The Atomic, Electronic and Defect Structure of the Dynamically Formed Cu2O/Cu Interfaces

2007 ◽  
Vol 1026 ◽  
Author(s):  
Xuetian Han ◽  
Judith C. Yang
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Island Growth ◽  
Cross Sectional ◽  
Dual Beam ◽  
Transmission Electron ◽  
Initial Stage ◽  
Cu Film ◽  
High Resolution Tem ◽  
Electron Energy Loss

AbstractTo gain fundamental insights into metal oxidation, the dynamically formed Cu/Cu2O interface was investigated by cross-sectional TEM (Transmission Electron Microscopy) methods. Copper (001) films were oxidized in oxygen within a UHV chamber to create Cu2O islands that formed epitaxially with respect to the Cu film. The cross-sectional Cu2O/Cu TEM sample was prepared by dual beam (DB) focused ion beam (FIB) instrument and the interface was probed by high-resolution TEM (HREM) and electron energy loss spectrum (EELS). It is found that Cu2O {110} layer distance significantly decreases from the interface area to the bulk Cu2O region, which is about 3∼4 unit cell thickness in Cu2O side; while the {100Cu2O layer distance increases with increasing distance from the interface region. The chemical Cu/Cu2O interface thickness has been measured with EELS analysis, which is about 2nm where the oxidation state of Cu gradually changes from Cu0 to Cu+1. This transition region indicates the area where Cu/Cu2O interface exists and suggests the existence of metastable Cu oxides. The Cu2O island growth mechanism of predominantly anion interfacial diffusion at the initial stage oxidation has been proposed.

Multiple Double Cross-Section Transmission Electron Microscope Sample Preparation of Specific Sub-10 nm Diameter Si Nanowire Devices

2011 ◽  
Vol 17 (6) ◽  
pp. 889-895 ◽  
Author(s):  
Lynne M. Gignac ◽  
Surbhi Mittal ◽  
Sarunya Bangsaruntip ◽  
Guy M. Cohen ◽  
Jeffrey W. Sleight
Keyword(s):  
Electron Microscope ◽  
High Resolution ◽  
Cross Section ◽  
Transmission Electron Microscope ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Si Nanowire ◽  
Dual Beam ◽  
Transmission Electron ◽  
High Resolution Tem

AbstractThe ability to prepare multiple cross-section transmission electron microscope (XTEM) samples from one XTEM sample of specific sub-10 nm features was demonstrated. Sub-10 nm diameter Si nanowire (NW) devices were initially cross-sectioned using a dual-beam focused ion beam system in a direction running parallel to the device channel. From this XTEM sample, both low- and high-resolution transmission electron microscope (TEM) images were obtained from six separate, specific site Si NW devices. The XTEM sample was then re-sectioned in four separate locations in a direction perpendicular to the device channel: 90° from the original XTEM sample direction. Three of the four XTEM samples were successfully sectioned in the gate region of the device. From these three samples, low- and high-resolution TEM images of the Si NW were taken and measurements of the NW diameters were obtained. This technique demonstrated the ability to obtain high-resolution TEM images in directions 90° from one another of multiple, specific sub-10 nm features that were spaced 1.1 μm apart.

A Novel Technique of Device Measurement after Cross-Sectional FIB in Failure Analysis

2009 ◽  
Author(s):  
Chih-Chung Chang ◽  
Jian-Chang Lin ◽  
Wen-Sheng Wu ◽  
Chih-Ying Tasi ◽  
Ching-Lin Chang
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Electrical Measurement ◽  
Cross Sectional ◽  
Root Cause ◽  
Novel Technique ◽  
Atomic Force ◽  
Dual Beam ◽  
Transmission Electron ◽  
Failure Site

Abstract A dual beam FIB (Focused Ion Beam) system which provides the ion beam (i-beam) and electron beam (e-beam) function are widely used in semiconductor manufacture for construction analysis and failure cause identification. Although FIB is useful for defect or structure inspection, sometimes, it is still difficult to diagnose the root cause via FIB e-beam image due to resolution limitation especially in products using nano meter scale processes. This restriction will deeply impact the FA analysts for worst site or real failure site judgment. The insufficient e-beam resolution can be overcome by advanced TEM (Transmission Electron Microscope) technology, but how can we know if this suspected failure site is a real killer or not when looking at the insufficient e-beam images inside a dual beam tool? Therefore, a novel technique of device measurement by using C-AFM (Conductive Atomic Force Microscope) or Nano-Probing system after cross-sectional (X-S) FIB inspection has been developed based on this requirement. This newly developed technology provides a good chance for the FA analysts to have a device characteristic study before TEM sample preparation. If there is any device characteristic shift by electrical measurement, the following TEM image should show a solid process abnormality with very high confidence. Oppositely, if no device characteristic shift can be measured, FIB milling is suggested to find the real fail site instead of trying TEM inspection directly.

Local impedance and microchemical analysis of electrical heterogeneities in multilayer electroceramic devices

2007 ◽  
Vol 22 (12) ◽  
pp. 3507-3515 ◽  
Author(s):  
G.Y. Yang ◽  
P.J. Moses ◽  
E.C. Dickey ◽  
C.A. Randall
Keyword(s):  
Electron Microscopy ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Electrical Potential ◽  
Experimental Methodology ◽  
Electrical Measurements ◽  
Dual Beam ◽  
Transmission Electron ◽  
Voltage Contrast ◽  
Electron Energy Loss

We present an experimental methodology for locating and studying local failure sites in multilayer electroceramic devices at the submicron-length scale. In particular, the inhomogeneous degradation of multilayer ceramic capacitors is studied using a judicious combination of scanning electron microscopy (SEM), local-probe electrical measurements, focused ion beam (FIB) extraction, and transmission electron microscopy (TEM). Voltage-contrast SEM permits the identification of regions of different electrical potential within degraded multilayer devices. The local impedance from specific regions is measured in situ between a tungsten probe and the internal device electrodes, while impedance spectra are extracted for more detailed analysis. Because implementation occurs in dual-beam FIB/SEM, these locally defective sites can be extracted and thinned to electron transparency for further investigation by TEM. In this study, degraded sites in BaTiO3 multilayer capacitors are found to be associated with local oxygen deficiencies in BaTiO3, as measured by electron energy loss spectroscopy.

Low Energy Ar Ion Milling of FIB TEM Specimens from 14 nm and Future FinFET Technologies

2018 ◽  
Author(s):  
C.S. Bonifacio ◽  
P. Nowakowski ◽  
M.J. Campin ◽  
M.L. Ray ◽  
P.E. Fischione
Keyword(s):  
Field Effect Transistor ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Specimen Preparation ◽  
Ion Milling ◽  
Transmission Electron ◽  
High Resolution Tem ◽  
Effect Transistor ◽  
20 Nm ◽  
Argon Ion

Abstract Transmission electron microscopy (TEM) specimens are typically prepared using the focused ion beam (FIB) due to its site specificity, and fast and accurate thinning capabilities. However, TEM and high-resolution TEM (HRTEM) analysis may be limited due to the resulting FIB-induced artifacts. This work identifies FIB artifacts and presents the use of argon ion milling for the removal of FIB-induced damage for reproducible TEM specimen preparation of current and future fin field effect transistor (FinFET) technologies. Subsequently, high-quality and electron-transparent TEM specimens of less than 20 nm are obtained.

TEM Sample Preparation Tricks for Advanced DRAMs

2015 ◽  
Author(s):  
Ching Shan Sung ◽  
Hsiu Ting Lee ◽  
Jian Shing Luo
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Sample Preparation ◽  
Integrated Circuit ◽  
Focused Ion Beam ◽  
Ion Beam ◽  
Tem Analysis ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Characterization Of Materials

Abstract Transmission electron microscopy (TEM) plays an important role in the structural analysis and characterization of materials for process evaluation and failure analysis in the integrated circuit (IC) industry as device shrinkage continues. It is well known that a high quality TEM sample is one of the keys which enables to facilitate successful TEM analysis. This paper demonstrates a few examples to show the tricks on positioning, protection deposition, sample dicing, and focused ion beam milling of the TEM sample preparation for advanced DRAMs. The micro-structures of the devices and samples architectures were observed by using cross sectional transmission electron microscopy, scanning electron microscopy, and optical microscopy. Following these tricks can help readers to prepare TEM samples with higher quality and efficiency.

To Eliminate Curtain Effect of FIB TEM Samples by a Combination of Sample Dicing and Backside Milling

2014 ◽  
Author(s):  
Jian-Shing Luo ◽  
Hsiu Ting Lee
Keyword(s):  
Sample Preparation ◽  
Focused Ion Beam ◽  
Preparation Method ◽  
Low Cost ◽  
Ion Beam ◽  
Sample Preparation Method ◽  
Site Specific ◽  
Dual Beam ◽  
Transmission Electron

Abstract Several methods are used to invert samples 180 deg in a dual beam focused ion beam (FIB) system for backside milling by a specific in-situ lift out system or stages. However, most of those methods occupied too much time on FIB systems or requires a specific in-situ lift out system. This paper provides a novel transmission electron microscopy (TEM) sample preparation method to eliminate the curtain effect completely by a combination of backside milling and sample dicing with low cost and less FIB time. The procedures of the TEM pre-thinned sample preparation method using a combination of sample dicing and backside milling are described step by step. From the analysis results, the method has applied successfully to eliminate the curtain effect of dual beam FIB TEM samples for both random and site specific addresses.

Dual Beam Focused Ion Beam and Transmission Electron Microscopies of Nanoscale Sectioned Diatom Frustules

2007 ◽  
Vol 13 (S02) ◽  
Author(s):  
T Gutu ◽  
J Wu ◽  
C Jeffreys ◽  
C-H Chang ◽  
G Rorrer ◽  
...  
Keyword(s):  
Focused Ion Beam ◽  
Ion Beam ◽  
Electron Microscopies ◽  
Dual Beam ◽  
Transmission Electron

A Method for Site Specific Characterization Using a Dedicated FIB System Combined With an Analyitical TEM

1999 ◽  
Vol 5 (S2) ◽  
pp. 914-915
Author(s):  
T. Kamino ◽  
T. Yaguchi ◽  
H. Matsumoto ◽  
H. Kobayashi ◽  
H. Koike
Keyword(s):  
Focused Ion Beam ◽  
Ion Irradiation ◽  
Ion Beam ◽  
System Stability ◽  
Specimen Preparation ◽  
Thin Specimen ◽  
Cross Sectional ◽  
Site Specific ◽  
Specimen Holder ◽  
High Resolution Tem

A method for site specific characterization of the materials using a dedicated focused ion beam(FIB) system and an analytical transmission electron microscope (TEM) was developed. Needless to say, in TEM specimen preparation using FIB system, stability of a specimen is quite important. The specimen stage employed in the developed FIB system is the one designed for high resolution TEM, and the specimen drift rate of the stage is less than lnm/min. In addition, FIB-TEM compatible specimen holder which allows milling of a specimen with the FIB system and observation of the specimen with the TEM without re-loading was developed. To obtain thin specimen from the area to be characterized correctly, confirmation of the area before final milling is needed. However, observation of cross sectional view in a FIB system is recommended because it causes damage by Ga ion irradiation. To solve this problem, we used a STEM unit as a viewer of FIB milled specimen.

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