Copper Diffusion Into Aluminum-Silicon Metallizations by Accelerated Thermal and Electrical Stressing
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AbstractPatterned 930 nm Al(1%-Si) interconnects over 147 nm of Cu were electromigration lifetime tested at 1.0–1.5 × 105 A/cm2 at 250 °C. The morphology of the surfaces of the electromigrated stripes with different line widths and times to failure were characterized by atomic force microscopy, and changes in surface roughness were compared. The diffusion of copper into the electromigrated aluminum stripes was determined by depth profiling using Auger electron spectroscopy. In particular, areas where hillocks formed were examined and compared to areas of median roughness.
2018 ◽
Vol 343
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pp. 012006
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1998 ◽
Vol 16
(1)
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pp. 137
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1999 ◽
Vol 142
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pp. 591-597
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2017 ◽
Vol 29
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pp. 201-208
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