Cure Cycle Analysis in Thermoset Polymers by Thermal and Mechanical Analysis

MRS Advances ◽  
2018 ◽  
Vol 3 (63) ◽  
pp. 3811-3816
Author(s):  
Guillermo I. Meza-Mendoza ◽  
Dalia H. Chávez-García ◽  
Josué A. López Leyva ◽  
Miguel Ponce

ABSTRACTA thermoset polymer can be used for specific applications by creating a unique chemical composition that is designed for certain characteristic environments. To know the behavior of a thermoset polymer, it is necessary to thermally analyze its behavior during the curing process, as well as its mechanical behavior under certain loads that are applied in its field of application. In this study, the epoxy resin X was created at high temperatures, which there was no record of its thermal or mechanical behavior; the resin was analyzed to determine if it was possible to make a reduction in its curing cycle that was at temperature of 425° F with a time of 24 hours. As a result, through thermal analysis such as Differential Scanning Calorimetry (DSC), rheometry, Thermogravimetric Analysis (TGA) and Dynamic Mechanical Thermal Analysis (DMTA); as well as mechanical analysis, such as stress, hardness and planar cutting tests; it was possible to reduce the curing cycle of resin X, which is used in aerospace generators, from 24 hours at 425 ° F to 8 hours at 425 ° F. In the same way, this reduction of the cure cycle was verified by means of a qualification of a product that involved the reduction of the curing cycle of the epoxy resin obtaining very similar results to the original ones, verifying that the change of curing in the epoxy resin did not affected the functioning of the component. This methodology can be used and applied for the study of thermoset polymers that are used in several industries such as aerospace, automotive, among others.

Author(s):  
Kinga Tamási ◽  
Kálmán Marossy

AbstractThe paper deals with the study of seven selected natural plant oils. Differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA) and thermally stimulated discharge (TSD) methods were used. It has been found that most of the oils tested are in a glassy state at low temperature and have multiple transitions in the low temperature range. DSC shows complex melting-like processes or glass transition. For both DMA and TSD, the scaffold supportive method was used and found as a suitable one. DMA and TSD proved more sensitive than DSC and revealed at least two transitions between − 120 and − 40 °C. In the case of three oils (argan, avocado and sunflower), current reversal was observed by TSD; this symptom cannot be fully explained at the moment.


2016 ◽  
Vol 51 (16) ◽  
pp. 2301-2313 ◽  
Author(s):  
B Stankiewicz

Modern bridge structures need light decks with long durability and promising technical parameters. Glass fiber-reinforced polymer orthotropic bridge deck creates unconventional possibilities in bridge designing. Parallel identification of glass fiber-reinforced polymer deck panel by differential thermal analysis, spectroscopy analysis, scanning and optical microscope monitoring, dynamic mechanical analysis and differential scanning calorimetry analysis, tensile and flexural tests will be presented in the paper. Differential thermal analysis was carried out for estimation of the physical and chemical transformation of glass fiber. The differential scanning calorimetry experiments were performed in the glass fiber-reinforced polymer–bridge deck material for determining the mass variation and the energy changes suffered by the materials, as a function of temperature and time. Dynamic mechanical analysis was allowed to detect thermal effects based on the changes in the modulus or damping behavior. Tensile and flexural tests allowed the observation of the decomposition process and information about the basic stress parameters of glass fiber-reinforced polymer material used in bridge applications was taken. Aforementioned analyses are necessary to examine the durability description of the composite element.


Materials ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1686
Author(s):  
Ignazio Blanco ◽  
Valentina Siracusa

The public pressure about the problems derived from the environmental issues increasingly pushes the research areas, of both industrial and academic sectors, to design material architectures with more and more foundations and reinforcements derived from renewable sources. In these efforts, researchers make extensive and profound use of thermal analysis. Among the different techniques available, thermal analysis offers, in addition to high accuracy in the measurement, smartness of execution, allowing to obtain with a very limited quantity of material precious information regarding the property–structure correlation, essential not only in the production process, but overall, in the design one. Thus, techniques such as differential scanning calorimetry (DSC), differential thermal analysis (DTA), dynamic mechanical analysis (DMA) and thermogravimetric analysis (TGA) were, are, and will be used in this transition from fossil feedstock to renewable ones, and in the development on new manufacturing processes such as those of additive manufacturing (AM). In this review, we report the state of the art of the last two years, as regards the use of thermal techniques in biopolymer design, polymer recycling, and the preparation of recyclable polymers as well as potential tools for biopolymer design in AM. For each study, we highlight how the most known thermal parameters, namely glass transition temperature (Tg), melting temperature (Tf), crystallization temperature (Tc) and percentage (%c), initial decomposition temperature (Ti), temperature at maximum mass loss rate (Tm), and tan δ, helped the researchers in understanding the characteristics of the investigated materials and the right way to the best design and preparation.


2008 ◽  
Vol 44 (1) ◽  
pp. 35-38 ◽  
Author(s):  
D. Galusek ◽  
Z. Lencés ◽  
P. Sajgalík ◽  
Ralf Riedel

The organosilicon precursors attract significant attention as substances, which upon heating in inert or reactive atmosphere convert directly to oxide or non-oxide ceramics, like nitrides, carbides, carbonitrides, boroncarbonitrides, oxycarbides, alons, etc. In characterisation, and in study of conversion of these polymers to ceramics thermal analysis plays an important role. The degree of cross-linking of the polymer vital for achievement of high ceramic yield is estimated with the use of thermal mechanical analysis (TMA). Decomposition of polymers and their conversion to ceramics is studied by the combination of differential thermal analysis (DTA), differential scanning calorimetry (DSC) thermogravimetry(TG), and mass spectrometry (MS). The use of these methods in study of the polymer-to-ceramic conversion is illustrated by case studies of a commercially available poly(allyl)carbosilane as the precursor of SiC, and a poly(hydridomethyl)silazane as the precursor of SiCN.


2020 ◽  
Vol 1010 ◽  
pp. 154-159
Author(s):  
K.A. Abdul Halim ◽  
James E. Kennedy ◽  
Joseph B. Farrell ◽  
Muhammad Salihin Zakaria

The addition of nanoclay within polymer matrix is anticipate to enhance the properties of the polymer system. Nonetheless, one of the key elements in property enhancements of a polymer nanocomposites is the surface modifications of the nanoclay. This is due to the affinity between polymer matrix and nanoclay is of important factors should be considered. In this study, amorphous polyamide were melt blended with different nanoclay grades with different surface modifications in order to evaluate the best clay grade for the polymer system. The thermal analysis carried out on the amorphous polyamide nanocomposites were carried out by means of differential scanning calorimetry (DSC) and dynamic mechanical analysis (DMA) whereas the mechanical properties were investigated using tensile testing. It was observed that there were changes in the glass transition temperature (Tg) of the nanocomposites due to clay additions. Further, the storage modulus was found to increase as a result of nanoclay incorporation. The type of clay grades significantly affects the mechanical properties of the amorphous polyamide nanocomposites.


Author(s):  
Chukwuemeka L. Ihemaguba ◽  
Kálmán Marossy

Abstract The paper deals with the study of plasticizers using different thermal methods. The literature data on the melting points of plasticizers proved uncertain; we intended to gather the data by other methods, differential scanning calorimetry (DSC), dynamic mechanical analysis (DMA) and thermally stimulated discharge (TSD). Results of ten plasticizers are demonstrated. During this work, we found that most of plasticizers have no well-defined melting point, and the solidification of plasticizer is similar to the glass transition of polymers. Only the di-n-butyl-phthalate showed regular crystallization. Thermally stimulated discharge current (TSD) method revealed that these compounds have several transitions –dispersion ranges assigned to different molecular motions.


2017 ◽  
Vol 139 (3) ◽  
Author(s):  
Yuan Liu ◽  
Jinyue Dai ◽  
Xiaoqing Liu ◽  
Jun Luo ◽  
Shusen You ◽  
...  

In this paper, a series of bio-based epoxy resins containing organic silicone were prepared from eugenol through a mild synthetic route. Then, 4,4′-diaminophenyl methane (DDM) was applied to cure these epoxy resins, and bisphenol A epoxy resin (DGEBA) was used as a control. The chemical structures of the synthesized resins were characterized by nuclear magnetic resonance (1H-NMR). Properties of the cured epoxy resins were investigated by dielectric test, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), dynamic mechanical analysis (DMA), and scanning electron microscopy (SEM). Compared with DGEBA, the bio-based epoxy resin containing cyclic organic silicon structure exhibited a dramatically lower dielectric constant at both low and high frequencies (3.46, 1 kHz, room temperature). Moreover, the silicone-modified bio-based epoxy resins demonstrated no weight loss below 325 °C and higher residues at 800 °C than that of DGEBA.


1996 ◽  
Vol 8 (1) ◽  
pp. 83-95 ◽  
Author(s):  
Ian Hamerton

Various blends of a commercial bismaleimide (BMI) mixture, a cyanate ester (CE) and a co-monomer with allyl and cyanate pendant groups were formulated and cured. Differential scanning calorimetry (DSC) data were used to monitor the cure of neat resins, while dynamic mechanical thermal analysis (DMTA) was used to assess cure by the measurement of glass transition temperatures ( Tg). It is suggested that following cyclotrimerization of the CE component, the co-reaction between allyl CE and BMI occurs via an ‘ene’/Diels–Alder mechanism (to form linked interpenetrating networks, LIPNs) as evidenced by 13C nuclear magnetic resonance (NMR) spectroscopy. DMTA reveals that, unlike the commercial CE/BMI blends, the cured LIPNs may display a single Tg value which may exceed 350°C depending on the co-monomers used.


1999 ◽  
Vol 72 (3) ◽  
pp. 513-552 ◽  
Author(s):  
A. K. Sircar ◽  
M. L. Galaska ◽  
S. Rodrigues ◽  
R. P. Chartoff

Abstract The paper defines the glass transition temperature (Tg) of elastomers using various thermal analysis techniques (differential scanning calorimetry, DSC; derivative DSC; thermomechanical analysis, TMA; dynamic mechanical analysis, DMA; dielectric analysis, DEA; thermal stimulated current, TSC) and compares Tg values of eight elastomers by the first four techniques. Comparison of Tg by two TMA methods (expansion and penetration) is also included. Necessary information regarding both the specific technique and the sample used to compare published data is mentioned. Their inclusion, along with the Tg data, is emphasized. Correlation of Tg, as determined by thermal methods with that determined by an industrial low-temperature test method (ASTM D 1053-89a) is discussed. The factors that are unique to elastomer Tg determination, such as subambient operation, as compared to other polymers, are pointed out.


2018 ◽  
Vol 45 (6) ◽  
pp. 269-274
Author(s):  
V.S. Osipchik ◽  
Yu.V. Olikhova ◽  
L.Kh. Nguen ◽  
G.A. Lushcheikin ◽  
V.M. Aristov

Thermomechanical analysis, dynamic mechanical analysis, differential scanning calorimetry, and dielectric thermal analysis were used to determine the glass transition temperature of hot-curing epoxy siloxane composites. The effect of polymethylphenylsiloxane resin on the parameters of the three-dimensional structure and on the deformation and strength properties of epoxy novolac resin during curing by 4,4′-diaminodiphenylmethane was established.


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