scholarly journals Effect of Heat Source and Imperfect Contact on Simultaneous Estimation of Thermal Properties of High-Conductivity Materials

2019 ◽  
Vol 2019 ◽  
pp. 1-15 ◽  
Author(s):  
Giampaolo D’Alessandro ◽  
Filippo de Monte ◽  
Donald E. Amos
Keyword(s):  
Heat Capacity ◽  
Thermal Properties ◽  
Heated Surface ◽  
Thermal Contact ◽  
High Conductivity ◽  
Simultaneous Estimation ◽  
Transform Method ◽  
Imperfect Contact ◽  
Experimental Apparatus ◽  
Layer Sample

In the current paper a novel methodology accounting for both the heater heat capacity and the imperfect thermal contact between a thin heater and a specimen is proposed. In particular, the volumetric heat capacity of the heater is considered by modelling it as a lumped capacitance body, while the imperfect thermal contact is considered by means of a contact resistance. Thus, the experimental apparatus consisting of three layers (specimen-heater-specimen) is reduced to a single finite layer (sample) subject to a “nonclassical” boundary condition at the heated surface, known as sixth kind. Once the temperature solution is derived analytically using the Laplace transform method, the scaled sensitivity coefficients are computed analytically at the interface between the heater and the sample (heater side and sample side) and at the sample backside. By applying the proposed methodology to a lab-controlled experiment available in the specialized literature, a reduction of the thermal properties values of about 1.4% is observed for a high-conductivity material (Armco iron).

scholarly journals Scanning Thermal Microscopy of Ultrathin Films: Numerical Studies Regarding Cantilever Displacement, Thermal Contact Areas, Heat Fluxes, and Heat Distribution

Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 491
Author(s):  
Christoph Metzke ◽  
Fabian Kühnel ◽  
Jonas Weber ◽  
Günther Benstetter
Keyword(s):  
Thermal Properties ◽  
Ultrathin Films ◽  
Hexagonal Boron Nitride ◽  
Thermal Contact ◽  
Heat Transfer Process ◽  
Heat Propagation ◽  
Heat Fluxes ◽  
Detailed Knowledge ◽  
Scanning Thermal Microscopy ◽  
Thermal Microscopy

New micro- and nanoscale devices require electrically isolating materials with specific thermal properties. One option to characterize these thermal properties is the atomic force microscopy (AFM)-based scanning thermal microscopy (SThM) technique. It enables qualitative mapping of local thermal conductivities of ultrathin films. To fully understand and correctly interpret the results of practical SThM measurements, it is essential to have detailed knowledge about the heat transfer process between the probe and the sample. However, little can be found in the literature so far. Therefore, this work focuses on theoretical SThM studies of ultrathin films with anisotropic thermal properties such as hexagonal boron nitride (h-BN) and compares the results with a bulk silicon (Si) sample. Energy fluxes from the probe to the sample between 0.6 µW and 126.8 µW are found for different cases with a tip radius of approximately 300 nm. A present thermal interface resistance (TIR) between bulk Si and ultrathin h-BN on top can fully suppress a further heat penetration. The time until heat propagation within the sample is stationary is found to be below 1 µs, which may justify higher tip velocities in practical SThM investigations of up to 20 µms−1. It is also demonstrated that there is almost no influence of convection and radiation, whereas a possible TIR between probe and sample must be considered.

scholarly journals Testing a Gypsum Composite Based on Raw Gypsum with a Direct Admixture of Paraffin and Polymer to Improve Thermal Properties

Materials ◽  
2021 ◽  
Vol 14 (12) ◽  
pp. 3241
Author(s):  
Krzysztof Powała ◽  
Andrzej Obraniak ◽  
Dariusz Heim
Keyword(s):  
Thermal Conductivity ◽  
Heat Capacity ◽  
Thermal Properties ◽  
Phase Change ◽  
Large Scale ◽  
Building Materials ◽  
Residential Buildings ◽  
Energy Performance ◽  
Polymer Content ◽  
Volumetric Heat Capacity

The implemented new legal regulations regarding thermal comfort, the energy performance of residential buildings, and proecological requirements require the design of new building materials, the use of which will improve the thermal efficiency of newly built and renovated buildings. Therefore, many companies producing building materials strive to improve the properties of their products by reducing the weight of the materials, increasing their mechanical properties, and improving their insulating properties. Currently, there are solutions in phase-change materials (PCM) production technology, such as microencapsulation, but its application on a large scale is extremely costly. This paper presents a solution to the abovementioned problem through the creation and testing of a composite, i.e., a new mixture of gypsum, paraffin, and polymer, which can be used in the production of plasterboard. The presented solution uses a material (PCM) which improves the thermal properties of the composite by taking advantage of the phase-change phenomenon. The study analyzes the influence of polymer content in the total mass of a composite in relation to its thermal conductivity, volumetric heat capacity, and diffusivity. Based on the results contained in this article, the best solution appears to be a mixture with 0.1% polymer content. It is definitely visible in the tests which use drying, hardening time, and paraffin absorption. It differs slightly from the best result in the thermal conductivity test, while it is comparable in terms of volumetric heat capacity and differs slightly from the best result in the thermal diffusivity test.

scholarly journals Enhanced electrical and thermal properties of semi-conductive PANI-CNCs with surface modified CNCs

RSC Advances ◽  
2021 ◽  
Vol 11 (19) ◽  
pp. 11444-11456
Author(s):  
Po-Yun Chen ◽  
Chieh Hsu ◽  
Manikandan Venkatesan ◽  
Yen-Lin Tseng ◽  
Chia-Jung Cho ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Thermal Properties ◽  
High Conductivity ◽  
Surface Modified ◽  
High Dispersibility

Biodegradable surface-modified CNCs were synthesized found high dispersibility and flexibility. Polyaniline-doped CNCs nanocomposites were exhibited high conductivity and thermal stability that may be promising for flexible semiconductors.

Study of elastic moduli and thermal properties of RMnO3 (R = La, Nd) compounds

2014 ◽  
Vol 03 (02) ◽  
pp. 1450011 ◽  
Author(s):  
Dinesh Varshney ◽  
Dinesh Choudhary
Keyword(s):  
Heat Capacity ◽  
Thermal Properties ◽  
Elastic Moduli ◽  
Systematic Investigation ◽  
Elastic Behavior ◽  
Repulsive Interaction ◽  
Interionic Interaction ◽  
Einstein Temperature ◽  
Capacity Calculation ◽  
Increasing Temperature

In this paper, we develop a theoretical model for quantitative analysis of temperature-dependent heat capacity calculation of the magnetoresistance compounds RMnO 3 ( R = La , Nd ). The results on heat capacity obtained by us are in good agreement with the measured values. An effective interionic interaction potential (EIoIP) with the long-range Coulomb, van der Waals (vdW) interaction and short-range repulsive interaction up to second neighbor ions within the Hafemeister and Flygare approach was formulated to estimate the Debye and Einstein temperature and was found to be consistent with the available experimental data. In addition, the properties studied are the cohesive energy, molecular force constant, Restrahlen frequency and Gruneisen parameter. After characterizing thermal properties, a systematic investigation of elastic behavior has been undertaken and it has been found that the elastic moduli are decreasing continuously with increasing temperature.

Onset of Natural Convection from a Suddenly Heated Horizontal Cylinder

1980 ◽  
Vol 102 (4) ◽  
pp. 636-639 ◽  
Author(s):  
J. R. Parsons ◽  
J. C. Mulligan
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Thermal Stability ◽  
Heat Capacity ◽  
Natural Convection ◽  
Stability Analysis ◽  
Horizontal Cylinder ◽  
Finite Cylinder ◽  
Global Motion ◽  
Experimental Apparatus

A study of the onset of transient natural convection from a suddenly heated, horizontal cylinder of finite diameter is presented. The termination of the initial conductive and “locally” conuectiue heat transfer regime which precedes the onset of global natural convection is treated as a thermal stability phenomenon. An analysis is presented wherein the effects of finite cylinder diameter, cylinder heat capacity, and cylinder thermal conductivity are included in calculations of the convective delay time. A simple experimental apparatus is described and data presented. The thermal stability analysis is confirmed experimentally and data is presented which indicates localized natural convection prior to global motion.

Determination of the Thermal Properties of a PCB by Coupled Numerical and Experimental Approach

2020 ◽  
Author(s):  
Yener Usul ◽  
Mustafa Özçatalbaş
Keyword(s):  
Thermal Conductivity ◽  
Heat Capacity ◽  
Thermal Properties ◽  
Numerical Analysis ◽  
Specific Heat ◽  
Specific Heat Capacity ◽  
Thermal Analyses ◽  
Analysis Model ◽  
Linear Temperature ◽  
Coefficient Of Thermal Conductivity

Abstract Increasing demand for usage of electronics intensely in narrow enclosures necessitates accurate thermal analyses to be performed. Conduction based FEM (Finite Element Method) is a common and practical way to examine the thermal behavior of an electronic system. First step to perform a numerical analysis for any system is to set up the correct analysis model. In this paper, a method for obtaining the coefficient of thermal conductivity and specific heat capacity of a PCB which has generally a complex composite layup structure composed of conductive layers, and dielectric layers. In the study, above mentioned properties are obtained performing a simple nondestructive experiment and a numerical analysis. In the method, a small portion of PCB is sandwiched from one side at certain pressure by jaws. A couple of linear temperature profiles are applied to the jaws successively. Unknown values are tuned in the analysis model until the results of FEM analysis and experiment match. The values for the coefficient of thermal conductivity and specific heat capacity which the experiment and numerical analysis results match can be said to be the actual values. From this point on, the PCB whose thermal properties are determined can be analyzed numerically for any desired geometry and boundary condition.

scholarly journals Thermal Properties of Stabilized Zirconia at Low Temperatures

1985 ◽  
Vol 38 (4) ◽  
pp. 617 ◽  
Author(s):  
JG Collins ◽  
SJ Collocott ◽  
GK White
Keyword(s):  
Heat Capacity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Low Temperatures ◽  
Linear Thermal Expansion Coefficient ◽  
Linear Thermal Expansion ◽  
Stabilized Zirconia ◽  
Elastic Data

The linear thermal expansion coefficient a from 2 to 100 K and heat capacity per gram cp from 0�3 to 30 K are reported for fully-stabilized zirconia containing a nominal 16 wt.% (9 mol.%) of yttria. The heat capacity below 7 K has been analysed into a linear (tunnelling?) term, a Schottky term centred at 1�2 K, a Debye term (e~ = 540 K), and a small T5 contribution. The expansion coefficient is roughly proportional to T from 5 to 20 K and gives a limiting lattice Griineisen parameter 'Yo ::::: 5, which agrees with that calculated from elastic data.

scholarly journals Mechanisms behind the enhancement of thermal properties of graphene nanofluids

Nanoscale ◽  
2018 ◽  
Vol 10 (32) ◽  
pp. 15402-15409 ◽  
Author(s):  
M. R. Rodríguez-Laguna ◽  
A. Castro-Alvarez ◽  
M. Sledzinska ◽  
J. Maire ◽  
F. Costanzo ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Heat Capacity ◽  
Thermal Properties ◽  
Specific Heat ◽  
Specific Heat Capacity

While the dispersion of nanomaterials is known to be effective in enhancing the thermal conductivity and specific heat capacity of fluids, the mechanisms behind this enhancement remain to be elucidated.

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