Novel Process for Ceramic Epitaxy Using Laser Mbe

1990 ◽  
Vol 201 ◽  
Author(s):  
Mamoru Yoshimoto ◽  
Hirotoshi Nagata ◽  
Tadashi Tsukahara ◽  
Satoshi Gonda ◽  
Hideomi Koinuma

AbstractAn ArF excimer laser MBE system specially designed for the deposition of ceramic thin films was used to construct atomi-cally defined epitaxial SrCuO2−x films. According to XPS analysis, Cu valence was evaluated to be 2+ in the film as-grown in the presence of 10−7 Torr NO2, but it was less than 2+ in the film prepared in the presence of 10−7Torr 02. In situ XPS depth analysis of as-grown SrCuO2−x film on SrTiO3 substrate revealed the band profile at the interface of the film and substarte. Ceramic superlattices composed of metallic SrCuO2−x (3∼8nm thick) and insulative SrTiO3 (8nm thick) were prepared by sequential heteroepitaxial growth.

1999 ◽  
Vol 65 (11) ◽  
pp. 1589-1593
Author(s):  
Takashi MORINO ◽  
Hayato ONODERA ◽  
Yoshimi TAKAHASHI ◽  
Masayuki IKEDA

1997 ◽  
Vol 502 ◽  
Author(s):  
Dave H. A. Blank ◽  
Horst Rogalla

ABSTRACTPulsed Laser and Sputter Deposition are used for the fabrication of complex oxide thin films at relatively high oxygen pressures (up to 0.5 mBar). This high pressure hampers the application of a number of in-situ diagnostic tools. One of the exceptions is ellipsometry. Using this technique we studied in-situ the growth of off-axis sputtered Yba2Cu3O6+x thin films on (001) SrTiO3 as a function of the deposition parameters. Furthermore, the oxidation process from O(6) to O(7) has been studied by performing spectroscopic ellipsometry during isobaric cooling procedures.Another suitable in-situ monitoring technique for the growth of thin films is Reflection High Energy Electron Diffraction (RHEED). In general this is a (high) vacuum technique. Here, we present an RHEED-system in which we can observe clear diffraction patterns up to a deposition pressure of 0.5 mBar. The system has been used for in-situ monitoring of the heteroepitaxial growth of YBa2Cu3 06+x on SrTiO3 by pulsed laser deposition.


2013 ◽  
Vol 210 (12) ◽  
pp. 2729-2735 ◽  
Author(s):  
Ingmar Höger ◽  
Thomas Schmidt ◽  
Anja Landgraf ◽  
Martin Schade ◽  
Annett Gawlik ◽  
...  

1995 ◽  
Vol 34 (Part 2, No. 9A) ◽  
pp. L1145-L1147 ◽  
Author(s):  
Minoru Tachiki ◽  
Masahiro Matsutani ◽  
Tatsuhiko Fujii ◽  
Yoshiyuki Sakaguchi ◽  
Takeshi Kobayashi

2021 ◽  
Vol 542 ◽  
pp. 148684
Author(s):  
Jordi Fraxedas ◽  
Max Schütte ◽  
Guillaume Sauthier ◽  
Massimo Tallarida ◽  
Salvador Ferrer ◽  
...  

1992 ◽  
Vol 7 (7) ◽  
pp. 1912-1916 ◽  
Author(s):  
M. Okoshi ◽  
M. Murahara ◽  
K. Toyoda

Photochemical modification of the polytetrafluoroethylene (PTFE) with incorporation of the CH3 radical released from the B(CH3)3 molecule excited by an ArF excimer laser has been demonstrated. The incorporation of CH3 radicals and the depletion of fluorine atoms of the polymer surface were studied by XPS analysis and infrared ATR spectrum measurement. In these photochemical reactions, the photoirradiated surface changed into oleophilic. The properties were studied by contact angle measurement. The stability of the oleophilic surface was examined at the elevated temperature of 200 °C for 6 h in O2 or N2 ambient and also by immersing in alkaline or acid water solutions.


1993 ◽  
Vol 334 ◽  
Author(s):  
T. Miyokawa ◽  
M. Okoshi ◽  
K. Toyoda ◽  
M. Murahara

AbstractSilicon films were deposited on a fluororesin surface. The process was divided into two steps: surface modification process and silicon CVD onto the modified parts. In the modification process, SiH4 and B(CH3)3 mixed gases were used with ArF excimer laser. Fluorine atoms of the surface were pulled out by boron atoms which were photo—dissociated from B(CH3)3 and were replaced with silicon atoms released from SiH4. In the CVD process, SiH4 gas was used with high—density excited ArF excimer laser. Silicon films were deposited onto the nuclei by photodecomposition of SiH4.Chemical compositions of the modified layers and the deposited parts were inspected by XPS analysis. 1000 Å thickness of the deposited silicon films was confirmed by the surface roughness interference–meter.


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