A Study on On-the-Machine Tool Re-Generation Technology : Process development for grinding tools with rapid baking system(Grinding technology)

Author(s):  
Naoki OSIO ◽  
Kiyoshi YANAGIHARA ◽  
Yasuhiro TANI
2010 ◽  
Vol 447-448 ◽  
pp. 9-15 ◽  
Author(s):  
Mustafizur Rahman ◽  
A.B.M.A. Asad ◽  
T. Masaki ◽  
Yoke San Wong ◽  
A. Senthil Kumar

Compound micro-machining is the most promising technology for the production of miniaturized parts and this technology is becoming more and more important and popular because of growing demand for industrial products with not only increased number of functions but also of reduced dimensions, higher dimensional accuracy and better surface finish. In this paper, the development efforts in micro/nano-machining based on solid tools (tool-based micro/nano-machining) in NUS are introduced. In order to achieve meaningful implementation of micro-machining techniques, this research seeks to address four important areas; namely (a) development of machine tool capable to do both conventional micro-machining, (b) process control, (c) process development to achieve necessary accuracy and quality, and (d) on-machine measurement and inspection. An integrated effort in these areas has resulted in successful fabrication of micro-structures that is able to meet the miniaturization demands of the industry. In the area of nano-machining machine tool and process developments have also been carried out for electrolytic in-process dressing (ELID) grinding and ultra precision machining using single point and poly crystalline diamond tools to produce nano surface finish on hard and brittle materials. An ultra-precision diamond turning machine has been developed which incorporates a fast and fine tool servo system to produce nano-precision surfaces and features.


Author(s):  
M. Rahman ◽  
A. B. M. A. Asad ◽  
Takeshi Masaki ◽  
Y. S. Wong ◽  
H. S. Lim

There is a growing demand for industrial products with not only increased number of functions, but also of reduced dimensions, higher dimensional accuracy and better surface finish. Micro/nano-machining is the most promising technology for the production of such miniaturized parts and components. Components for MEMS are basically produced using processes from semiconductor technology which impels the fabrication process to be limited to a few semiconductor materials like silicon and their compounds, or requires expensive facilities. Hybrid micromachining processes that combine conventional and non-conventional micromachining have the capability to fabricate high-aspect ratio microstructures with paramount dimensional accuracy. In order to achieve meaningful implementation of micro/nano machining techniques, our research efforts seek to address three important areas; namely (a) development of machine tool capable of hybrid micromachining, (b) process control and (c) process development to achieve necessary accuracy and quality. An integrated effort in these areas has resulted in successful fabrication of micro structures that is able to meet the miniaturization demands of the industry. This paper presents a few tool-based approaches integrating micro-EDM, micro EDG, micro-turning and micro-grinding to produce miniature components. This paper also describes the features and aspects of miniaturized multi-process machine tool that provides the capability of hybrid micromachining.


Author(s):  
S. Cea ◽  
S. Berrada ◽  
K. Ghosh ◽  
S. Hasan ◽  
P. Keys ◽  
...  

Author(s):  
Ralph Diodone ◽  
Hans J. Mair ◽  
Harpreet Sandhu ◽  
Navnit Shah

Author(s):  
P. B. Basham ◽  
H. L. Tsai

The use of transmission electron microscopy (TEM) to support process development of advanced microelectronic devices is often challenged by a large amount of samples submitted from wafer fabrication areas and specific-spot analysis. Improving the TEM sample preparation techniques for a fast turnaround time is critical in order to provide a timely support for customers and improve the utilization of TEM. For the specific-area sample preparation, a technique which can be easily prepared with the least amount of effort is preferred. For these reasons, we have developed several techniques which have greatly facilitated the TEM sample preparation.For specific-area analysis, the use of a copper grid with a small hole is found to be very useful. With this small-hole grid technique, TEM sample preparation can be proceeded by well-established conventional methods. The sample is first polished to the area of interest, which is then carefully positioned inside the hole. This polished side is placed against the grid by epoxy Fig. 1 is an optical image of a TEM cross-section after dimpling to light transmission.


Author(s):  
C.K. Wu ◽  
P. Chang ◽  
N. Godinho

Recently, the use of refractory metal silicides as low resistivity, high temperature and high oxidation resistance gate materials in large scale integrated circuits (LSI) has become an important approach in advanced MOS process development (1). This research is a systematic study on the structure and properties of molybdenum silicide thin film and its applicability to high performance LSI fabrication.


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