Effects of the Substrate on the Determination of SEBS Thin Film Mechanical Properties by Nanoindentation

2006 ◽  
Vol 315-316 ◽  
pp. 766-769
Author(s):  
Yong Zhi Cao ◽  
Ying Chun Liang ◽  
Shen Dong ◽  
T. Sun ◽  
Bo Wang
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Polymer Film ◽  
Young’S Modulus ◽  
Penetration Depth ◽  
Young's Modulus ◽  
Polymer Film Substrate ◽  
Film Substrate ◽  
Composite Hardness

In order to investigate nanoindentation data of polymer film-substrate systems and to learn more about the mechanical properties of polymer film-substrate systems, SEBS (styreneethylene/ butylene-styrene) triblock copolymer thin film on different substrate systems have been tested with a systematic variation in penetration depth and substrate characteristics. Nanoindentation experiments were performed using a Hysitron TriboIndenter with a Berkvoich tip. The resulting data were analyzed in terms of load-displacement curves and various comparative parameters, such as hardness and Young’s modulus. The results obtained by the Oliver and Pharr method show how the composite hardness and Young’s modulus are different for different substrates and different penetration depth.

Determination of Mechanical Properties of Thin Film on Silicon Wafer

2003 ◽  
Author(s):  
Enboa Wu ◽  
Albert J. D. Yang ◽  
Ching-An Shao ◽  
C. S. Yen
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Thermal Expansion ◽  
Young’S Modulus ◽  
Silicon Wafer ◽  
Coefficient Of Thermal Expansion ◽  
Young's Modulus ◽  
Poisson Ratio ◽  
Bulk State

Nondestructive determination of Young’s modulus, coefficient of thermal expansion, Poisson ratio, and thickness of a thin film has long been a difficult but important issue as the film of micrometer order thick might behave differently from that in the bulk state. In this paper, we have successfully demonstrated the capability of determining all these four parameters at one time. This novel method includes use of the digital phase-shifting reflection moire´ (DPRM) technique to record the slope of wafer warpage under temperature drop condition. In the experiment, 1-um thick aluminum was sputtered on a 6-in silicon wafer. The convolution relationship between the measured data and the mechanical properties was constructed numerically using the conventional 3D finite element code. The genetic algorithm (GA) was adopted as the searching tool for search of the optimal mechanical properties of the film. It was found that the determined data for Young’s modulus (E), Coefficient of Thermal Expansion (CTE), Poisson ratio (ν), and thickness (h) of the 1.00 um thick aluminum film were 104.2Gpa, 38.0 ppm/°C, 0.38, and 0.98 um, respectively, whereas that in the bulk state were measured to be E=71.4 Gpa, CTE=23.0 ppm/°C, and ν=0.34. The significantly larger values on the Young’s modulus and the coefficient of thermal expansion determined by this method might be attributed to the smaller dislocation density due to the thin dimension and formation of the 5-nm layer of Al2O3 formed on top of the 1-um thick sputtered film. The Young’s Modulus and the Poisson ratio of this nano-scale Al2O3 film were then determined. Their values are consistent with the physical intuition of the microstructure.

scholarly journals Determination of the Tensile Properties and Biodegradability of Cornstarch-Based Biopolymers Plasticized with Sorbitol and Glycerol

Polymers ◽  
2021 ◽  
Vol 13 (21) ◽  
pp. 3709
Author(s):  
M. M. Harussani ◽  
S. M. Sapuan ◽  
A. H. M. Firdaus ◽  
Yaser A. El-Badry ◽  
Enas E. Hussein ◽  
...  
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Tensile Strength ◽  
Young’S Modulus ◽  
Food Packaging ◽  
Young's Modulus ◽  
Casting Process ◽  
Biodegradable Materials ◽  
And Performance

In this study, the effects of various quantities of sorbitol and glycerol plasticizers (0%, 30%, 45%, and 60%) on cornstarch-based film were examined to develop a novel polymer for usage with biodegradable materials. The film was prepared using the casting process. According to the test findings, the application of the plasticizer concentrations affected the thickness, moisture content, and water absorption of the film. When plasticizer concentrations were increased to 60%, the tensile stress and Young’s modulus of plasticized films dropped regardless of plasticizer type. However, the thin film with addition of 30% sorbitol plasticizer demonstrated a steady value of Young’s modulus (60.17 MPa) with an increase in tensile strength (13.61 MPa) of 46%, while the lowest combination of tensile strength and Young’s modulus is the film that was plasticized with 60% glycerol, with 2.33 MPa and 16.23 MPa, respectively. In summary, the properties and performance of cornstarch-based film were greatly influenced by plasticizer types and concentrations. The finest set of features in this research appeared in the film plasticized with 30% sorbitol, which achieved the best mechanical properties for food packaging applications.

Measurement of Young's Modulus and Poisson's Ratio of Thin Film by Combination of Bulge Test and Nano-Indentation

2008 ◽  
Vol 33-37 ◽  
pp. 969-974 ◽  
Author(s):  
Bong Bu Jung ◽  
Seong Hyun Ko ◽  
Hun Kee Lee ◽  
Hyun Chul Park
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Poisson’S Ratio ◽  
Young's Modulus ◽  
Applied Pressure ◽  
Indentation Test ◽  
Poisson's Ratio ◽  
Bulge Test ◽  
Nano Indentation

This paper will discuss two different techniques to measure mechanical properties of thin film, bulge test and nano-indentation test. In the bulge test, uniform pressure applies to one side of thin film. Measurement of the membrane deflection as a function of the applied pressure allows one to determine the mechanical properties such as the elastic modulus and the residual stress. Nano-indentation measurements are accomplished by pushing the indenter tip into a sample and then withdrawing it, recording the force required as a function of position. . In this study, modified King’s model can be used to estimate the mechanical properties of the thin film in order to avoid the effect of substrates. Both techniques can be used to determine Young’s modulus or Poisson’s ratio, but in both cases knowledge of the other variables is needed. However, the mathematical relationship between the modulus and Poisson's ratio is different for the two experimental techniques. Hence, achieving agreement between the techniques means that the modulus and Poisson’s ratio and Young’s modulus of thin films can be determined with no a priori knowledge of either.

Influence of annealing on microstructure & molecular orientation, thermal behaviour, mechanical properties and their correlations of uniaxially drawn iPP thin film

e-Polymers ◽  
2008 ◽  
Vol 8 (1) ◽  
Author(s):  
Sayant Saengsuwan
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Tensile Strength ◽  
Young’S Modulus ◽  
Thermal Behaviour ◽  
Annealing Time ◽  
Molecular Orientation ◽  
Young's Modulus ◽  
Crystal Thickness ◽  
Scanning Calorimetry

AbstractThe influence of annealing on the microstructure and molecular orientation, thermal behaviour and mechanical properties of uniaxially drawn iPP thin film was studied by wide-angle X-ray diffraction, differential scanning calorimetry and tensile testing, respectively. The correlations of mechanical and microstructural properties of annealed films were also examined. The transformation of smectic phase of iPP to the α-form was more pronounced with increasing annealing time and temperature. The true and apparent crystallinities and crystal thickness were strongly enhanced with annealing time and temperature. The relative molecular orientation tended to increase with annealing time. These results caused the significant improvement of modulus and tensile strength of the annealed films in both machine (MD) and transverse (TD) directions. The increases in MD-Young’s modulus and MD-tensile strength were well correlated with the increase in true crystallinity obtained in equatorial scans. Some relationship between the increase in crystal thickness and the increase in Young’s modulus in both MD and TD directions was also found.

On the Characterization of Thin Film-only Mechanical Property Based on the Indentation Image Analysis

2006 ◽  
Vol 976 ◽  
Author(s):  
Yun-Hee Lee ◽  
Yong-Il Kim ◽  
Hoon-Sik Jang ◽  
Seung-Hoon Nahm ◽  
Ju-Young Kim ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Penetration Depth ◽  
Volume Ratio ◽  
Hardness Measurement ◽  
Relative Depth ◽  
Au Thin Films ◽  
Film Substrate ◽  
Indenter Penetration

AbstractConventional nanoindentation testing generally uses a peak penetration depth of less than 10 % of thin-film thickness in order to measure film-only mechanical properties, without considering the critical depth for a given thin film-substrate system. The uncertainties in this testing condition make hardness measurement more difficult. We propose a new way to determine the critical relative depth for general thin-film/substrate systems; an impression volume analyzed from the remnant indent image is used here as a new parameter. Nanoindents made on soft Cu and Au thin films with various indentation loads were observed by atomic force microscope. The impression volume calculated from 3D remnant image was normalized by the indenter penetration volume. This indent volume ratio varied only slightly in the shallow regime but decreased significantly when the indenter penetration depth exceeded the targeted critical relative depth. Thus, we determined the critical relative depth by empirically fitting the trend of the indent volume ratio and determining the inflection point. The critical relative depths for Cu and Au films were determined as 0.170 and 0.173, respectively, values smaller than 0.249 and 0.183 determined from the hardness variation of the two thin films. Hence the proposed indent volume ratio is highly sensitive to the substrate constraint, and stricter control of the penetration depth is needed to measure film-only mechanical properties.

Nanoindentation Measurements on Low-k Porous Silica Thin Films Spin Coated on Silicon Substrates

2003 ◽  
Vol 125 (4) ◽  
pp. 361-367 ◽  
Author(s):  
Xiaoqin Huang ◽  
Assimina A. Pelegri
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Microelectromechanical Systems ◽  
Young's Modulus ◽  
Porous Silica ◽  
Silicon Substrates ◽  
Silica Thin Films ◽  
Low K

MEMS (MicroElectroMechanical Systems) are composed of thin films and composite nanomaterials. Although the mechanical properties of their constituent materials play an important role in controlling their quality, reliability, and lifetime, they are often found to be different from their bulk counterparts. In this paper, low-k porous silica thin films spin coated on silicon substrates are studied. The roughness of spin-on coated porous silica films is analyzed with in-situ imaging and their mechanical properties are determined using nanoindentation. A Berkovich type nanoindenter, of a 142.3 deg total included angle, is used and continuous measurements of force and displacements are acquired. It is shown, that the measured results of hardness and Young’s modulus of these films depend on penetration depth. Furthermore, the film’s mechanical properties are influenced by the properties of the substrate, and the reproduction of the force versus displacement curves depends on the quality of the thin film. The hardness of the studied low-k spin coated silica thin film is measured as 0.35∼0.41 GPa and the Young’s modulus is determined as 2.74∼2.94 GPa.

Evaluation of Young's Modulus and Yield Strength of Thin Film Structural Material Using Nanoindentation Technique

1999 ◽  
Vol 562 ◽  
Author(s):  
Dongil Son ◽  
Yun-Hee Lee ◽  
Jeong-Hoon Ahn ◽  
Dongil Kwon
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Yield Strength ◽  
Film Thickness ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Surface Condition ◽  
Sensors And Actuators ◽  
Elastic Range ◽  
Silicon Bulk

ABSTRACTAluminum films have wide applications in micromechanical devices such as micro sensors and actuators. Therefore, their mechanical properties are very important for reliability evaluation. However, there is no standardized method to evaluate the mechanical properties of the materials used in MEMS(microelectromechanical system) devices since the measured mechanical properties are influenced by many factors such as the surface condition of materials, intrinsic limit of the measurement device, etc. Hence, it was intended to evaluate the mechanical properties of thin film, which is important in its mechanical operation. Because MEMS devices are usually operated in the elastic range, Young's modulus and yield strength were evaluated by using a microcantilever beam technique. First, A1 cantilever beams were fabricated using the silicon bulk micromachining technology to have various film thicknesses. The load-displacement curves during beam bending by nanoindentation method were then obtained. The linear relationship of the curve in elastic range was utilized in deriving Young's modulus of the A1 film, which gave reproducible results regardless of film thickness. In the high load range, the deviation from the linear relation was detected, so that yield strength of A1 film could be evaluated. It was found that the yield strength increases with decreasing film thickness. By applying the misfit dislocation theory and the Hall-Petch relationship, the theoretical estimation could predict the trend of yield strength.

Tuning the Mechanical Properties of SiO2 Thin Film for MEMS Application

2003 ◽  
Vol 795 ◽  
Author(s):  
Wang-Shen Su ◽  
Weileun Fang ◽  
Ming-Shih Tsai
Keyword(s):  
Thin Film ◽  
Mechanical Properties ◽  
Residual Stress ◽  
Plasma Treatment ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Plasma Surface ◽  
Sio2 Thin Film ◽  
Plasma Treatments ◽  
Novel Method

ABSTRACTThis study reported a novel method for tuning thin film mechanical properties by means of plasma surface modification. In order to demonstrate the feasibility of this approach, various plasma treatments, including O2, H2, NH3 atmospheres, were implemented to tune the Young's modulus and residual stress of SiO2 film. Without plasma treatment, the static tip deflection of 200μm long SiO2 cantilever was 9.01μm. After treatment with H2, O2, and NH3 plasma, the tip deformation of the treated cantilevers became 10.22μm, 8.28μm, and -6.84μm respectively. The Young's modulus of the SiO2 cantilever without plasma treatment was 76.3GPa. After treated with H2, O2, NH3 plasma, the Young's modului of those treated cantilevers became 70.8 GPa, 74.7 GPa, and 71.4 GPa, respectively. Hence, after H2 and NH3 plasma treatment, the equivalent elastic modulus of SiO2 cantilever could be reduced about 7%.

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