P27 Thermal fatigue reliability design of BGA package in electronic devices using CAE

2005 ◽  
Vol 2005 (0) ◽  
pp. 477-478
Author(s):  
Qiang YU ◽  
Tadahiro SHIBUTANI ◽  
Masaki SHIRATORI ◽  
Jae-Chul JIN ◽  
Satoshi KONDO
Keyword(s):  
Thermal Fatigue ◽  
Electronic Devices ◽  
Fatigue Reliability ◽  
Reliability Design ◽  
Bga Package

The Iterative Method for Reliability Estimation of Fatigue Life

2012 ◽  
Vol 249-250 ◽  
pp. 628-631
Author(s):  
Xin Li Bai ◽  
Peng Xu ◽  
Jiang Yan Li
Keyword(s):  
Fatigue Life ◽  
Design Method ◽  
Estimation Method ◽  
Engineering Application ◽  
Reliability Estimation ◽  
Fatigue Reliability ◽  
Reliability Design ◽  
Fatigue Design ◽  
Machine Parts ◽  
Stress Cycles

The expression of reliability estimation method for fatigue life of machine parts was derived, and two kinds of stress cycles (reversed cycle and un-symmetric reversed cycle) were considered. An iteration method is presented and the corresponding computer program named STRENGTH-2 is developed for estimating reliable life of machine parts. The engineering application results show that the calculated results are close to experimental results. The proposed method can be convenient to carry out the fatigue reliability design for machine parts under the action of uni-axial and multi-axial loadings, and promote the popularization and application of existing anti-fatigue design method. It has the high value of engineering application.

Analysis of Solder Joint Breakdown Life in Electronic Device Mounted in Vehicle

2004 ◽  
Author(s):  
Qiang Yu ◽  
Masaki Shiratori ◽  
Kimimasa Murayama ◽  
Kazuhiro Igarashi ◽  
Takashi Nakanishi
Keyword(s):  
Thermal Fatigue ◽  
Solder Joints ◽  
Electronic Device ◽  
Time Estimation ◽  
Initial Crack ◽  
Fatigue Reliability ◽  
Electric Device ◽  
Long Time ◽  
Reliability Of Solder Joints ◽  
Improve Reliability

In recent years many electric equipments have come to be used for cars. Solder joints in electric device utilizing car are exposed to harder environment and required higher reliability than that in electric household appliances. Because of this reason, thermal fatigue reliability of solder joints has become one of the most important issues in car electronics. Generally thermal fatigue reliability is estimated by thermal cycle examination, but it needs long time. Estimation by FEM enables it to improve reliability and to reduce time. Analysis of solder life generally can predict only initial crack. But it is important to predict crack propagation and solder joints break down, considering that a function of solder joints is electric connection. In this study, the authors proposed a method to predict break down life by analytical approach.

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