909 An Analysis of Step Barings Introduced Differentiable Continuous Film Thickness Function with Infinite Small Roundness

2008 ◽  
Vol 2008.46 (0) ◽  
pp. 341-342
Author(s):  
Hirotsugu HAYASHI ◽  
Masahiro HAYASHI
Keyword(s):  
Film Thickness ◽  
Continuous Film ◽  
Thickness Function

Continuous-Film Thickness Determination by AES of Cr Overlayers on Cu Surfaces

1989 ◽  
Vol 153 ◽  
Author(s):  
H. Lefakis ◽  
P.S. Ho
Keyword(s):  
Film Thickness ◽  
Rough Surface ◽  
Film Growth ◽  
Substrate Surface ◽  
Continuous Film ◽  
Substrate Heating ◽  
Native Oxides ◽  
Surface Oxides ◽  
Coverage Rates ◽  
Cr Film

AbstractThe characteristics of Cr coverage of Cu surfaces, including determination of tc, the minimum average film thickness required for formation of a continuous film, have been studied in-situ by Auger Electron Spectroscopy (AES). Auger signal intensities of substrate and deposit were monitored during Cr film growth by vapor deposition in UHV. It was shown that substrate surface morphology (roughness) has a dominant effect on coverage rate and tc. Slower coverage rates and larger tc′s were effected by the presence of native oxides, substrate heating (to 330°C) and H2O-vapor rich (5×10−5 Torr) ambient during Cr deposition. Surface oxides seemed to affect more the coverage of a smooth than a rough surface. Conversely, substrate heating affected more the coverage of a rough surface. The combined effect of substrate heating and water vapor rich atmosphere was pronounced for both smooth and rough surface coverages. Some of the main factors controlling these effects are discussed.

scholarly journals Coating flow on a rotating cylinder in the presence of an irrotational airflow with circulation

2021 ◽  
Vol 932 ◽  
Author(s):  
Andrew J. Mitchell ◽  
Brian R. Duffy ◽  
Stephen K. Wilson
Keyword(s):  
Film Thickness ◽  
Rotating Cylinder ◽  
Stationary Points ◽  
Uniform Pressure ◽  
Maximum Mass ◽  
Continuous Film ◽  
Coating Flow ◽  
Dimensional Parameters ◽  
Horizontal Circular Cylinder ◽  
Qualitative Changes

A detailed analysis of steady coating flow of a thin film of a viscous fluid on the outside of a uniformly rotating horizontal circular cylinder in the absence of surface-tension effects but in the presence of a non-uniform pressure distribution due to an irrotational airflow with circulation shows that the presence of the airflow can result in qualitatively different behaviour of the fluid film from that in classical coating flow. Full-film solutions corresponding to a continuous film of fluid covering the entire cylinder are possible only when the flux and mass of fluid do not exceed critical values, which are determined in terms of the non-dimensional parameters $F$ and $K$ representing the speed of the far-field airflow and the circulation of the airflow, respectively. The qualitative changes in the behaviour of the film thickness as $F$ and $K$ are varied are described. In particular, the film thickness can have as many as four stationary points and, in general, has neither top-to-bottom nor right-to-left symmetry. In addition, when the circulation of the airflow is in the same direction as the rotation of the cylinder the maximum mass of fluid that can be supported on the cylinder is always less than that in classical coating flow, whereas when the circulation is in the opposite direction the maximum mass of fluid can be greater than that in classical coating flow.

Electrical and Structural Properties of Thin Palladium Films

1986 ◽  
Vol 41 (4) ◽  
pp. 665-670 ◽  
Author(s):  
R. Anton ◽  
K. Häupl ◽  
P. Rudolf ◽  
P. Wißmann
Keyword(s):  
Electrical Resistivity ◽  
Film Thickness ◽  
Statistical Model ◽  
Structural Information ◽  
Film Structure ◽  
X Ray Diffraction ◽  
Continuous Film ◽  
X Ray ◽  
Amorphous Substrates ◽  
Steep Decrease

The electrical resistivity of thin palladium films deposited on amorphous substrates is measured in dependence on film thickness. The data are interpreted with the help of a statistical model taking into account structural information obtained from AES, TEM and x-ray diffraction texture analysis. The steep decrease of resistivity in the ultra-thin thickness region can be immediately correlated with the formation of coherent areas in the films. A more flattened course is reached at about 8 nm thickness where a continuous film structure develops.

scholarly journals Оптические коэффициенты пленок меди нанометровой толщины в диапазоне 9--11 GHz

2019 ◽  
Vol 127 (11) ◽  
pp. 834
Author(s):  
В.А. Вдовин ◽  
В.Г. Андреев ◽  
П.С. Глазунов ◽  
И.А. Хорин ◽  
Ю.В. Пинаев
Keyword(s):  
Reflection Coefficient ◽  
Film Thickness ◽  
Microwave Radiation ◽  
Quartz Substrate ◽  
Copper Films ◽  
Conductive Layer ◽  
Absorption Coefficients ◽  
Continuous Film ◽  
Transmission And Absorption

The reflection, transmission, and absorption coefficients of ultrathin copper films on a quartz substrate in a waveguide at frequencies of 9–11 GHz were measured. Films less than 5 nm thick are almost completely oxidized and transparent to microwave radiation. A conductive layer is formed when the film thickness exceeds 5 nm, however, the reflection coefficient increases with a thickness in the range of 5-15 nm more slowly than it follows from calculations utilized the model conductivity of a continuous film. The results can be explained by the morphology of the films.

Surface Films on Zircaloy-2 Samples Cracked in Neutral Aqueous NaCl by Stress Corrosion

1973 ◽  
Vol 31 ◽  
pp. 46-47
Author(s):  
R.A. Ploc
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Film Thickness ◽  
Stress Corrosion ◽  
Zirconium Dioxide ◽  
Surface Film ◽  
Surface Films ◽  
Continuous Layer ◽  
Transmission Electron ◽  
Product Film

Samples of low-nickel Zircaloy-2 (material MLI-788-see(1)), when anodically polarized in neutral 5 wt% NaCl solutions, were found to be susceptible to pitting and stress corrosion cracking. The SEM revealed that pitting of stressed samples was occurring below a 2000Å thick surface film which behaved differently from normal zirconium dioxide in that it did not display interference colours. Since the initial film thickness was approximately 65Å, attempts were made to examine the product film by transmission electron microscopy to deduce composition and how the corrosion environment could penetrate the continuous layer.

(111) Monocrystalline Nickel Films

1972 ◽  
Vol 30 ◽  
pp. 512-513
Author(s):  
T.E. Pratt ◽  
R.W. Vook
Keyword(s):  
Film Thickness ◽  
Deposition Rate ◽  
Room Temperature ◽  
Narrow Range ◽  
High Vacuum ◽  
Residual Pressure ◽  
Temperature Dependent ◽  
Deposition Parameters ◽  
Transmission Electron ◽  
Substrate Temperatures

(111) oriented thin monocrystalline Ni films have been prepared by vacuum evaporation and examined by transmission electron microscopy and electron diffraction. In high vacuum, at room temperature, a layer of NaCl was first evaporated onto a freshly air-cleaved muscovite substrate clamped to a copper block with attached heater and thermocouple. Then, at various substrate temperatures, with other parameters held within a narrow range, Ni was evaporated from a tungsten filament. It had been shown previously that similar procedures would yield monocrystalline films of CU, Ag, and Au.For the films examined with respect to temperature dependent effects, typical deposition parameters were: Ni film thickness, 500-800 A; Ni deposition rate, 10 A/sec.; residual pressure, 10-6 torr; NaCl film thickness, 250 A; and NaCl deposition rate, 10 A/sec. Some additional evaporations involved higher deposition rates and lower film thicknesses.Monocrystalline films were obtained with substrate temperatures above 500° C. Below 450° C, the films were polycrystalline with a strong (111) preferred orientation.

The method of replication affects metal film granularity and resolution

1989 ◽  
Vol 47 ◽  
pp. 708-709
Author(s):  
George C. Ruben
Keyword(s):  
Electron Beam ◽  
High Resolution ◽  
Film Thickness ◽  
Single Molecule ◽  
Metal Film ◽  
Vertical Surface ◽  
High Resolution Imaging ◽  
Controllable Factors ◽  
Resolution Imaging

Single molecule resolution in electron beam sensitive, uncoated, noncrystalline materials has been impossible except in thin Pt-C replicas ≤ 150Å) which are resistant to the electron beam destruction. Previously the granularity of metal film replicas limited their resolution to ≥ 20Å. This paper demonstrates that Pt-C film granularity and resolution are a function of the method of replication and other controllable factors. Low angle 20° rotary , 45° unidirectional and vertical 9.7±1 Å Pt-C films deposited on mica under the same conditions were compared in Fig. 1. Vertical replication had a 5A granularity (Fig. 1c), the highest resolution (table), and coated the whole surface. 45° replication had a 9Å granulartiy (Fig. 1b), a slightly poorer resolution (table) and did not coat the whole surface. 20° rotary replication was unsuitable for high resolution imaging with 20-25Å granularity (Fig. 1a) and resolution 2-3 times poorer (table). Resolution is defined here as the greatest distance for which the metal coat on two opposing faces just grow together, that is, two times the apparent film thickness on a single vertical surface.

FILM THICKNESS DEPENDENCE OF HEAT TRANSMISSION INTO HELIUM

1981 ◽  
Vol 42 (C6) ◽  
pp. C6-825-C6-827
Author(s):  
P. Taborek ◽  
M. Sinvani ◽  
M. Weimer ◽  
D. Goodstein
Keyword(s):  
Film Thickness ◽  
Thickness Dependence ◽  
Heat Transmission

A new method for quantifying the blocking of coated paperboard

TAPPI Journal ◽  
2010 ◽  
Vol 9 (5) ◽  
pp. 29-35 ◽  
Author(s):  
PAULINE SKILLINGTON ◽  
YOLANDE R. SCHOEMAN ◽  
VALESKA CLOETE ◽  
PATRICE C. HARTMANN
Keyword(s):  
Surface Roughness ◽  
Fatty Acid ◽  
Surface Energy ◽  
Film Thickness ◽  
External Factors ◽  
Additive Concentration ◽  
Pressure Surface ◽  
Fatty Acid Amides ◽  
Coated Surfaces ◽  
Definite Period

Blocking is undesired adhesion between two surfaces when subjected to pressure and temperature constraints. Blocking between two coated paperboards in contact with each other may be caused by inter-diffusion, adsorption, or electrostatic forces occurring between the respective coating surfaces. These interactions are influenced by factors such as the temperature, pressure, surface roughness, and surface energy. Blocking potentially can be reduced by adjusting these factors, or by using antiblocking additives such as talc, amorphous silica, fatty acid amides, or polymeric waxes. We developed a method of quantifying blocking using a rheometer. Coated surfaces were put in contact with each other with controlled pressure and temperature for a definite period. We then measured the work necessary to pull the two surfaces apart. This was a reproducible way to accurately quantify blocking. The method was applied to determine the effect external factors have on the blocking tendency of coated paperboards, i.e., antiblocking additive concentration, film thickness, temperature, and humidity.

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