The Elastic Moduli of Silver Thin Films Measured with a New Microtensile Tester

1991 ◽  
Vol 239 ◽  
Author(s):  
J. Ruud ◽  
D. Josell ◽  
A. L. Greer ◽  
F. Spaepen
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Diffraction Grating ◽  
Strain Measurement ◽  
Elastic Moduli ◽  
Two Dimensional ◽  
Bulk Crystals ◽  
Free Standing ◽  
Tensile Direction ◽  
Silver Thin Films

ABSTRACTA new design for a thin film microtensile tester is presented. The strain is measured directly on the free-standing thin film from the displacement of laser spots diffracted from a thin grating applied to its surface by photolithography. The diffraction grating is two-dimensional, allowing strain measurement both along and transverse to the tensile direction. In principle, both Young's modulus and Poisson's ratio of a thin film can be determined. Ag thin films with strong <111> texture were tested. The measured Young moduli agreed with those measured on bulk crystals, but the measured Poisson ratios were low, most likely due to slight transverse folding of the film that developed during the test.

scholarly journals A Direct Comparison of Three Buckling-Based Methods to Measure the Elastic Modulus of Nanobiocomposite Thin Films

2020 ◽  
Author(s):  
Taylor C. Stimpson ◽  
Daniel A. Osorio ◽  
Emily D. Cranston ◽  
Jose Moran-Mirabal
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Elastic Modulus ◽  
Elastic Moduli ◽  
Input Parameter ◽  
Layer By Layer ◽  
Free Standing ◽  
Film Composition ◽  
Parameter Values

<p>To engineer tunable thin film materials, accurate measurement of their mechanical properties is crucial. However, characterizing the elastic modulus with current methods is particularly challenging for sub-micrometer thick films and hygroscopic materials because they are highly sensitive to environmental conditions and most methods require free-standing films which are difficult to prepare. In this work, we directly compared three buckling-based methods to determine the elastic moduli of supported thin films: 1) biaxial thermal shrinking, 2) uniaxial thermal shrinking, and 3) the mechanically compressed, strain-induced elastic buckling instability for mechanical measurements (SIEBIMM) method. Nanobiocomposite model films composed of cellulose nanocrystals (CNCs) and polyethyleneimine (PEI) were assembled using layer-by-layer deposition to control composition and thickness. The three buckling-based methods yielded the same trends and comparable values for the elastic moduli of each CNC-PEI film composition (ranging from 15 – 44 GPa, depending on film composition). This suggests that the methods are similarly effective for the quantification of thin film mechanical properties. Increasing the CNC content in the films statistically increased the modulus, however, increasing the PEI content did not lead to significant changes. The standard deviation of elastic moduli determined from SIEBIMM was 2-4 times larger than for thermal shrinking, likely due to extensive cracking and partial film delamination. In light of these results, biaxial thermal shrinking is recommended as the method of choice because it affords the simplest implementation and analysis and is the least sensitive to small deviations in the input parameter values, such as film thickness or substrate modulus.</p>

scholarly journals A Direct Comparison of Three Buckling-Based Methods to Measure the Elastic Modulus of Nanobiocomposite Thin Films

2020 ◽  
Author(s):  
Taylor C. Stimpson ◽  
Daniel A. Osorio ◽  
Emily D. Cranston ◽  
Jose Moran-Mirabal
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Elastic Modulus ◽  
Elastic Moduli ◽  
Input Parameter ◽  
Layer By Layer ◽  
Free Standing ◽  
Film Composition ◽  
Parameter Values

<p>To engineer tunable thin film materials, accurate measurement of their mechanical properties is crucial. However, characterizing the elastic modulus with current methods is particularly challenging for sub-micrometer thick films and hygroscopic materials because they are highly sensitive to environmental conditions and most methods require free-standing films which are difficult to prepare. In this work, we directly compared three buckling-based methods to determine the elastic moduli of supported thin films: 1) biaxial thermal shrinking, 2) uniaxial thermal shrinking, and 3) the mechanically compressed, strain-induced elastic buckling instability for mechanical measurements (SIEBIMM) method. Nanobiocomposite model films composed of cellulose nanocrystals (CNCs) and polyethyleneimine (PEI) were assembled using layer-by-layer deposition to control composition and thickness. The three buckling-based methods yielded the same trends and comparable values for the elastic moduli of each CNC-PEI film composition (ranging from 15 – 44 GPa, depending on film composition). This suggests that the methods are similarly effective for the quantification of thin film mechanical properties. Increasing the CNC content in the films statistically increased the modulus, however, increasing the PEI content did not lead to significant changes. The standard deviation of elastic moduli determined from SIEBIMM was 2-4 times larger than for thermal shrinking, likely due to extensive cracking and partial film delamination. In light of these results, biaxial thermal shrinking is recommended as the method of choice because it affords the simplest implementation and analysis and is the least sensitive to small deviations in the input parameter values, such as film thickness or substrate modulus.</p>

Indentation Technique to Investigate Elastic Moduli of Thin Films on Substrates

1988 ◽  
Vol 130 ◽  
Author(s):  
D. S. Stone ◽  
T. W. Wu ◽  
P.-S. Alexopoulos ◽  
W. R. Lafontaine
Keyword(s):  
Thin Film ◽  
Experimental Data ◽  
Thin Films ◽  
Closed Form ◽  
Elastic Moduli ◽  
Depth Sensing ◽  
Indentation Technique ◽  
Average Displacement ◽  
Elasticity Solutions ◽  
Poor Adhesion

AbstractClosed-form elasticity solutions are introduced, that predict the average displacement beneath square and triangular, uniformly loaded areas at the surface of a bilayer. The solutions aid in the application of depth-sensing indentation techniques for measuring thin film elastic moduli. The elasticity solutions agree closely with experimental data of Al, Si, 1 μm Al on Si, and 2 μm Cr on Si. The case of poor adhesion between the film and substrate is briefly examined.

Preparation of a two-dimensional flexible MnO2/graphene thin film and its application in a supercapacitor

2016 ◽  
Vol 4 (27) ◽  
pp. 10618-10626 ◽  
Author(s):  
Zhimin Li ◽  
Yufeng An ◽  
Zhongai Hu ◽  
Ning An ◽  
Yadi Zhang ◽  
...  
Keyword(s):  
Thin Film ◽  
Spin Coating ◽  
Hydrothermal Process ◽  
Graphene Film ◽  
Two Dimensional ◽  
Supercapacitor Electrode ◽  
Free Standing

A novel two-dimensional (2D) free standing and flexible MnO2/graphene film (MGF) supercapacitor electrode is successfully fabricated by a spin-coating and hydrothermal process.

scholarly journals Tip-Based Nanomachining on Thin Films: A Mini Review

2021 ◽  
Author(s):  
Shunyu Chang ◽  
Yanquan Geng ◽  
Yongda Yan
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Data Storage ◽  
Three Dimensional ◽  
Maintenance Cost ◽  
Two Dimensional ◽  
Force Microscopy ◽  
Atomic Force ◽  
Current State ◽  
Two Dimensional Materials

AbstractAs one of the most widely used nanofabrication methods, the atomic force microscopy (AFM) tip-based nanomachining technique offers important advantages, including nanoscale manipulation accuracy, low maintenance cost, and flexible experimental operation. This technique has been applied to one-, two-, and even three-dimensional nanomachining patterns on thin films made of polymers, metals, and two-dimensional materials. These structures are widely used in the fields of nanooptics, nanoelectronics, data storage, super lubrication, and so forth. Moreover, they are believed to have a wide application in other fields, and their possible industrialization may be realized in the future. In this work, the current state of the research into the use of the AFM tip-based nanomachining method in thin-film machining is presented. First, the state of the structures machined on thin films is reviewed according to the type of thin-film materials (i.e., polymers, metals, and two-dimensional materials). Second, the related applications of tip-based nanomachining to film machining are presented. Finally, the current situation of this area and its potential development direction are discussed. This review is expected to enrich the understanding of the research status of the use of the tip-based nanomachining method in thin-film machining and ultimately broaden its application.

Free-standing membranes from the chemical exfoliation of mesoporous amorphous titania thin film

2021 ◽  
Author(s):  
Victor Malgras ◽  
Joel Henzie ◽  
Yoshitaka Matsushita ◽  
Yoshiyuki Sugahara ◽  
Yusuke Yamauchi
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Free Standing ◽  
Amorphous Titania ◽  
Titania Thin Film ◽  
Chemical Exfoliation

Thin films are typically bound to their substrate, limiting their integration on rough, porous, curved or chemically/thermally sensitive surfaces. Instead of employing tedious and expensive back-etching processes, certain chemical routes...

Monolayer graphene-supported free-standing PS-b-PMMA thin film with perpendicularly orientated microdomains

RSC Advances ◽  
2014 ◽  
Vol 4 (109) ◽  
pp. 63941-63945 ◽  
Author(s):  
Mei-Ling Wu ◽  
Jing Li ◽  
Li-Jun Wan ◽  
Dong Wang
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Monolayer Graphene ◽  
Free Standing

A facile way to fabricate robust free-standing PS-b-PMMA thin films with perpendicularly orientated microdomains on monolayer graphene is reported.

A Novel Technique to Determine Elastic Constants of Thin Films

2008 ◽  
Vol 1139 ◽  
Author(s):  
Klaus Martinschitz ◽  
Rostislav Daniel ◽  
Christian Mitterer ◽  
Keckes Jozef
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Elastic Moduli ◽  
Elastic Anisotropy ◽  
Interaction Model ◽  
X Ray Diffraction ◽  
X Ray ◽  
Anisotropic Factor ◽  
Polycrystalline Thin Films ◽  
Cu Thin Film

AbstractA new X-ray diffraction technique to determine elastic moduli of polycrystalline thin films deposited on monocrystalline substrates is demonstrated. The technique is based on the combination of sin2ψ and X-ray diffraction wafer curvature techniques which are used to characterize X-ray elastic strains and macroscopic stress in thin film. The strain measurements must be performed for various hkl reflections. The stresses are determined from the substrate curvature applying the Stoney's equation. The stress and strain values are used to calculate hkl reflection dependent X-ray elastic moduli. The mechanical elastic moduli can be then extrapolated from X-ray elastic moduli considering film macroscopic elastic anisotropy. The derived approach shows for which reflection and corresponding value of the X-ray anisotropic factor Γ the X-ray elastic moduli are equal to their mechanical counterparts in the case of fibre textured cubic polycrystalline aggregates. The approach is independent of the crystal elastic anisotropy and depends on the fibre texture type, the texture sharpness, the amount of randomly oriented crystallites and on the supposed grain interaction model. The new method is demonstrated on a fiber textured Cu thin film deposited on monocrystalline Si(100) substrate. The advantage of the new technique remains in the fact that moduli are determined non-destructively, using a static diffraction experiment and represent volume averaged quantities.

Quantitative Adhesion Measures of Diamond Films Using A Blister Test

2007 ◽  
Vol 329 ◽  
pp. 551-556
Author(s):  
Xiao Gang Jian ◽  
L.D. Shi ◽  
Ming Chen ◽  
Fang Hong Sun
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Adhesive Strength ◽  
Diamond Films ◽  
Free Standing ◽  
Adhesion Properties ◽  
Blister Test ◽  
Diamond Thin Film ◽  
Diamond Thin Films ◽  
Micrometer Scale

Adhesion properties of diamond thin films are essential to their performance in technical applications. To obtain the adhesive strength precisely and quantitatively has been the frontier issue to the related scientists and engineers. In this paper, a new experimental equipment for blister tests was designed purposely and fabricated considering related influencing facts. A free-standing window of diamond thin film with the support of silicon wafer was obtained by the aid of photolithography and anisotropic wet etching technology so as to improve the precision of quantitative adhesion measures of diamond films. The mechanics for calculating the quantitative driving force of blister-induced delamination of diamond thin film is presented, which is on base of intensive modeling and simulation. The laser interferometer measurement with fine solution was used to pick up dynamic signals of diamond thin film bulge deformation in micrometer scale and the relationship demonstration of stress to strain of the diamond thin film was available, as a consequence, the adhesive strength could be obtained precisely and quantitatively by the valid model. The paper confirms the accessibility to precise quantitative adhesion measures of diamond films and the results will be beneficial to wide application of diamond thin films in the related fields.

TRANSPORT PROPERTIES OF ELECTRON-DOPED La2−xCexCuO4 THIN FILM IN THE UNDER-DOPED REGION

2007 ◽  
Vol 21 (18n19) ◽  
pp. 3258-3261
Author(s):  
J. YUAN ◽  
H. WU ◽  
L. ZHAO ◽  
K. JIN ◽  
B. XU ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Transport Properties ◽  
Fermi Liquid ◽  
Kondo Effect ◽  
Two Dimensional ◽  
Optimal Doping ◽  
Semiconductor Behavior ◽  
Liquid Behavior ◽  
Fermi Liquid Behavior

Underdoped electron-doped La 2-x Ce x CuO 4 ( x =0.06-0.09) thin films were successfully grown and investigated for the transport properties in ab-plane. It was found that the in-plane resistivity ρab shows a semiconductor behavior when x =0.06, with increasing the Ce concentration to the optimal doping level, it changes to the two dimensional Fermi-liquid behavior. In the films with x≥0.08, a Kondo effect like scattering is observed in the low temperature range.

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