Kinetics of intermetallic compound layers and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field

2010 ◽  
Vol 25 (2) ◽  
pp. 359-367 ◽  
Author(s):  
Cong-qian Cheng ◽  
Jie Zhao ◽  
Yang Xu
Keyword(s):  
Magnetic Field ◽  
Intermetallic Compound ◽  
Lorentz Force ◽  
High Magnetic Field ◽  
Solubility Limit ◽  
Layer Growth ◽  
Ripening Process ◽  
Cu Substrate ◽  
Cu Dissolution ◽  
Kinetics Of

The kinetics of intermetallic compound (IMC) layer and Cu dissolution at Sn1.5Cu/Cu interface under high magnetic field was experimentally examined. It is found that the IMC layer growth is controlled by flux-driven ripening process. The high magnetic field promotes the growth of IMC layer, retards the dissolution of Cu substrate, and decreases the content of Cu solute at the liquid–IMC interface front. Based on the experimental results, it is considered that the magnetization induced by magnetic field promotes the ripening process for IMC layer growth. The Lorentz force dampening the convection and magnetization decreasing the Cu solubility limit can retard the Cu dissolution and change the solute distribution at the liquid–IMC interface front.

Growth Kinetics of Intermetallic Compounds at the Interface of Liquid Sn-9Zn/Cu

2011 ◽  
Vol 233-235 ◽  
pp. 2323-2327
Author(s):  
Hui Zhen Huang ◽  
Xiu Qin Wei ◽  
Lang Zhou
Keyword(s):  
Activation Energy ◽  
Intermetallic Compound ◽  
Intermetallic Compounds ◽  
Solder Alloy ◽  
Growth Kinetics ◽  
Layer Growth ◽  
Experimental Results ◽  
Cu Substrate ◽  
Diffusion Mechanisms ◽  
Kinetics Of

The morphology and growth of the intermetallic compound (IMC) formed between liquid Sn-9Zn eutectic solder alloy and Cu at 220-260°C was investigated. Experimental results showed that γ-Cu5Zn8 was present at the Sn-9Zn/Cu interface as the reaction product. The IMC layer growth follows the parabolic-growth law, which indicates that the growth of the IMC is controlled by the diffusion mechanisms. The activation energy of γ-Cu5Zn8 layer growth for liquid Sn-9Zn reacting with Cu substrate is determined as 50.5 KJ/mol.

Nucleation kinetics of paramagnetic and diamagnetic metal melts under a high magnetic field

2021 ◽  
Vol 73 ◽  
pp. 165-170
Author(s):  
Zhipeng Long ◽  
Qiuyue Jiang ◽  
Jiantao Wang ◽  
Long Hou ◽  
Xing Yu ◽  
...  
Keyword(s):  
Magnetic Field ◽  
High Magnetic Field ◽  
Nucleation Kinetics ◽  
Metal Melts ◽  
Kinetics Of

Effect of Magnetic Field Processing on Recrystallization and Grain Growth

2012 ◽  
Vol 706-709 ◽  
pp. 2806-2811 ◽  
Author(s):  
I. Salvatori
Keyword(s):  
Magnetic Field ◽  
Grain Growth ◽  
High Magnetic Field ◽  
Field Intensity ◽  
Magnetic Field Intensity ◽  
Retarding Effect ◽  
Cold Rolled ◽  
Kinetics Of

In this paper the recrystallisation kinetics of cold rolled strips as a function of magnetic field intensity has been studied on a Fe-0.05C-1.5Mn alloy. The retarding effect on recrystallisation due to the application of a magnetic field on samples treated with magnetic field up to 10T, has been experimentally confirmed. The effect was more evident for high magnetic field and for long annealing times. In addition, a small retarding effect of magnetic field on grain growth has been noticed.

scholarly journals The Feasibility of Formation and Kinetics of NMR Signal Amplification by Reversible Exchange (SABRE) at High Magnetic Field (9.4 T)

2014 ◽  
Vol 136 (9) ◽  
pp. 3322-3325 ◽  
Author(s):  
Danila A. Barskiy ◽  
Kirill V. Kovtunov ◽  
Igor V. Koptyug ◽  
Ping He ◽  
Kirsten A. Groome ◽  
...  
Keyword(s):  
Magnetic Field ◽  
High Magnetic Field ◽  
Signal Amplification ◽  
Kinetics Of

Growth Kinetics of Intermetallic Compound and Interfacial Reactions in Pb-Free Flip Chip Solder Bump during Solid State Isothermal Aging

2005 ◽  
Vol 486-487 ◽  
pp. 273-276
Author(s):  
Dae Gon Kim ◽  
Hyung Sun Jang ◽  
Young Jig Kim ◽  
Seung Boo Jung
Keyword(s):  
Solid State ◽  
Intermetallic Compound ◽  
Growth Kinetics ◽  
Isothermal Aging ◽  
Flip Chip ◽  
Compound Layer ◽  
Layer Growth ◽  
Intermetallic Compound Layer ◽  
Temperature Range ◽  
Kinetics Of

In the present work, the growth kinetics of intermetallic compound layer formed in Sn-3.5Ag flip chip solder joints by solid-state isothermal aging was examined at temperatures between 80 and 150 °C for 0 to 60 days. The bumping for the flip chip devices was performed using an electroless under bump metallization. The quantitative analyses were performed on the intermetallic compound layer thickness as a function of aging time and aging temperature. The layer growth of the Ni3Sn4 intermetallic compound followed a parabolic law within a given temperature range. As a whole, because the value of the time exponent (n) is approximately equal to 0.5, the layer growth of the intermetallic compound was mainly controlled by diffusion mechanism in the temperature range studied. The apparent activation energy of the Ni3Sn4 intermetallic was 49.63 kJ/mol.

The Growth Behaviors of IMC Layers at Soldered and Diffusion Bonding Sn/Cu Interfaces and the Effects of High Magnetic Field

2008 ◽  
Vol 373-374 ◽  
pp. 480-483 ◽  
Author(s):  
Cong Qian Cheng ◽  
Jie Zhao ◽  
Yang Xu ◽  
Peng Yang
Keyword(s):  
Magnetic Field ◽  
Intermetallic Compound ◽  
High Magnetic Field ◽  
Diffusion Bonding ◽  
Crystal Orientations ◽  
And Diffusion

The growth behaviors of intermetallic compound (IMC) layers in soldered and diffusion bonding Sn/Cu joints and the effects of magnetic field have been investigated. The results indicate that, without high magnetic field, the growth behaviors of these two IMC layers are similar in the aging except the initial morphologies. However, the morphologies and crystal orientations of these two IMC layers have changed after being aged in high magnetic field.

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