Low-Temperature Crystallization of Amorphous Silicon Thin Films by Microwave Heating

1997 ◽  
Vol 471 ◽  
Author(s):  
Jeong No Lee ◽  
Yoon Chang Kim ◽  
Yong Woo Choi ◽  
Byung Tae Ahn
Keyword(s):  
Amorphous Silicon ◽  
Microwave Heating ◽  
Solid Phase ◽  
Silicon Film ◽  
Structural Disorder ◽  
Silicon Films ◽  
Silicon Thin Films ◽  
Conventional Furnace ◽  
Si Films ◽  
Temperature Crystallization

ABSTRACTMicrowave heating was utilized for the first time for solid phase crystallization of amorphous silicon films. Microwave heating lowered annealing temperature and reduced the annealing time for complete crystallization. For example, the amorphous silicon film deposited at 400 °C was fully crystallized in 3 h at 550 °C below which glass is available as a substrate. On microwave heating, the hydrogen in the amorphous films diffused out very quickly, but there was no change in structural disorder following hydrogen evolution. The lower temperature crystallization of a-Si films compared to conventional furnace annealing is due to the interaction between microwave and silicon atoms. The grain size of the crystallized silicon films was in the range of 0.55 to 0.78 μm, depending on the deposition temperature. These grain sizes are not so small comparing those of Si films by conventional furnace heating, while the crystallization processing time is much shorter.

Crystallization of Amorphous Silicon Thin Films by Microwave Heating

2014 ◽  
Vol 1666 ◽  
Author(s):  
Tomohiko Nakamura ◽  
Shinya Yoshidomi ◽  
Masahiko Hasumi ◽  
Toshiyuki Sameshima ◽  
Tomohisa Mizuno
Keyword(s):  
Thin Films ◽  
Heat Treatment ◽  
Amorphous Silicon ◽  
Microwave Heating ◽  
Volume Ratio ◽  
Heated Sample ◽  
Silicon Thin Films ◽  
Scattering Spectra ◽  
Raman Scattering Spectra ◽  
Si Films

ABSTRACTWe report crystallization of amorphous silicon (a-Si) thin films and improvement of thin film transistors (TFTs) characteristics using 2.45 GHz microwave heating assisted with carbon powders. Undoped 50-nm-thick a-Si films were formed on quartz substrates and heated by microwave irradiation for 2, 3, and 4 min. Raman scattering spectra revealed that the crystalline volume ratio increased to 0.42 for the 4-min heated sample. The dark and photo electrical conductivities measured by Air mass 1.5 at 100 mW/cm2 were 2.6x10-6 and 5.2x10-6 S/cm in the case of 4-min microwave heating followed by 1.3x106-Pa-H2O vapor heat treatment at 260°C for 3 h. N channel polycrystalline silicon TFTs characteristics were improved by the combination of microwave heating with high-pressure H2O vapor heat treatment. The threshold voltage decreased from 5.3 to 4.2 V and the effective carrier mobility increased from 18 to 25 cm2/Vs.

Crystallization of Tin-Implanted Amorphous Silicon Thin Films

1992 ◽  
Vol 279 ◽  
Author(s):  
Fuyu Lin ◽  
Miltiadis K. Hatalis
Keyword(s):  
Amorphous Silicon ◽  
Crystallization Process ◽  
Silicon Films ◽  
Grain Structure ◽  
Crystallization Time ◽  
Silicon Thin Films ◽  
Fine Grain ◽  
Annealing Conditions ◽  
Transmission Electron ◽  
Si Films

ABSTRACTThe crystallization of Sn-implanted amorphous silicon was studied as a function of tin implant dose and annealing conditions by transmission electron microscopy. The films were implanted at an energy of 110 keV with a dose in the range of 5 × 1014 to 5×1016 cm−2 and were annealed at a temperature in the range of 450°C to 550°C. An enhanced rate of crystallization in amorphous Si-Sn films compared to the non-implanted amorphous silicon films during thermal annealing was observed. The crystallization process of Si films implanted with tin at a dose of 2.5×1016 cm−2 or less is very similar to unimplanted silicon films except higher nucleation rates and shorter crystallization time were observed with increasing tin dose. Films implanted with tin at a dose of 2.5×1016 cm−2 or more display extremely rapid crystallization (3 hours at 450°C) and very fine grain structure (10 nm); no substantial grain growth has been observed during lurther annealing, but some single crystal-like areas were formed. In-situ annealing of silicon implanted to 5×1016 cm−2 showed that the crystallization process is enhanced by the formation of the liquid tin phase.

Ni-Induced Selective Nucleation and Solid Phase Epitaxy of Large-Grained Poly-Si on Glass

1999 ◽  
Vol 587 ◽  
Author(s):  
Rosaria A. Puglisi ◽  
Hiroshi Tanabe ◽  
Claudine M. Chen ◽  
Harry A. Atwater ◽  
Emanuele Rimini
Keyword(s):  
Amorphous Silicon ◽  
Polycrystalline Silicon ◽  
Crystalline Silicon ◽  
Solid Phase ◽  
Silicon Film ◽  
Crystallization Rate ◽  
Silicon Films ◽  
Solid Phase Epitaxy ◽  
Tem Analysis ◽  
Glass Substrates

AbstractWe investigated the formation of large-grain polycrystalline silicon films on glass substrates for application in low-cost thin film crystalline silicon solar cells. Since use of glass substrates constrains process temperatures, our approach to form large-grain polycrystalline silicon templates is selective nucleation and solid phase epitaxy (SNSPE). In this process, selective crystallization of an initially amorphous silicon film, at lithographically predetermined sites, enables grain sizes larger than those observed via random crystallization. Selective heterogeneous nucleation centers were created on undoped, 75 nm thick, amorphous silicon films, by masked implantation of Ni islands, followed by annealing at temperatures below 600 °. At this temperature, the Ni precipitates into NiSi2 particles that catalyze the transition from the amorphous to the crystalline Si phase. Seeded crystallization begins at the metal islands and continues via lateral solid phase epitaxy (SPE), thus obtaining crystallized regions of several tens of square microns in one hour. We have studied the dependence of the crystallization rate on the Ni-implanted dose in the seed, in the 5×1015/cm3 - 1016/cm3range. The large grained polycrystalline Si films were then used as a substrate for molecular beam epitaxy (MBE) depositions of 1 [.proportional]m thick Si layers. Transmission electron microscopy (TEM) analysis showed a strong correlation between the substrate morphology and the deposited layer. The layer presented a large grain morphology, with sizes of about 4 [.proportional]m.

Determination of Hydrogen Density of States in Amorphous Silicon Using Fractional Evolution Experiments

1997 ◽  
Vol 467 ◽  
Author(s):  
A. J. Franz ◽  
W. B. Jackson ◽  
J. L. Gland
Keyword(s):  
Amorphous Silicon ◽  
Density Of States ◽  
Silicon Film ◽  
Mean Field ◽  
Frequency Factor ◽  
Silicon Films ◽  
Hydrogen Density ◽  
Heating And Cooling ◽  
Novel Method

ABSTRACTHydrogen plays an important role in the electronic behavior, structure and stability of amorphous silicon films. Therefore, determination of the hydrogen density of states (DOS) and correlation of the hydrogen DOS with the electronic film properties are important research goals. We have developed a novel method for determination of hydrogen DOS in silicon films, based on fractional evolution experiments. Fractional evolution experiments are performed by subjecting a silicon film to a series of linear, alternating heating and cooling ramps, while monitoring the hydrogen evolution rate. The fractional evolution data can be analyzed using two complementary memods, the fixed frequency factor approach and Arrhenius analysis. Using a rigorous, mean-field evolution model, we demonstrate the applicability of the two approaches to obtaining the hydrogen DOS in silicon films. We further validate both methods by analyzing experimental fractional evolution data foran amorphous silicon carbide film. Both types of analysis yield a similar double peaked density of states for the a-Si:C:H:D film.

Amorphous Silicon Crystallization For Tft Applications

1993 ◽  
Vol 321 ◽  
Author(s):  
J. Yi ◽  
R. Wallace ◽  
N. Sridhar ◽  
D. D. L. Chung ◽  
W. A. Anderson
Keyword(s):  
Thin Film ◽  
Amorphous Silicon ◽  
Leakage Current ◽  
Excimer Laser ◽  
Delay Time ◽  
Solid Phase ◽  
Laser Energy ◽  
Silicon Film ◽  
Rapid Thermal Anneal ◽  
Laser Anneal

ABSTRACTThin film hydrogenated Amorphous silicon (a-Si:H) was deposited on Molybdenum (Mo) substrates by d.c. glow discharge. We investigated the a-Si:H crystallization using four anneal techniques; nitrogen atmosphere furnace, vacuum, rapid thermal anneal (RTA), and excimer laser anneal. Anneal temperature ranged from 100 to 1200 °C. Excimer laser energy per pulse ranged from 90 to 340 M.J. Transmission electron Microscopy (TEM) revealed microstructure of crystallized Si film with grain size over 0.5 μm. X-ray diffraction (XRD) and Raman spectroscopy were employed to determine the degree of crystallization. The a-Si:H started to crystallize at temperatures over 600 °C. An 850 °C anneal reduced film resistivity to 10s (ω-cm) for intrinsic and 1 (ω-cm) for n-type. Coplanar type thin film transistors (TFT) with gate channel length of 25 μm and width of 220 μm were fabricated with various insulating layers; if sputtered SiO2, Si3N4, BaTiO3, MgO, and evaporated SiO. The first two exhibited the least leakage current. The as-grown intrinsic a-Si:H field effect mobility was around 0.03 (cmVV.s) and delay time was 5×10−7 s. The solid phase crystallized silicon film exhibited high leakage current. The delay time of an excimer laser anneal treated TFT was reduced to 2.5×10−7 s. Crystallized Si film mobility was improved to 15 (cm2 /V.s).

scholarly journals Characterization of Defects and Stress in Polycrystalline Silicon Thin Films on Glass Substrates by Raman Microscopy

2011 ◽  
Vol 2011 ◽  
pp. 1-14 ◽  
Author(s):  
Kuninori Kitahara ◽  
Toshitomo Ishii ◽  
Junki Suzuki ◽  
Takuro Bessyo ◽  
Naoki Watanabe
Keyword(s):  
Grain Boundaries ◽  
Polycrystalline Silicon ◽  
Solid Phase ◽  
Raman Microscopy ◽  
Laser Crystallization ◽  
Local Vibration ◽  
Optical Phonon Mode ◽  
Glass Substrates ◽  
Silicon Thin Films ◽  
Si Films

Raman microscopy was applied to characterize polycrystalline silicon (poly-Si) on glass substrates for application as thin-film transistors (TFTs) integrated on electronic display panels. This study examines the crystallographic defects and stress in poly-Si films grown by industrial techniques: solid phase crystallization and excimer laser crystallization (ELC). To distinguish the effects of defects and stress on the optical-phonon mode of the Si–Si bond, a semiempirical analysis was performed. The analysis was compared with defect images obtained through electron microscopy and atomic force microscopy. It was found that the Raman intensity for the ELC film is remarkably enhanced by the hillocks and ridges located around grain boundaries, which indicates that Raman spectra mainly reflect the situation around grain boundaries. A combination of the hydrogenation of films and the observation of the Si-hydrogen local-vibration mode is useful to support the analysis on the defects. Raman microscopy is also effective for detecting the plasma-induced damage suffered during device processing and characterizing the performance of Si layer in TFTs.

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