Determination of elastic modulus of thin layers using nanoindentation

1997 ◽  
Vol 12 (9) ◽  
pp. 2475-2484 ◽  
Author(s):  
J. Menčík ◽  
D. Munz ◽  
E. Quandt ◽  
E. R. Weppelmann ◽  
M. V. Swain
Keyword(s):  
Thin Film ◽  
Experimental Data ◽  
Elastic Modulus ◽  
Linear Function ◽  
Thin Layers ◽  
Film Substrate ◽  
Comparison Of The Results ◽  
Practical Recommendations ◽  
Indentation Response

Elastic modulus of thin homogeneous films can be determined by indenting the specimen to various depths and extrapolating the measured (apparent) E-values to zero penetration. The paper shows the application of five approximation functions for this purpose: linear, exponential, reciprocal exponential, Gao's, and the Doerner and Nix functions. Comparison of the results for 26 film/substrate combinations has shown that the indentation response of film/substrate composites can, in general, be described by the Gao analytical function. In determining the thin film modulus from experimental data, satisfactory results can also be obtained with the exponential function, while linear function may be used only for thick films where the relative depths of penetration are small. The article explains the pertinent procedures and gives practical recommendations for the testing.

Non-Contact Real-Time Evaluation of Polyimide Thin Film Thermoelastic Properties Through Impulsive Stimulated Thermal Scattering

1992 ◽  
Vol 284 ◽  
Author(s):  
J. A. Rogers ◽  
A. R. Duggal ◽  
K. A. Nelson
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Real Time ◽  
Viscoelastic Properties ◽  
Thermoelastic Properties ◽  
Substrate Adhesion ◽  
Thermal Scattering ◽  
Film Substrate ◽  
Time Evaluation

ABSTRACTWe demonstrate a new purely optical based method for the excitation and detection of acoustic and thermal disturbances in thin films. This technique is applied to the determination of the viscoelastic properties of unsupported and silicon supported polyimide thin (∼1 micron) films. We show how this technique can be used to detect film delaminations and suggest how it may be used to probe film-substrate adhesion quality.

Effects of the Substrate on the Determination of SEBS Thin Film Mechanical Properties by Nanoindentation

2006 ◽  
Vol 315-316 ◽  
pp. 766-769
Author(s):  
Yong Zhi Cao ◽  
Ying Chun Liang ◽  
Shen Dong ◽  
T. Sun ◽  
Bo Wang
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Polymer Film ◽  
Young’S Modulus ◽  
Penetration Depth ◽  
Young's Modulus ◽  
Polymer Film Substrate ◽  
Film Substrate ◽  
Composite Hardness

In order to investigate nanoindentation data of polymer film-substrate systems and to learn more about the mechanical properties of polymer film-substrate systems, SEBS (styreneethylene/ butylene-styrene) triblock copolymer thin film on different substrate systems have been tested with a systematic variation in penetration depth and substrate characteristics. Nanoindentation experiments were performed using a Hysitron TriboIndenter with a Berkvoich tip. The resulting data were analyzed in terms of load-displacement curves and various comparative parameters, such as hardness and Young’s modulus. The results obtained by the Oliver and Pharr method show how the composite hardness and Young’s modulus are different for different substrates and different penetration depth.

Extraction of Elastic Modulus and Hardness of the Soft Metallic Films on Hard Substrates by Nanoindentation

2007 ◽  
Vol 561-565 ◽  
pp. 2005-2008
Author(s):  
X.Y. Zhou ◽  
Hai Rong Wang ◽  
Zhuang De Jiang ◽  
Rui Xia Yu
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Elastic Modulus ◽  
Contact Stiffness ◽  
Cross Sectional ◽  
Simple Method ◽  
Sem Image ◽  
Sputter Deposited ◽  
Film Substrate ◽  
Hard Substrates

A simple method to extract the intrinsic mechanical properties of the soft metallic thin films on hard substrates by nanoindenation is presented. Utilizing the geometry relationship of residual impressions obtained by the SEM image and the cross-sectional profile, the pile up error in elastic modulus determination of soft thin films by the Oliver and Pharr analysis is first corrected. Knowledge of the ‘true’ elastic modulus, the ‘true’ hardness of thin film is then extracted from the measured contact stiffness data for an elastically homogeneous film-substrate system. The present method is applied for a 504 nm Au thin film sputter deposited on the glass substrate and the results show that the ‘true’ elastic modulus and hardness of Au film are 80 GPa and 1.3 GPa, which are in agreement well with the literatures.

Determination of thin film hardness for a film/substrate system

2001 ◽  
Vol 27 (4) ◽  
pp. 385-389 ◽  
Author(s):  
H.L. Wang ◽  
M.J. Chiang ◽  
M.H. Hon
Keyword(s):  
Thin Film ◽  
Film Hardness ◽  
Film Substrate

An Engineering Approach for Cumulative Damage in Metals Under Creep Loading

1979 ◽  
Vol 101 (4) ◽  
pp. 337-343 ◽  
Author(s):  
T. Bui-Quoc
Keyword(s):  
Experimental Data ◽  
High Temperature ◽  
Linear Function ◽  
Creep Damage ◽  
Order Effect ◽  
Cumulative Damage ◽  
Remaining Life ◽  
Stress Dependent ◽  
Creep Loading

A concept of cumulative damage is developed for an evaluation of the damage incurred under creep loading at high temperature. The damage is essentially stress-dependent and is a non-linear function of the exposure time. The development results in equations which permit the determination of the creep-rupture curve under loading with constant stress as well as the evaluation of the remaining life under loading with several stress levels. The order effect of creep loading is taken into consideration. The theoretical sum of time-ratios is greater than unity for two decreasing stresses; the reverse is obtained for two increasing levels. This trend is in agreement with observations obtained in cumulative creep damage tests. The correlation between the proposed relations and some available experimental data is discussed.

scholarly journals ИСПОЛЬЗОВАНИЕ ЧИСЛЕННОГО МОДЕЛИРОВАНИЯ ПРИ РАСЧЕТЕ ОСТАТКОВ КОМПОНЕНТОВ ТОПЛИВА

2018 ◽  
Vol 26 (4) ◽  
pp. 87-92
Author(s):  
И.Н. Орлянская ◽  
О.М. Иванов
Keyword(s):  
Experimental Data ◽  
Supply System ◽  
Scale Model ◽  
Ansys Cfx ◽  
Software Product ◽  
Comparison Of The Results

Analysis comparison of the results of the determination of the propellant residual in the propellant supply system by two methods: experimental and numerical was spent. Experimentally, the propellant residual was determined by the scale model. The propellant residual was determined numerically using ANSYS (CFX) software. Recommendations are given for setting up the software product to obtain satisfactory convergence with experimental data.

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