Investigation of tool geometry in nanoscale cutting single-crystal copper by molecular dynamics simulation

2019 ◽  
Vol 233 (8) ◽  
pp. 1208-1220 ◽  
Author(s):  
Houfu Dai ◽  
Hao Du ◽  
Jianbin Chen ◽  
Genyu Chen
Keyword(s):  
Molecular Dynamics ◽  
Single Crystal ◽  
Cutting Force ◽  
Rake Angle ◽  
Tool Geometry ◽  
Single Crystal Copper ◽  
Clearance Angle ◽  
Edge Radius ◽  
Lower Temperature ◽  
Nanoscale Cutting

Molecular dynamics has been employed in this paper to investigate the nanoscale cutting process of single-crystal copper with a diamond tool. The behavior of the workpiece during material removal by diamond cutting has been studied. The effects of tool geometry including rake angle, clearance angle, and edge radius are thoroughly investigated in terms of chips, dislocation movement, temperature distribution, cutting temperature, cutting force, and friction coefficient. The investigation showed that an appropriate positive rake angle ([Formula: see text]), a suitable clearance angle ([Formula: see text]), or a smaller edge radius tip resulted in a smaller cutting force and a better subsurface finish. It was found that a tool with a rake angle of [Formula: see text] generated more chips, had a higher cutting efficiency, and produced a lower temperature in the workpiece, but a smaller rake angle tip was more conducive to protecting the groove compared to a large rake angle tip. Compared with a tool with a small clearance angle, the tool with a larger clearance angle generated more chips and caused a lower temperature rise in the copper workpiece, and prolonged its lifetime. In addition, a larger clearance angle tip was more conducive to protecting the groove. A smaller edge radius tip reduces the cutting heat during the nanoscale cutting process, while the volume of chips decreases. These results indicated that it is possible to control and adjust the tool parameters according to the tool rake angle, clearance angle, and edge radius during the machining of single-crystal copper, and a set of tool parameters were obtained: [Formula: see text] rake angle, [Formula: see text] clearance angle, and 0 nm edge radius which could reduce surface damage and the required cutting force.

Influence of Geometry in Nanometric Cutting Single-Crystal Copper via MD Simulation

2011 ◽  
Vol 421 ◽  
pp. 123-128 ◽  
Author(s):  
Hong Wei Zhao ◽  
Lin Zhang ◽  
Peng Zhang ◽  
Cheng Li Shi
Keyword(s):  
Single Crystal ◽  
Subsurface Layer ◽  
Tangential Force ◽  
Rake Angle ◽  
Cutting Process ◽  
Tool Geometry ◽  
Machined Surface ◽  
Nanometric Cutting ◽  
Single Crystal Copper ◽  
Clearance Angle

A series of three-dimension molecular dynamics (MD) simulations are performed using hybrid potentials to investigate nanometric cutting process of single-crystal copper with diamond tool. The effect of tool geometry in nanometric cutting process is investigated. It is observed that with the negative rake angle, the volume of chips becomes smaller due to large hydrostatic pressure and plastic deformation generated in the subsurface layer. When the rake angle changes from -40° to 40°, the machined surface becomes smoother. Besides, the ratio of tangential force to normal force decreases with the increase of rake angle. In addition, the effect of clearance angle is analyzed and approximate entropy (APEN) is presented to denote the complexity and uncontrollability of the interactions between tool and workpiece with different clearance angles. With the decrease of clearance angle, the machined surface quality decreases with the local stress distribution in subsurface layer is uneven. An appropriate clearance angle not only keeps cutting force stable, but makes sure of the quality of machined surface as well.

Investigation of effect of uncut chip thickness to edge radius ratio on nanoscale cutting behavior of single crystal copper: MD simulation approach

2020 ◽  
pp. 251659842093763
Author(s):  
A. Sharma ◽  
P. Ranjan ◽  
R. Balasubramaniam
Keyword(s):  
Molecular Dynamics ◽  
Single Crystal ◽  
Material Removal ◽  
Chip Thickness ◽  
Cutting Process ◽  
Uncut Chip Thickness ◽  
Edge Radius ◽  
Nanoscale Cutting ◽  
Cutting Behavior ◽  
Subsurface Defects

Extremely small cutting depths in nanoscale cutting makes it very difficult to measure the thermodynamic properties and understand the underlying mechanism and behavior of workpiece material. Highly precise single-crystal Cu is popularly employed in optical and electronics industries. This study, therefore, implements the molecular dynamics technique to analyze the cutting behavior and surface and subsurface phenomenon in the nanoscale cutting of copper workpieces with a diamond tool. Molecular dynamics simulation is carried out for different ratios of uncut chip thickness ( a) to cutting edge radius ( r) to investigate material removal mechanism, cutting forces, surface and subsurface defects, material removal rate (MRR), and stresses involved during the nanoscale cutting process. Calculation of forces and amount of plowing indicate that a/ r = 0.5 is the critical ratio for which the average values of both increase to maximum. Material deformation mechanism changes from shear slip to shear zone deformation and then to plowing and elastic rubbing as the cutting depth/uncut chip thickness is reduced. The deformation during nano-cutting in terms of dislocation density changes with respect to cutting time. During the cutting process, it is observed that various subsurface defects like point defects, dislocations and dislocation loops, stacking faults, and stair-rod dislocation take place.

Deformation Mechanism of Diamond Nanocutting Single-Crystal Copper Using Molecular Dynamics Simulatio

2011 ◽  
Vol 239-242 ◽  
pp. 2775-2778
Author(s):  
Jia Xuan Chen ◽  
Ying Chun Liang ◽  
Xia Yu ◽  
Zhi Guo Wang ◽  
Zhen Tong
Keyword(s):  
Molecular Dynamics ◽  
Single Crystal ◽  
Cutting Force ◽  
Dislocation Loop ◽  
Deformation Mechanism ◽  
Molecular Dynamics Method ◽  
Parameter Method ◽  
Removal Mechanism ◽  
Single Crystal Copper ◽  
Dynamics Method

To study the removal mechanism of materials during nano cutting, molecular dynamics method is adopted to simulate single crystal copper nanomachining processes, and subsurface defects evolvements and chip forming regulation are analyzed by revised centro-symmetry parameter method and the ratios of the tangential cutting forceand the normal cutting force. The results show that there are different defects under different cutting depths. When cutting depths is shallower, there are dislocation loop nucleation in the subsurface of the workpiece beneath the tool; however, when the cutting depths is deeper, there are dislocations nucleation and slipping along {101} plane and (111) plane. In addition, both tangential cutting forceand the normal cutting force decrease as the cutting depths decreasing. When the ratios of the normal cutting force and the tangential cutting force is below 0.9, the chip will be formed.

Optimal Selection of Tool Geometry by Finite Element Simulation

2007 ◽  
Vol 10-12 ◽  
pp. 702-706
Author(s):  
Sheng Wen Zhang ◽  
Chan Yuan Gong ◽  
Xi Feng Fang ◽  
Gui Cheng Wang
Keyword(s):  
Finite Element ◽  
Cutting Force ◽  
Finite Element Simulation ◽  
Cutting Temperature ◽  
Rake Angle ◽  
Cutting Process ◽  
Tool Geometry ◽  
Clearance Angle ◽  
Tool Geometries ◽  
Element Simulation

The effect of cutting tool geometry on cutting process is very prominent and cannot be ignored, especially the interactions between tool geometries. In this study, the effects of the rake angle, the clearance angle, the cutting edge radius and the interaction between rake angle and clearance angle on cutting force and cutting temperature are numerically investigated using finite element method. Four-factor three-lever orthogonal experimental design is adopted in the finite element simulation of orthogonal cutting process. An analysis of range is performed to identify significant trends in the cutting force and cutting temperature and the optimal level values of each factor. The result shows that the effect of the rake angle on cutting force is significant. The effect of interaction between rake angle and clearance angle on cutting temperature also appeared to be important. Finally, the optimal parameter combinations of tool geometries for cutting force and cutting temperature are obtained, respectively.

Research on Nano-Cutting Processes Based on Parallel Molecular Dynamics

2006 ◽  
Vol 532-533 ◽  
pp. 357-360
Author(s):  
Ying Chun Liang ◽  
De Gang Li ◽  
Qing Shun Bai ◽  
Yu Lan Tang
Keyword(s):  
Molecular Dynamics ◽  
Potential Energy ◽  
Single Crystal ◽  
Cutting Forces ◽  
Single Crystal Silicon ◽  
Rake Angle ◽  
Tool Geometry ◽  
Crystal Silicon ◽  
Parallel Molecular Dynamics ◽  
Cutting Processes

To investigate the effect of tool geometry on single-crystal silicon nano-cutting, parallel molecular dynamics (MD) simulations are carried out with different tool rake angles. In this study, a parallel arithmetic based on mechanism of spatial decomposition together with MD is applied to simulate nano-cutting processes of single-crystal silicon (100) plane by using a single-crystal diamond tool. The simulation results show that tool rake angle has great effects on cutting forces and subsurface stress, and the effect of tool rake angle variation on work-piece potential energy is not evident while cutting single-crystal Silicon (100) plane. Moreover, the analysis of cutting forces and potential energy show that there is not evident dislocation in the nano-cutting.

scholarly journals Experimental Investigation and Numerical Prediction of the Effects of Cutting Tool Geometry During Turning of AISI 316L Steel

2021 ◽  
Vol 65 (4) ◽  
pp. 293-301
Author(s):  
Amor Benmeddour
Keyword(s):  
Temperature Distribution ◽  
Residual Stresses ◽  
Cutting Force ◽  
Rake Angle ◽  
Tool Geometry ◽  
Model Parameters ◽  
Fe Model ◽  
Aisi 316L ◽  
Arbitrary Lagrangian Eulerian ◽  
The Impact

In this work, a numerical and an experimental study aimed to gain a better understanding of the impact of tool geometry such as (rake angle and cutting edge radius) on the temperature distribution and residual stresses in machining surface of AISI 316L stainless steel have been presented. To evaluate the experimental results, various experimental equipment was used, such as a conventional lathe to carry out the machining operations, the cutting force was measured using a Kistler dynamometer and X-ray diffraction technique was employed for determination of the residual stresses distribution on the machined surfaces. In addition, A thermo-mechanically coupled finite element (FE) analysis for cutting process is developed through ABAQUS code to predict the temperature distribution and residual stresses using an Arbitrary Lagrangian-Eulerian (ALE) approach. An inverse identification method has been used to determine the adequate Johnson-Cook (JC) material model parameters to obtain a good correlation between the cutting force measurements and numerical one. The FE model was then validated by comparison of the numerical results of residual stresses with experimental measurements for different tool geometries, which revealed a reasonable agreement.

Quasicontinuum Simulation of Uniaxial Tension of Single Crystal Copper Nanowire

2011 ◽  
Vol 694 ◽  
pp. 200-204
Author(s):  
Xing Lei Hu ◽  
Ying Chun Liang ◽  
Jia Xuan Chen ◽  
Hong Min Pen
Keyword(s):  
Mechanical Properties ◽  
Finite Element Method ◽  
Molecular Dynamics ◽  
Finite Element ◽  
Single Crystal ◽  
Size Effects ◽  
Tension Test ◽  
Quasicontinuum Method ◽  
Single Crystal Copper ◽  
Copper Nanowire

Quasicontinuum simulations of tension test of single crystal copper nanowire are performed to analyze deformation mechanism of tension process and size effects of mechanical properties. New tension models of nanowire are constructed by using quasicontinuum method, which has combined molecular dynamics and finite element method. Tension processes of three different length nanowires without notches and those with notches are simulated. Yield strength and elastic modulus are calculated according to the obtained load-displacement curves. Finally, the results show that the mechanical properties of copper nanowire have obvious size effect and the notches have obvious influence on the mechanical properties.

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