Effect of surface finish metallurgy on intermetallic compounds during soldering with tin-silver-copper solders

Author(s):  
A. Ourdjini ◽  
M.A. Azmah Hanim ◽  
I. Siti Rabiatull Aisha ◽  
Y.T. Chin
1973 ◽  
Vol 8 (12) ◽  
pp. 1788-1794 ◽  
Author(s):  
E. Chandler ◽  
Miss H. M. Lindsay ◽  
H. Li. D. Pugh ◽  
J. S. White

2012 ◽  
Vol 472-475 ◽  
pp. 2756-2759
Author(s):  
Wen Cui ◽  
Shao Jun Qi

To understand the relationship between surface finish and zinc whisker growth, this study investigated the growth of whiskers on two mild steel substrates of different surface finish by Field Emission Gun Scanning Electron Microscope (FEG SEM). Results show that, under the same experimental conditions, deposits on substrates with a mirror finish grew less whiskers and nodules than substrates with a rough surface finish.


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