Surface Topography of Cocondensed Amorphous ZrCo-Alloy Films Investigated in Situ By UHV-STM

1994 ◽  
Vol 355 ◽  
Author(s):  
B. Reinker ◽  
M. Moske ◽  
H. Geisler ◽  
K. Samwer
1996 ◽  
Vol 275 (1-2) ◽  
pp. 240-243 ◽  
Author(s):  
B. Reinker ◽  
H. Geisler ◽  
M. Moske ◽  
K. Samwer

1992 ◽  
Vol 260 ◽  
Author(s):  
A. G. Dirks ◽  
R. A. M. Wolters ◽  
A. E. M. De Veirman

ABSTRACTTungsten-rich W-Ti (or W-Ti-N) alloy films are known for their applicability as diffusion barriers in advanced silicon technology, especially in the case of aluminium-based metallizations. For a wide variety of deposition conditions and post-deposition anneal treatments these refractory-metal barriers show a columnar microstructure. In contact with aluminium the W-Ti films do not form absolute barriers, because of mutual diffusion resulting in compound formation. The reactivity of the W-Ti barriers with the Al99Si1 interconnect has been studied by in-situ resistance measurements in vacuum at temperatures of approximately 450 °C (for W-Ti alloy films) and 475 °C (for W-Ti-N alloy films). In this paper new results dealing with the relationship between deposition conditions, microstructure and barrier properties will be discussed. Furthermore, it will be shown that the actual distribution of the titanium atoms in the tungsten matrix has a substantial influence on the reactivity of the barrier film with the Al99Si1 interconnect.


Sensors ◽  
2019 ◽  
Vol 19 (5) ◽  
pp. 1012 ◽  
Author(s):  
Zbigniew Muszyński ◽  
Marek Wyjadłowski

This article presents in situ research on the side surface of continuous flight auger (CFA) foundation piles using a three-dimensional (3D) laser scanner (Leica ScanStation C10) in order to evaluate the morphology assessment of pile concrete surfaces in various geotechnical layers. Terrestrial laser scanning describes the 3D geometry of the construction with high spatial resolution and accuracy. A total of six areas were selected from the acquired point cloud for which a two-step approach for removing the form was applied. In the first step, the reference surface was fitted using the least squares method, and then, cylindrical projection of the surface was performed. In the second step, an operator of removal of the multi-plane form was applied. For each sample, height parameters (Sq, Ssk, Sku, Sp, Sv, Sz, Sa) and functional volume parameters (Vmp, Vmc, Vvc, Vvv) according to the standard ISO 25178-2:2012 were determined. Significant differences in the values of surface height and functional volume parameters were observed for each geotechnical layer where piles were formed. Because the piles remain embedded in the ground, in situ tests of the side surface of piles are rarely performed and taken into account in the assessment of pile bearing capacity. The study of surface topography is a crucial stage in the assessment of the shear strength at the interface between a concrete pile and the soil layer. The obtained concrete morphology assessments are applicable during the determination of the skin friction factor in the analytical or numerical estimation of pile shaft resistance. The proposed procedure of morphology evaluation may improve the fidelity of the assumed friction factor between the concrete and soil and increase the reliability of direct shear experiments.


1989 ◽  
Vol 136 (10) ◽  
pp. 3088-3094 ◽  
Author(s):  
A. J. Pidduck ◽  
D. J. Robbins ◽  
D. B. Gasson ◽  
C. Pickering ◽  
J. L. Glasper

2012 ◽  
Vol 57 (6) ◽  
pp. 849-855 ◽  
Author(s):  
M. M. Kolendovskii ◽  
S. I. Bogatyrenko ◽  
A. P. Kryshtal ◽  
N. T. Gladkikh

1991 ◽  
Vol 225 ◽  
Author(s):  
C. Y. Chang ◽  
R. W. Vook

ABSTRACTIn-situ transmission electron microscope (TEM) electromigration damage (EMD) tests were performed on pure Al films which were thermally evaporated onto oxidized silicon wafers under different deposition conditions. Three different aluminum alloy films, Al-2wt%Cu, Al-8wt%Cu, and Al-2wt%Cu-lwt%Si were also examined. TEM images were recorded photographically and by a video camcorder. The sample stripes were stressed by a high DC current density (≈1.5 MA/cm2). A linear temperature ramp (5°C/min) was supplied by an external, computer controlled heater. The morphology of EMD-induced voids was found to be strongly dependent on microstructure. In small grain size Al stripes, EMD occurred by the formation of void “fingers” which propagated in an almost random manner. In large grain size Al and Al alloy stripes, the EMD-elongated voids propagated approximately parallel to each other and along the field direction. They were preceded with clearly identifiable local thinning. The thinned regions often had crystallographic edges. Contrary to the commonly held belief that EMD occurs only by a grain boundary diffusion mechanism, the present study clearly shows that surface or interface diffusion was the dominant, latter stage EMD failure mode in large grain size films.


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