An Overview of Multichip Module Technology for low Power Applications

1992 ◽  
Vol 264 ◽  
Author(s):  
Chung W. Ho ◽  
Sharon McAfee-Hunter

AbstractThin-film multichip modules (i.e. MCM-D) can provide simple, low-cost packaging and interconnect options for interconnecting high-density, high-performance devices. The following is an overview of an MCM-D technology that can be implemented on top of several substrate materials. Tradeoffs will be discussed related to using different substrate materials and the corresponding implications from the assembly point of view. The MCM-D manufacturing process is reviewed and the subsequent reliability results are discussed.

1992 ◽  
Vol 114 (2) ◽  
pp. 226-233 ◽  
Author(s):  
H. K. Charles

Multichip modules are rapidly becoming a major thrust in electronic packaging technology. Because of the high density and high performance nature of the electronic devices packaged in multichip modules, stringent new demands are being placed on materials, interconnect, and packaging structures. A systematic review of the materials and material structures for multichip modules is presented along with their associated physical and electronic properties. Particular emphasis is placed on new materials and their potential impact on multichip module packaging. Examples of their use in the fabrication of multichip modules and advanced chip-on-board systems are described.


2018 ◽  
Vol 42 (16) ◽  
pp. 13382-13392 ◽  
Author(s):  
Ke Zheng ◽  
Shaoqi Zhou ◽  
Xuan Zhou

The incorporation of the PVB significantly improved the performance of the PVB/PVC substrates based thin-film composite forward osmosis membrane.


2020 ◽  
Vol 2 (1) ◽  
pp. 368-376 ◽  
Author(s):  
Nan Chen ◽  
Michael R. Scimeca ◽  
Shlok J. Paul ◽  
Shihab B. Hafiz ◽  
Ze Yang ◽  
...  

A high-performance n-type thermoelectric Ag2Se thin film via cation exchange using a low-cost solution processed Cu2Se template.


2017 ◽  
Vol 7 (1) ◽  
Author(s):  
Tsung-Ta Wu ◽  
Wen-Hsien Huang ◽  
Chih-Chao Yang ◽  
Hung-Chun Chen ◽  
Tung-Ying Hsieh ◽  
...  

2016 ◽  
Vol 4 (20) ◽  
pp. 4478-4484 ◽  
Author(s):  
Ao Liu ◽  
Guoxia Liu ◽  
Huihui Zhu ◽  
Byoungchul Shin ◽  
Elvira Fortunato ◽  
...  

Eco-friendly IWO thin films are fabricated via a low-cost solution process and employed as channel layers in thin-film transistors.


1999 ◽  
Vol 54 (3) ◽  
pp. 202-209 ◽  
Author(s):  
G.S. Korotchenkov ◽  
S.V. Dmitriev ◽  
V.I. Brynzari

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