Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

2005 ◽  
Vol 20 (2) ◽  
pp. 364-374 ◽  
Author(s):  
F. Guo ◽  
J.G. Lee ◽  
T. Hogan ◽  
K.N. Subramanian
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Thermal Shock ◽  
Intermetallic Compounds ◽  
Damage Accumulation ◽  
Coefficient Of Thermal Expansion ◽  
Substrate Interface ◽  
Effects Of Aging

Electrical conductivity of electronic interconnects made with Sn-based solders undergo a significant amount of deterioration during service. Several factors, such as anisotropy of Sn, coefficient of thermal expansion mismatches between the entities that make up the joint, and growth of intermetallic compounds present within the solder and solder/substrate interface, may contribute to the damage accumulation during thermal excursions and cause deterioration of properties. This study dealing with effects of aging and thermal shock on electrical conductivity, carried out with bulk Sn, and eutectic Sn–Ag in bulk and joint configurations, is aimed at evaluating the roles of the above factors on the deterioration of electrical conductivity from these thermal excursions.

Effect of Interconnectivity of Nickel on Electrical and Thermal Properties of Alumina-Ni Interpenetrating Phase Composite

2011 ◽  
Vol 239-242 ◽  
pp. 2679-2682 ◽  
Author(s):  
Rub Nawaz Shahid ◽  
Bin Awais Hasan ◽  
Fahad Ali ◽  
Naeem Ul Haq Tariq
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Impedance Spectroscopy ◽  
Electron Spectroscopy ◽  
Coefficient Of Thermal Expansion ◽  
Optimal Combination ◽  
Percolation Limit ◽  
Scanning Electron

In this work percolation range for Al2O3-Ni interpenetrating phase composite (IPC) was studied to find the optimal combination of electrical conductivity and coefficient of thermal expansion (CTE). The impedance spectroscopy and scanning electron spectroscopy were used to study the percolation limit.

Synthesis and processing of nanocrystalline Ag–Fe–Ni for low thermal expansion–high conductivity thermal management applications

2001 ◽  
Vol 16 (2) ◽  
pp. 340-343 ◽  
Author(s):  
J. Stolk ◽  
M. Gross ◽  
D. Stolk ◽  
A. Manthiram
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Metal Ion ◽  
Coefficient Of Thermal Expansion ◽  
Thermomechanical Analysis ◽  
Nominal Composition ◽  
Two Phase ◽  
X Ray ◽  
Fine Grained ◽  
Low Thermal Expansion

Nanocrystalline Ag–Fe–Ni powders were produced by a reduction of the aqueous metal ion solutions with sodium borohydride and then converted to fine-grained silver–Invar alloys that offer attractive thermal, electrical, and mechanical properties. The samples were characterized by x-ray diffraction, scanning electron microscopy, wavelength dispersive x-ray spectrometry, thermomechanical analysis, microhardness measurements, and electrical conductivity measurements; thermal conductivity was estimated using the Wiedemann–Franz law. Sintering of a specimen with a nominal composition of 60 wt% Ag–25.6 wt% Fe–14.4 wt.% Ni led to the formation of a two-phase silver–Invar alloy with a grain size of approximately 2 μm, a hardness of 133 HK200g, coefficient of thermal expansion of 12.44 × 10−6 / °C, and electrical conductivity of 2.13 × 105 (Ω cm) −1.

Comparison study of carbon black (CB) used as conductive filler in epoxy and polymethylmethacrylate (PMMA)

2016 ◽  
Vol 36 (4) ◽  
pp. 391-398 ◽  
Author(s):  
Jin-Luen Phua ◽  
Pei-Leng Teh ◽  
Supri Abdul Ghani ◽  
Cheow-Keat Yeoh
Keyword(s):  
Thermal Stability ◽  
Electrical Conductivity ◽  
Fracture Toughness ◽  
Thermal Expansion ◽  
Carbon Black ◽  
Coefficient Of Thermal Expansion ◽  
Conductive Filler ◽  
Filler Loading ◽  
Comparison Study ◽  
Thermoset Epoxy

Abstract A comparison study between carbon black (CB) filled thermoset (epoxy) and thermoplastic, polymethylmethacrylate (PMMA), was done in this research. CB was introduced as the conductive filler in epoxy and PMMA at different filler loading, which ranged from 5 vol.% to 20 vol.%. The physical, mechanical, electrical and thermal stability properties were investigated. The incorporation of CB into both epoxy and PMMA increased the density, improved the thermal stability and electrical conductivity of the composites, reduced the coefficient of thermal expansion and weakened the flexural and fracture toughness properties of the composites.

Reliability of Sn-Ag-Cu Flip Chip Package with Underfill under Thermal Shock

2006 ◽  
Vol 510-511 ◽  
pp. 558-561 ◽  
Author(s):  
Bo In Noh ◽  
Seung Boo Jung
Keyword(s):  
Thermal Expansion ◽  
Thermal Shock ◽  
Solder Ball ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Fatigue Property ◽  
Electroless Nickel ◽  
Fatigue Properties ◽  
Electroless Nickel Immersion Gold ◽  
Better Than

Thermal fatigue properties of solder joints encapsulated with underfill were studied conducting thermal shock tests. Flip chip package with electroless nickel-immersion gold plated on FR-4 substrate and the Sn-3.0Ag-0.5Cu solder ball was used. The fatigue property of package with underfill was better than the package without it. The fatigue property of package with underfill which has a higher glass transition temperature (Tg) and lower coefficient of thermal expansion (CTE) was better than that of package with underfill with lower Tg and higher CTE.

Thermal, Electrical and Physical Properties of Recycled Copper Filled Epoxy Composites

2012 ◽  
Vol 620 ◽  
pp. 208-212
Author(s):  
Mohamd Nur Fuadi Pargi ◽  
Pei Leng Teh ◽  
Salmah Husseinsyah ◽  
Cheow Keat Yeoh
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Physical Properties ◽  
Volume Fraction ◽  
Epoxy Composite ◽  
Coefficient Of Thermal Expansion ◽  
Filler Loading ◽  
Epoxy Composites ◽  
Milling Machine

The effect of recycled copper filled epoxy composites on thermal, electrical and physical properties were investigated. The recycled copper was collected as a waste from the milling machine. The recycled copper filled epoxy composite was mixed using mechanical stirrer. The effect of volume fraction of recycled copper of the epoxy composites were studied based on the coefficient of thermal expansion (CTE), electrical conductivity hardness and density. Incorporation of recycled copper has decreased the CTE of the composites. The electrical conductivity, hardness and density of the composites increased with increasing of volume fraction and filler loading.

Improving mechanical and thermal properties of graphite–aluminium composite using Si, SiC and eggshell particles

2019 ◽  
Vol 54 (17) ◽  
pp. 2365-2376 ◽  
Author(s):  
MO Durowoju ◽  
TB Asafa ◽  
ER Sadiku ◽  
S Diouf ◽  
MB Shongwe ◽  
...  
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Relative Density ◽  
Coefficient Of Thermal Expansion ◽  
Mechanical And Thermal Properties ◽  
Sem Images ◽  
Plasma Sintering ◽  
Low Thermal Expansion ◽  
Spark Plasma

Graphite–aluminium (Gr–Al) composites are being used for diverse engineering applications because of their light weight, good electrical conductivity and thermal properties. However, their applications are limited by high coefficient of thermal expansion and low microhardness values which can be enhanced by adding cheap and efficient fillers. This paper reports the effect of addition of eggshell (ES) particles on the properties of sintered Gr–Al-based composites. Five different composites (Gr–Al, Gr–Al  +  20 wt.%Si, Gr–Al + 20 wt.%SiC, Gr–Al + 20Si wt.% + 20 wt.%ES and Gr–Al + 20SiC wt.% + 20 wt.%ES) were sintered at a temperature of 540 ℃, holding time of 10 min, heating rate of 52 ℃/min and pressure of 50 MPa using spark plasma sintering system. The sintered samples were characterized based on morphology, microhardness, relative density, coefficient of thermal expansion and electrical conductivity. Based on SEM images, graphite particles of flake-like structure were largely undeformed while Al particles were smaller, round and irregular in shape and fairly uniformly distributed in the composites. The microhardness value of sintered Gr–Al + 20 wt.%SiC + 20 wt.%ES composite was 39.55 HV compared to 30.46 HV for Gr–Al, the least of the samples. The Gr–Al + 20 wt.%SiC + 20 wt.%ES composite also has a very low thermal expansion coefficient (0.98 × 10−5/K) but lowest electrical conductivity at temperature beyond 150 ℃. Highest densification and minimum relative density (94%) were obtained in Gr–Al + 20 wt.%Si + 20 wt.%ES composite. These enhanced performances are largely due to the incorporation of ES particles. This study therefore demonstrated that ESs particles enhanced microhardness and lowered thermal expansion of Gr–Al-based composites which have promising applications in industries especially for thermal management.

scholarly journals Intrinsic Thermal Shock Behavior of Common Rutile Oxides

Physics ◽  
2019 ◽  
Vol 1 (2) ◽  
pp. 290-300 ◽  
Author(s):  
Denis Music ◽  
Bastian Stelzer
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Elastic Modulus ◽  
Thermal Shock ◽  
Thermal Shock Resistance ◽  
Density Functional ◽  
Coefficient Of Thermal Expansion ◽  
Thermomechanical Properties ◽  
Linear Coefficient ◽  
Shock Resistance

Rutile TiO2, VO2, CrO2, MnO2, NbO2, RuO2, RhO2, TaO2, OsO2, IrO2, SnO2, PbO2, SiO2, and GeO2 (space group P42/mnm) were explored for thermal shock resistance applications using density functional theory in conjunction with acoustic phonon models. Four relevant thermomechanical properties were calculated, namely thermal conductivity, Poisson’s ratio, the linear coefficient of thermal expansion, and elastic modulus. The thermal conductivity exhibited a parabolic relationship with the linear coefficient of thermal expansion and the extremes were delineated by SiO2 (the smallest linear coefficient of thermal expansion and the largest thermal conductivity) and PbO2 (vice versa). It is suggested that stronger bonding in SiO2 than PbO2 is responsible for such behavior. This also gave rise to the largest elastic modulus of SiO2 in this group of rutile oxides. Finally, the intrinsic thermal shock resistance was the largest for SiO2, exceeding some of the competitive phases such as Al2O3 and nanolaminated Ti3SiC2.

INCOLOY ALLOY 909

Alloy Digest ◽  
1987 ◽  
Vol 36 (12) ◽  
Keyword(s):  
Thermal Expansion ◽  
Corrosion Resistance ◽  
Physical Properties ◽  
Thermal Shock ◽  
Thermal Fatigue ◽  
Coefficient Of Thermal Expansion ◽  
High Strength ◽  
Heat Treating ◽  
Strength Alloy ◽  
Incoloy Alloy

Abstract INCOLOY alloy 909 is a high-strength alloy having a constant low coefficient of thermal expansion and an essentially constant rigidity up to 1200 F. The alloy is highly resistant to thermal fatigue and thermal shock. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Fe-81. Producer or source: Inco Alloys International Inc..

NILO ALLOY 36

Alloy Digest ◽  
1987 ◽  
Vol 36 (8) ◽  
Keyword(s):  
Thermal Expansion ◽  
Corrosion Resistance ◽  
High Temperature ◽  
Physical Properties ◽  
Surface Treatment ◽  
Constant Coefficient ◽  
Coefficient Of Thermal Expansion ◽  
Heat Treating ◽  
Temperature Performance ◽  
Iron Nickel

Abstract NILO alloy 36 is a binary iron-nickel alloy having a very low and essentially constant coefficient of thermal expansion at atmospheric temperatures. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, joining, and surface treatment. Filing Code: Fe-79. Producer or source: Inco Alloys International Inc..

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