Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste

2015 ◽  
Vol 754-755 ◽  
pp. 546-550 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Contact Angle ◽  
Intermetallic Compound ◽  
Composite Solder ◽  
Copper Substrate ◽  
Compound Layer ◽  
Intermetallic Compound Layer ◽  
Solder Paste ◽  
X Ray Diffraction ◽  
Free Solder ◽  
Sic Particle

The effects of SiC on wettability and intermetallic compound (IMC) formation of Sn-Cu-Ni solder paste composite were systematically investigated. Lead-free solder paste composite was produced by mixing silicon carbide (SiC) particle with Sn-Cu-Ni (SN100C) solder paste. The wettability of composite solder was studied by observing the contact angle between solder and copper substrate. The IMC phase formation on copper substrate interface was identified using X-ray diffraction (XRD). The phase as detected in the composite solder is Cu6Sn5.The wettability of composite solder was observed through contact angle between solder and copper substrate and Sn-Cu-Ni + 1.0 wt.% SiC shows improvements in wetting angle and suppresses the IMCs formation.

Wetting and the reaction of multiwalled carbon nanotube-reinforced composite solder with a copper substrate

2013 ◽  
Vol 20 (4) ◽  
pp. 301-306 ◽  
Author(s):  
Her-Yueh Huang ◽  
Chung-Wei Yang ◽  
Sian-Ze Pan
Keyword(s):  
Carbon Nanotube ◽  
Composite Solder ◽  
Copper Substrate ◽  
Compound Layer ◽  
Multiwalled Carbon Nanotube ◽  
Lead Free ◽  
Intermetallic Compound Layer ◽  
Lead Free Solder ◽  
Multiwalled Carbon ◽  
Free Solder

AbstractIn this work, contact angle, spreading area, and isothermal aging tests were conducted to study the difference between Sn-3Ag-0.5Cu lead-free solder and its composite solder at different multiwalled carbon nanotube reinforcement volume fractions. The material interaction between the solder and the substrate at different aging temperatures and times was investigated using scanning electron microscopy elemental analysis. The experimental results indicated that the composite solder had a lower contact angle as well as good spreading area. An intermetallic compound layer was found between the solder and the copper substrate, and the thickness of this reaction layer increased with increasing aging temperature and time. Meanwhile, the intermetallic compound layer of multiwalled carbon nanotube reinforcement composite solder was thicker than that of the Sn-3Ag-0.5Cu lead-free solder. The composite solder with 0.1 vol% multiwalled carbon nanotube reinforcement addition exhibited better comprehensive properties than composite solders with other reinforcement volume fractions.

The Influence of Activated Carbon (AC) on Melting Temperature, Wettability and Intermetallic Compound Formation of Sn-Cu-Ni (SN100C) Solder Paste

2015 ◽  
Vol 754-755 ◽  
pp. 551-555 ◽  
Author(s):  
Rita Mohd Said ◽  
Norainiza Saud ◽  
Mohd Arif Anuar Mohd Salleh ◽  
Mohd Nazree Derman ◽  
Mohd Izrul Izwan Ramli ◽  
...  
Keyword(s):  
Activated Carbon ◽  
Intermetallic Compound ◽  
Melting Temperature ◽  
Composite Solder ◽  
Copper Substrate ◽  
Contact Angles ◽  
Solder Paste ◽  
Compound Formation ◽  
Carbon Particles ◽  
Intermetallic Compound Formation

This paper reports on the effect of activated carbon (AC) addition on the properties of Sn-Cu-Ni (SN100C) solder paste. The composite solder was prepared by mixing reinforcement particles (0, 0.25, 0.5, 0.75 and 1.0 wt. %) into SN100C solder paste. The melting temperature of composite solder was determined by using differential scanning calorimetry (DSC). Wettability of fabricated solder was studied through contact angles between solder and copper substrate interface. The intermetallic compound formation was studied after reflow soldering process.With increased carbon particles addition, the composite solder was found to have a slightly lower melting temperature compared to monolithic solder while the wettability of composite solder effectively had improved. The activated carbon particles in solder paste composite have significant effects on the formation of intermetallic compounds (IMCs) at the solder/Cu substrate interfaces by suppressing the IMCs thickness.

Surface Roughness and Wettability of SAC/CNT Lead Free Solder

2016 ◽  
Vol 857 ◽  
pp. 73-75 ◽  
Author(s):  
Norliza Ismail ◽  
Roslina Ismail ◽  
Nik Khairul Amilin Nik Ubaidillah ◽  
Azman Jalar ◽  
Norazwani Muhammad Zain
Keyword(s):  
Surface Roughness ◽  
Contact Angle ◽  
Substrate Surface ◽  
Copper Substrate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Cu Substrate ◽  
Substrate Surface Roughness ◽  
Free Solder

The effect of substrate surface roughness on the wettability of SAC237 (Sn 99.9%, Ag 0.3%, Cu 0.7%) with difference percentage of CNT on copper substrate was investigated. Solder paste of SAC 237 without CNT, 0.01% and 0.04% of CNT were reflowed at 270°C on different surface roughness of Cu substrate (abrasive number 240, 400, 600, 800). Contact angle of soldered samples measured by Infinite Focus Microscope (IFM). As a result, contact angle value of investigated solders range 7° to 20°. Contact angle obtained decreases with the increasing surface roughness of Cu substrate. This demonstrates that rougher substrate enhance the wettability of the solders. Addition of CNT also effects the wettability of investigated solders. Higher composition of CNT show better wettability.

Dissimilar Metal Welding of Steel to Al-Mg Alloy by Spot Resistance Welding

2006 ◽  
Vol 15-17 ◽  
pp. 381-386 ◽  
Author(s):  
I.H. Hwang ◽  
Takehiko Watanabe ◽  
Y. Doi
Keyword(s):  
Intermetallic Compound ◽  
Base Metal ◽  
Joint Strength ◽  
Pure Aluminum ◽  
Compound Layer ◽  
Interfacial Microstructure ◽  
Mg Alloy ◽  
Intermetallic Compound Layer ◽  
Commercially Pure ◽  
Insert Metal

We tried to join steel to Al-Mg alloy using a resistance spot welding method. The effect of Mg in Al-Mg alloy on the strength and the interfacial microstructure of the joint was investigated. Additionally, the effect of insert metal of commercially pure aluminum, which was put into the bonding interface, on the joint strength was examined. The obtained results were as follows. The cross-tensile strength of a joint between SS400 steel and commercially pure aluminum (SS400/Al) was high and fracture occurred in the aluminum base metal. However, the strength of a joint between SS400 and Al-Mg alloy was remarkably low and less than 30% of that of the SS400/Al joint. An intermetallic compound layer developed so thickly at the bonded interface of the SS400/Al-Mg alloy joint that the joint strength decreased. The intermetallic compound layer developed more thickly as Mg content in the Al-Mg alloy increased. Using insert metal of commercially pure aluminum containing little Mg successfully improved the strength of the SS400/Al-Mg alloy joint and the strength was equivalent to that of the base metal.

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