Point Defect Detector Studies of Oxidized Silicon

1991 ◽  
Vol 238 ◽  
Author(s):  
H. L. Meng ◽  
K. S. Jones ◽  
S. Prussin
Keyword(s):  
Ion Implantation ◽  
Point Defect ◽  
Point Defects ◽  
Device Fabrication ◽  
Type Ii ◽  
Dislocation Loops ◽  
Plan View ◽  
Atom Concentration ◽  
Enhanced Diffusion ◽  
Transmission Electron

ABSTRACTIon implantation and thermal oxidation are device fabrication processes that lead to perturbation of equilibrium point defects concentration in silicon. This study investigates the interaction between oxidation-induced point defects and type II dislocation loops intentionally introduced in silicon via ion implantation. The type II dislocation loops were introduced via Si implants into (100) Si wafers at 50 keV to a dose ranging from 2×1015 to 1×1016/cm2. The subsequent furnace annealing at 900 °C was done for times between 30 min and 4 hr in either a dry oxygen or nitrogen ambient. Plan-view transmission electron microscopy (PTEM) was used to characterize the increase in atom concentration bound by dislocation loops as a result of oxidation. The results show type II dislocation loops can be used as point defect detector and they are efficient in measuring oxidation-induced point defects. It is also shown that the measured net interstitials flux trapped by dislocation loops is linearly proportional to the total supersaturation of interstitials as measured by oxidation enhanced diffusion (OED) studies.

Point Defect Detector Studies of Ge+ Implanted Silicon upon Oxidation

1992 ◽  
Vol 262 ◽  
Author(s):  
H. L. Meng ◽  
S. Prusstn ◽  
K. S. Jones
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Point Defect ◽  
Point Defects ◽  
Type Ii ◽  
Dislocation Loops ◽  
Furnace Annealing ◽  
Plan View ◽  
Atom Concentration ◽  
Transmission Electron

ABSTRACTPrevious results [1] have shown that type II (end-of-range) dislocation loops can be used as point defect detectors and are efficient in measuring oxidation induced point defects. This study investigates the interaction between oxidation-induced point defects and dislocation loops when Ge+ implantation was used to form the type II dislocation loops. The type II dislocation loops were introduced via Ge+ implants into <100> Si wafers at 100 keV to at doses ranging from 2×1015 to l×1016/cm2. The subsequent furnace annealing at 900 °C was done for times between 30 min and 4 hr in either a dry oxygen or nitrogen ambient. The change in atom concentration bound by dislocation loops as a result of oxidation was measured by plan-view transmission electron microscopy (PTEM). The results show that the oxidation rate for Ge implanted Si is similar to Si+ implanted Si. Upon oxidation a decrease in the interstitial injection was observed for the Ge implanted samples relative to the Si implanted samples. With increasing Ge+ dose the trapped atom concentration bound by the loops actually decreases upon oxidation relative to the inert ambient implying oxidation of Ge+ implanted silicon can result in either vacancy injection or the formation of an interstitial sink.

Type II Dislocation Loops and their Effect on Strain in Ion Implanted Silicon as Studied by High Resolution X-ray Diffraction

1995 ◽  
Vol 378 ◽  
Author(s):  
R. H. Thompson ◽  
V. Krishnamoorthy ◽  
J. Liu ◽  
K. S. Jones
Keyword(s):  
High Resolution ◽  
Type Ii ◽  
Dislocation Loops ◽  
X Ray Diffraction ◽  
Empirical Constant ◽  
Plan View ◽  
X Ray ◽  
Transmission Electron ◽  
Measured Strain ◽  
P Type

AbstractP-type (100) silicon wafers were implanted with 28Si+ ions at an energy of 50 keV and to doses of 1 × 1015, 5 × 1015 and 1 × 1016 cm−2, respectively, and annealed in a N2 ambient at temperatures ranging from 700°C to 1000°C for times ranging from 15 minutes to 16 hours. The resulting microstructure consisted of varying distributions of Type II end of range dislocation loops. The size distribution of these loops was quantified using plan-view transmission electron microscopy and the strain arising from these loops was investigated using high resolution x-ray diffraction. The measured strain values were found to be constant in the loop coarsening regime wherein the number of atoms bound by the loops remained a constant. Therefore, an empirical constant of 7.7 × 10−12 interstitial/ppm of strain was evaluated to relate the number of interstitials bound by these dislocation loops and the strain. This value was used successfully in estimating the number of interstitials bound by loops at the various doses studied provided the annealing conditions were such that the loop microstructure was in the coarsening or dissolution regime.

Defect Evolution from Low Energy, Amorphizing, Germanium Implants on Silicon

2001 ◽  
Vol 669 ◽  
Author(s):  
Andres F. Gutierrez ◽  
Kevin S. Jones ◽  
Daniel F. Downey
Keyword(s):  
Time Window ◽  
Low Energy ◽  
Dislocation Loops ◽  
Medium Energy ◽  
Evolutionary Pathway ◽  
Plan View ◽  
Enhanced Diffusion ◽  
Conventional Furnace ◽  
Transmission Electron ◽  
Defect Evolution

ABSTRACTPlan-view transmission electron microscopy (PTEM) was used to characterize defect evolution upon annealing of low-to-medium energy, 5-30 keV, germanium implants into silicon. The implant dose was 1 × 1015 ions/cm2, sufficient for surface amorphization. Annealing of the samples was done at 750 °C in nitrogen ambient by both rapid thermal annealing (RTA) and conventional furnace, and the time was varied from 10 seconds to 360 minutes. Results indicate that as the energy drops from 30 keV to 5 keV, an alternate path of excess interstitials evolution may exist. For higher implant energies, the interstitials evolve from clusters to {311}'s to loops as has been previously reported. However, as the energy drops to 5 keV, the interstitials evolve from clusters to small, unstable dislocation loops which dissolve and disappear within a narrow time window, with no {311}'s forming. These results imply there is an alternate evolutionary pathway for {311} dissolution during transient enhanced diffusion (TED) for these ultra-low energy implants.

Effect of the End of Range Loop Layer Depth on the Evolution of {311} Defects.

1998 ◽  
Vol 532 ◽  
Author(s):  
R. Raman ◽  
M. E. Law ◽  
V. Krishnamoorthy ◽  
K. S. Jones
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Experimental Investigation ◽  
Point Defects ◽  
Chemical Mechanical Polishing ◽  
Dislocation Loops ◽  
Layer Depth ◽  
Plan View ◽  
Projected Range ◽  
Transmission Electron

ABSTRACTThe interactions between end of range dislocation loops and {311} defects as a function of their proximity was studied. The dislocation loops were introduced at 2600 Å by a dual 1 × 1015 cm−2, 30 keV and a 1 × 1015 cm−2 , 120 keV Si+ implantation into Silicon followed by a anneal at 850 °C for 30 minutes. The depth of the loop layer from the surface was varied from 2600 Å to 1800 Å and 1000 Å by polishing off the Si surface using a chemical-mechanical polishing (CMP) technique. A post-CMP 1 × 1014 cm−2, 40 keV Si+ implantation was used to create point defects at the projected range of 580 Å. The wafers were annealed at 700, 800 and 900 °C and plan-view transmission electron microscopy (TEM) study was performed. It was found that the number of interstitials in {311} defects decreased as the projected range damage was brought closer to the loop layer, while the number of rectangular elongated defects (REDs) increased. Experimental investigation showed that REDs are formed at the end-of-range. It is concluded that the interstitials introduced at the projected range are trapped at the end-of-range dislocations. The REDs are formed due to the interactions between the interstitials and the pre-existing loops.

A Study of Loop Evolution During Inert Ambient Annealing and Reaction Between Point Defects and Dislocation Loops During Oxidation of Silicon

1994 ◽  
Vol 354 ◽  
Author(s):  
J. Liu ◽  
K. S. Jones
Keyword(s):  
Point Defects ◽  
Annealing Temperature ◽  
Arrhenius Plot ◽  
Type Ii ◽  
Dislocation Loops ◽  
Plan View ◽  
Annealing Behavior ◽  
Diffusion Limited ◽  
Rate Versus ◽  
Range Type

AbstractIn the first part of this work, a plan-view TEM study has been made of the time-dependent annealing behavior of end of range (type II) dislocation loops introduced by lxl015/cm2 50KeV Si+ implantation into silicon. The activation energy for loop growth was determined to be 1.0±0.2eV from the Arrhenius plot of loop growth rate versus the reciprocal of annealing temperature. In the second part of this study, a thin boron layer was used as a diffusion monitor. The number of injected interstitials as a result of oxidation was measured by TEM. The diffusivity of boron with and without the presence of loops was studied by fitting experimental SIMS profiles with FLOOPS simulations. The interaction between loops and interstitials was determined to be diffusion limited.

Study of dislocation loops in Arsenic-Rich as-grown GaAs

1987 ◽  
Vol 45 ◽  
pp. 350-351
Author(s):  
Byung-Teak Lee
Keyword(s):  
Point Defects ◽  
Electronic Devices ◽  
Arsenic Concentration ◽  
Stoichiometric Compound ◽  
Dislocation Loops ◽  
Gaas Crystal ◽  
Ion Milling ◽  
Transmission Electron ◽  
Arsenic Source ◽  
High Arsenic

Grown-in dislocations in GaAs have been a major obstacle in utilizing this material for the potential electronic devices. Although it has been proposed in many reports that supersaturation of point defects can generate dislocation loops in growing crystals and can be a main formation mechanism of grown-in dislocations, there are very few reports on either the observation or the structural analysis of the stoichiometry-generated loops. In this work, dislocation loops in an arsenic-rich GaAs crystal have been studied by transmission electron microscopy.The single crystal with high arsenic concentration was grown using the Horizontal Bridgman method. The arsenic source temperature during the crystal growth was about 630°C whereas 617±1°C is normally believed to be optimum one to grow a stoichiometric compound. Samples with various orientations were prepared either by chemical thinning or ion milling and examined in both a JEOL JEM 200CX and a Siemens Elmiskop 102.

Effects of Concurrent Co or Ti Silicidation on Transient Diffusion and End-of-Range Damage in Phosphorus Implanted Silicon

1992 ◽  
Vol 262 ◽  
Author(s):  
J.W. Honeycutt ◽  
J. Ravi ◽  
G. A. Rozgonyi
Keyword(s):  
Secondary Ion Mass Spectrometry ◽  
Complete Removal ◽  
Dislocation Loops ◽  
Enhanced Diffusion ◽  
Depth Profiles ◽  
Enhanced Dissolution ◽  
Implantation Damage ◽  
Transmission Electron ◽  
Defect Behavior ◽  
Secondary Ion

ABSTRACTThe effects of Ti and Co silicidation on P+ ion implantation damage in Si have been investigated. After silicidation of unannealed 40 keV, 2×1015 cm-2 P+ implanted junctions by rapid thermal annealing at 900°C for 10–300 seconds, secondary ion mass spectrometry depth profiles of phosphorus in suicided and non-silicided junctions were compared. While non-silicided and TiSi2 suicided junctions exhibited equal amounts of transient enhanced diffusion behavior, the junction depths under COSi2 were significantly shallower. End-of-range interstitial dislocation loops in the same suicided and non-silicided junctions were studied by planview transmission electron microscopy. The loops were found to be stable after 900°C, 5 minute annealing in non-silicided material, and their formation was only slightly effected by TiSi2 or COSi2 silicidation. However, enhanced dissolution of the loops was observed under both TiSi2 and COSi2, with essentially complete removal of the defects under COSi2 after 5 minutes at 900°C. The observed diffusion and defect behavior strongly suggest that implantation damage induced excess interstitial concentrations are significantly reduced by the formation and presence of COSi2, and to a lesser extent by TiSi2. The observed time-dependent defect removal under the suicide films suggests that vacancy injection and/or interstitial absorption by the suicide film continues long after the suicide chemical reaction is complete.

Solute Segregation and Dynamics of Solid-Phase Crystallization In in and Sb-Implanted Silicon

1981 ◽  
Vol 4 ◽  
Author(s):  
J. Narayan ◽  
G. L. Olson ◽  
O. W. Holland
Keyword(s):  
Laser Power ◽  
Solid Phase ◽  
Solute Segregation ◽  
Dislocation Loops ◽  
Solid Phase Crystallization ◽  
Time Resolved ◽  
Plan View ◽  
Ion Channeling ◽  
Retrograde Solubility ◽  
Transmission Electron

ABSTRACTTime-resolved-reflectivity measurements have been combined with transmission electron microscopy (cross-section and plan-view), Rutherford backscattering and ion channeling techniques to study the details of laser induced solid phase epitaxial growth in In+ and Sb+ implanted silicon in the temperature range from 725 to 1500 °K. The details of microstructures including the formation of polycrystals, precipitates, and dislocations have been correlated with the dynamics of crystallization. There were limits to the dopant concentrations which could be incorporated into substitutional lattice sites; these concentrations exceeded retrograde solubility limits by factors up to 70 in the case of the Si-In system. The coarsening of dislocation loops and the formation of a/2<110>, 90° dislocations in the underlying dislocation-loop bands are described as a function of laser power.

Effect of Self-Interstitial Diffusion Anisotropy in Electron-Irradiated Zirconium. A Cluster Dynamics Modeling

2005 ◽  
Vol 237-240 ◽  
pp. 659-664
Author(s):  
Frédéric Christien ◽  
Alain Barbu
Keyword(s):  
Point Defects ◽  
Thin Foil ◽  
Elastic Interaction ◽  
Dislocation Loops ◽  
Considerable Influence ◽  
Dynamics Modeling ◽  
Dynamics Model ◽  
Diffusion Anisotropy ◽  
Vacancy Loops ◽  
Transmission Electron

Irradiation of metals leads to the formation of point-defects (vacancies and selfinterstitials) that usually agglomerate in the form of dislocation loops. Due to the elastic interaction between SIA (self-interstitial atoms) and dislocations, the loops absorb in most cases more SIA than vacancies. That is why the loops observed by transmission electron microscopy are almost always interstitial in nature. Nevertheless, vacancy loops have been observed in zirconium following electron or neutron irradiation (see for example [1]). Some authors proposed that this unexpected behavior could be accounted for by SIA diffusion anisotropy [2]. Following the approach proposed by Woo [2], the cluster dynamics model presented in [3] that describes point defect agglomeration was extended to the case where SIA diffusion is anisotropic. The model was then applied to the loop microstructure evolution of a zirconium thin foil irradiated with electrons in a high-voltage microscope. The main result is that, due to anisotropic SIA diffusion, the crystallographic orientation of the foil has considerable influence on the nature (vacancy or interstitial) of the loops that form during irradiation.

scholarly journals Thermal Annealing of High Dose P Implantation in 4H-SiC

2019 ◽  
Vol 963 ◽  
pp. 399-402 ◽  
Author(s):  
Cristiano Calabretta ◽  
Massimo Zimbone ◽  
Eric G. Barbagiovanni ◽  
Simona Boninelli ◽  
Nicolò Piluso ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Raman Spectroscopy ◽  
Ion Implantation ◽  
Epitaxial Layer ◽  
Point Defects ◽  
High Dose ◽  
Double Step ◽  
Post Annealing ◽  
Transmission Electron

In this work, we have studied the crystal defectiveness and doping activation subsequent to ion implantation and post-annealing by using various techniques including photoluminescence (PL), Raman spectroscopy and transmission electron microscopy (TEM). The aim of this work was to test the effectiveness of double step annealing to reduce the density of point defects generated during the annealing of a P implanted 4H-SiC epitaxial layer. The outcome of this work evidences that neither the first 1 hour isochronal annealing at 1650 - 1700 - 1750 °C, nor the second one at 1500 °C for times between 4 hour and 14 hour were able to recover a satisfactory crystallinity of the sample and achieve dopant activations exceeding 1%.

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