Study of the Thermal Stability of the Schottky Contacts on GaInP Grown by LP-MOCVD

1992 ◽  
Vol 282 ◽  
Author(s):  
Edward Y. Chang ◽  
Yeong-Lin Lai ◽  
Kuen-Chyuan Lin ◽  
Chun-Yen Chang ◽  
F. Y. Juang
Keyword(s):  
Thermal Stability ◽  
Single Layer ◽  
Schottky Contacts ◽  
Metal Contacts ◽  
Barrier Heights ◽  
Annealing Conditions ◽  
Metal Silicides ◽  
Lattice Matched ◽  
Thermal Stability Of ◽  
Selection Of

ABSTRACTThermal stability of the Schottky contacts on Ga0.51In0.49P has been made. The Ga0.51In0.49P epitaxial layer was successfully grown on the GaAs substrate by LP-MOCVD to form a lattice-matched heterostructure. In this paper, materials aspects of the Ga0.51In0.49P layers were characterized and thermal stability of three different types of films, including single-layer metal (Pt, Ni, Pd, Au, Co, Mo, W, Cr, Ti, Al, Ta, and In), metal silicides (WSi2, W5Si3, PtSi, and Pt2i), and TiW nitrides (TiWNx ) as the Schottky contacts materials on Ga0.51In0.49P were studied. Due to the high bandgap nature of Ga0.51In0.49P, the Schottky contacts on Ga0.51In0.49P demonstrate good characteristics. The barrier heights range from 0.79 to 1.19 eV depending on the selection of the materials and the annealing conditions. For single-metal contacts, Pt film shows the best thermal stability, the barrier height of 1.09 eV and the ideality factor of 1.06 were obtained for the Pt Schottky diode with furnace annealing at 500 °C for 30 min. For refractory compound films, the TiWNx film shows the best thermal stability. The TiWNx Schottky contacts demonstrate excellent electrical as well as physical characteristics, even after high temperature annealing at 850°C.

The Study of TiWN Schottky Contacts on n-Ga0.51 In0.49P

1993 ◽  
Vol 300 ◽  
Author(s):  
Edward Y. Chang ◽  
Yeong-Lin Lai ◽  
Kuen-Chyuan Lin ◽  
Chun-Yen Chang ◽  
F. Y. Juang
Keyword(s):  
Schottky Contact ◽  
Rf Magnetron Sputtering ◽  
Schottky Contacts ◽  
Electrical Characteristics ◽  
X Ray Diffraction ◽  
Barrier Heights ◽  
Annealing Conditions ◽  
Transmission Electron ◽  
Lattice Matched ◽  
Thermal Stability Of

ABSTRACTThe first study of the TiW nitrides (TiWNx) as the Schottky contact metals to the n type Ga0.51In0 49P has been made. The Ga0.51 In0.49P epitaxial layer was successfully grown on the GaAs substrate by LP-MOCVD to form a lattice-matched heterostructure. The RF-magnetron sputtering system was utilized for the nitride deposition. The thermal stability of the nitride films were studied using rapid thermal annealing (RTA) method. Both the electrical characteristics and the materials characteristics were investigated. The materials properties of the nitride films were characterized by X-ray diffraction (XRD), Transmission electron microscopy (TEM), and Auger electron spectroscopy (AES). The TiWNx Schottky contacts demonstrate excellent electrical and physical characteristics, even after high temperature annealing. The barrier heights range from 0.81 to 1.05 eV depending on the content of the nitrogen and the annealing conditions. The XRD and AES results show no indication of interaction at the TiWNX/GaInP interface of both as-deposited and annealed samples. The outstanding characteristics of the contact were attributed to the high bandgap nature of the Ga0.51In0.49P and the incorporation of nitrogen into the TiW films.

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

Metal Contacts on a-GaN

1996 ◽  
Vol 1 ◽  
Author(s):  
T. U. Kampen ◽  
W. Mönch
Keyword(s):  
Tight Binding ◽  
Image Force ◽  
Schottky Contacts ◽  
Metal Contacts ◽  
Zero Bias ◽  
Barrier Heights ◽  
Current Voltage ◽  
Optical Dielectric Constant ◽  
Optical Dielectric ◽  
Gap States

The Schottky barrier heights of silver and lead contacts on n-type GaN (0001) epilayers were determined from current-voltage characteristics. The zero-bias barrier heights and the ideality factors were found to be linearly correlated. Similar observations were previously reported for metal contacts on Si (111) and GaAs (110) surfaces. The barrier heights of ideal Schottky contacts are characterized by image force lowering of the barrier only. This gives an ideality factor of 1.01. From our data we obtain barrier heights of 0.82 eV and 0.73eV for ideal Ag and Pb contacts on GaN, respectively. The metal-induced gap states (MIGS) model predicts the barrier heights of ideal Schottky contacts on a given semiconductor to be linearly correlated with the electronegativities of the metals. The two important parameters of this MIGS-and-electronegativity model are the charge neutrality level (CNL) of the MIGS and a slope parameter. The CNL may be calculated from the dielectric band gap and using the empirical tight-binding method. The slope parameters are given by the optical dielectric constant of the respective semiconductor. The predictions of the MIGS model for metal/GaN contacts are confirmed by the results presented here and by barrier heights previously reported by others for Au, Ti, Pt, and Pd contacts on GaN.

Investigation of Dependence between Thermal Stability for Nano-Dispersed Metals and Velocity of Flame Spreading and Time Storage

2014 ◽  
Vol 682 ◽  
pp. 357-362 ◽  
Author(s):  
Yulia A. Amelkovich ◽  
Olga B. Nazarenko ◽  
Alexander I. Sechin ◽  
Kristina O. Fraynova
Keyword(s):  
Thermal Stability ◽  
Storage Time ◽  
Electrical Explosion ◽  
Metal Powders ◽  
Flame Spreading ◽  
Long Time ◽  
Thermal Stability Of ◽  
Time Lead ◽  
Selection Of ◽  
Copper Nanopowders

Thermal stability of aluminum, iron and copper nanopowders, produced by electrical explosion of wire during heating in the air, was investigated in the work. Thermal analysis method was used for control of thermal stability for nanodispersed metals in heating in the air. It was shown, that after a long time of storage in air electrical explosion metal nanopowders have had extra active ones. Estimation of velocity of flame spreading in poured layer of the powders was carried out. Quality changes in investigated samples, happened for storage time, lead to increase of flame front length and its line velocity. The results of the researches could be used for diagnostics of fire danger of nanodispersed metals, also for selection of working regimes and provision of fire explosion safety for technologies which produce and apply of nanodispersed metal powders. Time-factor have not effected on criteria concerning the danger of the loads and have not changed its marking.

Thermal Stability of Pd Schottky Contacts to p-Type 6H-SiC

2003 ◽  
Vol 433-436 ◽  
pp. 681-684 ◽  
Author(s):  
M.E. Samiji ◽  
A.M. Venter ◽  
A.W.R. Leitch
Keyword(s):  
Thermal Stability ◽  
Schottky Contacts ◽  
P Type ◽  
Thermal Stability Of

scholarly journals Thermal Stability Study of Oxygen Implanted Algaas/Gaas Single Quantum Well Structures Using PhotoreflectancE

1994 ◽  
Vol 354 ◽  
Author(s):  
P J Hughes ◽  
E H Li ◽  
B L Weiss ◽  
H E Jackson ◽  
J S Roberts
Keyword(s):  
Thermal Stability ◽  
Quantum Well ◽  
Room Temperature ◽  
Low Dose ◽  
Stability Study ◽  
Single Quantum ◽  
Single Quantum Well ◽  
Quantum Well Structures ◽  
Annealing Conditions ◽  
Thermal Stability Of

AbstractThe effects of interdiffusion on the band structure of two MxGaUxAs/GaAs single quantum well (SQW) structures were studied using room temperature photoreflectance. Rapid thermal annealing of the SQW structures at temperatures of 800°C, 900°C and 1000°C for times up to 180 seconds resulted in limited interdiffusion. Low dose (1014 cm”2) oxygen implantation reduced the thermal stability of these structures where the extent of the interdiffusion was found to be greater for the implanted samples for identical annealing conditions.

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