film uniformity in ECR-CVD process. Finally, the optimal and the best 3.8% in uniformity could be achieved in 150mm diameter when the ratio of magnetic field strength at wafer edge to wafer center is 215%, working pressure is 1.5 mtorr, microwave power density is 4W/cm2, and substrate temperature is 180°C.


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