H-9 EFFECT OF SURFACE FINISH ON INTERMETALLIC COMPOUNDS GROWTH AT INTERFACE OF Sn-3.0%Ag-0.5% Cu SOLDER ON Cu/NiAu AND Cu SUBSTRATE(Session: Welding / Joining)

2006 ◽  
Vol 2006 (0) ◽  
pp. 145
Author(s):  
N. Tantivanitchanon ◽  
S. Sirimethanon ◽  
O. Diewwanit
Keyword(s):  
Intermetallic Compounds ◽  
Surface Finish ◽  
Cu Substrate ◽  
Effect Of Surface

scholarly journals First-principles investigation of the structural stability and electronic properties of Pd doped monoclinic Cu6Sn5 intermetallic compounds

2014 ◽  
Vol 32 (4) ◽  
pp. 592-596 ◽  
Author(s):  
Wei-Quan Shao ◽  
Wen-Cai Lu ◽  
Sha-Ou Chen
Keyword(s):  
Electronic Properties ◽  
Intermetallic Compounds ◽  
Structural Properties ◽  
Structural Stability ◽  
Surface Finish ◽  
Phase Stability ◽  
First Principles ◽  
Heat Of Formation ◽  
Dominant Factor ◽  
Cu Substrate

AbstractTri-layer Au/Pd/Ni(P) films have been widely used as surface finish over the Cu pads in high-end packaging applications. It was found that a thin (Cu,Pd)6Sn5 IMC layer was beneficial in effective reducing inter-diffusion between a Cu substrate and a solder, and therefore the growth of the IMC layer and the EM (electromigration) processes. In this study, the structural properties and phase stability of monoclinic Cu6Sn5-based structures with Pd substitutions were studied by using the first-principles method. The (Cu,Pd)6Sn5 structure with the 4e site substituted by Pd has the lowest heat of formation and is the most stable among (Cu,Pd)6Sn5 structures. Hybridization of Pd-d and Sn-p states is a dominant factor for stability improvement. Moreover, Pd atoms concentration corresponding to the most stable structure of (Cu,Pd)6Sn5 was found to be 1.69 %, which is consistent with the experimental results.

Effect of Surface Potential Distribution on Corrosion Behavior of SnAgCu Solder/Cu Substrate Interface

2018 ◽  
Vol 273 ◽  
pp. 77-82 ◽  
Author(s):  
Omid Mokhtari ◽  
Hiroshi Nishikawa
Keyword(s):  
Mechanical Properties ◽  
Corrosion Resistance ◽  
Intermetallic Compounds ◽  
Corrosion Behavior ◽  
Surface Potential ◽  
Potential Distribution ◽  
Cu Substrate ◽  
Snagcu Solder ◽  
Sac Solder ◽  
Effect Of Surface

While various mechanical properties of SnAgCu (SAC) solder has been reported in the literature the corrosion resistance of solder materials has not been widely reported. This study shows regions adjacent to the Cu6Sn5 intermetallic compounds (IMCs) as the corroded region. To investigate the possible formation of a galvanic cell at the interface of SAC solder and the Cu substrate the surface potential distribution at this interface has been evaluated. Results exhibited a comparatively large surface potential difference between SAC solder and the Cu6Sn5 IMC indicating SAC solder and Cu6Sn5 IMC as the anode and cathode in this system, respectively.

Intermetallic compounds formed in Sn droplet on Cu substrate under the impact of electric currents

2021 ◽  
Author(s):  
Yueying Su ◽  
Rui Zhu ◽  
Tianqing Zheng ◽  
Yanping Shen ◽  
Yanyi Xu ◽  
...  
Keyword(s):  
Intermetallic Compounds ◽  
Electric Currents ◽  
Cu Substrate ◽  
The Impact

The effect of surface finish on the pressure-induced ductility of beryllium

1973 ◽  
Vol 8 (12) ◽  
pp. 1788-1794 ◽  
Author(s):  
E. Chandler ◽  
Miss H. M. Lindsay ◽  
H. Li. D. Pugh ◽  
J. S. White
Keyword(s):  
Surface Finish ◽  
Effect Of Surface

Intermetallic compounds growth between Sn–3.5Ag lead-free solder and Cu substrate by dipping method

2005 ◽  
Vol 392 (1-2) ◽  
pp. 192-199 ◽  
Author(s):  
D.Q. Yu ◽  
C.M.L. Wu ◽  
C.M.T. Law ◽  
L. Wang ◽  
J.K.L. Lai
Keyword(s):  
Intermetallic Compounds ◽  
Lead Free ◽  
Lead Free Solder ◽  
Cu Substrate ◽  
Free Solder

Effects of In and Sb addition on the thermal and wetting behavior of Sn-3.5Ag solder

2018 ◽  
Vol 30 (4) ◽  
pp. 233-240 ◽  
Author(s):  
Md Hasnine
Keyword(s):  
Differential Scanning Calorimetry ◽  
Melting Point ◽  
Thermal Behavior ◽  
Surface Finish ◽  
Design Methodology ◽  
Solder Alloys ◽  
Scanning Calorimetry ◽  
Content Type ◽  
Cu Substrate ◽  
Free Solder

Purpose This paper aims to investigate the effect of In and Sb additions on the thermal behavior and wettability of Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) solder alloys. Design/methodology/approach The thermal behavior of the Pb-free solder alloys was studied using differential scanning calorimetry. Wetting balance experiments were performed in accordance with the IPC standard, IPC-TM-650 and at a temperature of 260°C. Also, a solder spread test was performed on a Cu surface finish using the JIS-Z-3197 solderability standard. Findings It is shown that among the selected Sn-3.5Ag-xIn-ySb (x = 0, 1.0 and 1.5 Wt.%, y = 0, 1.0, 1.4 and 2.1 Wt.%) alloys, Sn-3.5Ag-1.5In-1Sb showed the lowest melting point and the lowest undercooling temperature. The best wettability was achieved when the In and Sb contents were approximately 1.5 and 1.0 Wt.%, respectively. The effect of the combined addition of In and Sb on solder spreadability on a Cu substrate was also demonstrated. Originality/value It was found that adding approximately 1.5 and 1.0 Wt.% of In and Sb, respectively, in Sn-3.5Ag solder provided the best wetting performance and improved the solder spreadability.

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