Applications of High Resolution Immersion Lens Scanning Electron Microscopes to Sem-Based Defect Review at 250nm Design Rules

1998 ◽  
Vol 523 ◽  
Author(s):  
B. Tracy
Keyword(s):  
High Performance ◽  
Low Voltage ◽  
Semiconductor Industry ◽  
Image Resolution ◽  
Objective Lens ◽  
Dramatic Improvement ◽  
Design Rules ◽  
Electron Microscopes ◽  
Routine Observation ◽  
Scanning Electron

IntroductionThe use of SEM-based defect review tools has increased dramatically over the past five years as the semiconductor industry moved from 0.7 micron to 0.25 micron design rules. During this period, a dramatic inflection occurred at the 0.5 micron node; optical microscopy lacked sufficient resolution to determine even if a simple etch step was properly performed. Accordingly, many “inspection SEMs” were introduced into the wafer fabrication facility. With ever increasing focus on yield improvement, defect review SEM's proliferated in the fab in an effort to drive down both baseline defects and process excursions. In order for such an effort to be successful, a clear improvement in the low voltage image resolution performance of the scanning electron microscope was required. Commercial vendors have responded with impressive tools achieving image resolutions of 2.5–4nm @1 kV. At this level of performance, routine observation of semiconductor wafers is possible at 100,000X magnification. This dramatic improvement in resolution is the result of many factors, by far the biggest of which is the use of “immersion lens” designs which employ a strongly excited objective lens operated at short working distances (∼2mm). This electron optic design was first introduced into the laboratory SEM market, with instruments capable of producing approximately 1.2nm resolution at 20kV. These high performance lenses in which the magnetic field extends below the bottom of the polepiece, were fitted onto 200mm platforms allowing whole wafer inspection/defect review. The features of such tools and their application to the IC industry is the subject of this paper. An example of the superb imaging performance of such a 200mm tool is illustrated in figure 1.

Current State of Biological High-Resolution Scanning Electron Microscopy

1988 ◽  
Vol 46 ◽  
pp. 180-181 ◽  
Author(s):  
Klaus-Ruediger Peters
Keyword(s):  
High Performance ◽  
Low Voltage ◽  
Backscattered Electrons ◽  
Lens Position ◽  
Low Voltage Operation ◽  
Signal Collection ◽  
Probe Size ◽  
Electron Microscopes ◽  
Scanning Electron Microscopes ◽  
Scanning Electron

A new generation of high performance field emission scanning electron microscopes (FSEM) is now commercially available (JEOL 890, Hitachi S 900, ISI OS 130-F) characterized by an "in lens" position of the specimen where probe diameters are reduced and signal collection improved. Additionally, low voltage operation is extended to 1 kV. Compared to the first generation of FSEM (JE0L JSM 30, Hitachi S 800), which utilized a specimen position below the final lens, specimen size had to be reduced but useful magnification could be impressively increased in both low (1-4 kV) and high (5-40 kV) voltage operation, i.e. from 50,000 to 200,000 and 250,000 to 1,000,000 x respectively.At high accelerating voltage and magnification, contrasts on biological specimens are well characterized1 and are produced by the entering probe electrons in the outmost surface layer within -vl nm depth. Backscattered electrons produce only a background signal. Under these conditions (FIG. 1) image quality is similar to conventional TEM (FIG. 2) and only limited at magnifications >1,000,000 x by probe size (0.5 nm) or non-localization effects (%0.5 nm).

Low-voltage high-resolution Scanning Electron Microscopy of semiconductors

1989 ◽  
Vol 47 ◽  
pp. 82-83
Author(s):  
S.J. Krause ◽  
G.N. Maracas ◽  
W.J. Varhue ◽  
D.C. Joy
Keyword(s):  
High Resolution ◽  
High Performance ◽  
Low Voltage ◽  
Image Recording ◽  
Surface Charging ◽  
New Information ◽  
Negative Surface ◽  
Electron Microscopes ◽  
Scanning Electron Microscopes ◽  
Scanning Electron

The advent of scanning electron microscopes (SEMs) with reliable, high performance field emission guns (FEG) has afforded many opportunities to obtain new information at low voltages not available at higher voltages in traditional SEMs equipped with tungsten hairpin or LaB6 filaments. The FEG SEMs are able to operate at low voltages with both high brightness and high resolution (HR) due to the small source size and low energy spread of the beam. Resolution of 4 nm down to 1.5 nm are routinely possible in the energy range from 1 to 5 keV along with standard image recording times of 1 to 2 minutes. The low voltage capabilities have allowed insulating materials, such as polymers, composites, and ceramics to be imaged at high resolutions at energies below the second crossover, usually around 1 to 2 keV, without experiencing image artifacts from negative surface charging normally found in uncoated insulators at higher operating voltages.

On the Microanalysis of Small Precipitates at Low Voltage with a FE-SEM

1999 ◽  
Vol 5 (S2) ◽  
pp. 308-309
Author(s):  
Raynald Gauvin ◽  
Pierre Hovington
Keyword(s):  
Field Emission ◽  
Secondary Electron ◽  
Low Voltage ◽  
Chromatic Aberration ◽  
Incident Electron Energy ◽  
Objective Lens ◽  
Type I ◽  
Backscattered Electrons ◽  
Electron Microscopes ◽  
Scanning Electron

The observation of microstructural features smaller than 300 nm is generally performed using Transmission Electron Microscopy (TEM) because conventional Scanning Electron Microscopes (SEM) do not have the resolution to image such small phases. Since the early 1990’s, a new generation of microscopes is now available on the market. These are the Field Emission Gun Scanning Electron Microscope with a virtual secondary electron detector. The field emission gun gives a higher brightness than those obtained using conventional electron filaments allowing enough electrons to be collected to operate the microscope with incident electron energy, E0, below 5 keV, with probe diameter smaller than 2.5 nm. Furthermore, what gives FE-SEM outstanding resolution is the combination of new magnetic lenses with a virtual secondary electron (SE) detector. The new lenses are designed to reduce the spherical and chromatic aberration coefficients, giving a smaller probe size. Contrary to the conventional systems, the SE detector is located above the objective lens and it becomes a virtual or through-the-lens (TTL) detector. Therefore, the SE image is mostly made up of all SEs of type I, almost eliminating those of type II and III which are generated by the backscattered electrons inside the specimen as well as in the chamber. It has been shown recently that Nb(CN) precipitates in Fe, as small than 10 nm, can be imaged with a FE-SEM Hitachi S-4500 with the TTL detector.

Magnetic Domain Observation of an Amorphous Fe-Si-B Ribbon by Means of a High Voltage Scanning Electron Microscope

1981 ◽  
Vol 39 ◽  
pp. 320-321
Author(s):  
K. Tsuno ◽  
Y. Harada ◽  
T. Sato
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
High Voltage ◽  
Amorphous Ribbon ◽  
Image Resolution ◽  
Objective Lens ◽  
Magnetic Domains ◽  
Scattered Electron ◽  
Voltage Scanning ◽  
Scanning Electron

Magnetic domains of ferromagnetic amorphous ribbon have been observed using Bitter powder method. However, the domains of amorphous ribbon are very complicated and the surface of ribbon is not flat, so that clear domain image has not been obtained. It has been desired to observe more clear image in order to analyze the domain structure of this zero magnetocrystalline anisotropy material. So, we tried to observe magnetic domains by means of a back-scattered electron mode of high voltage scanning electron microscope (HVSEM).HVSEM method has several advantages compared with the ordinary methods for observing domains: (1) high contrast (0.9, 1.5 and 5% at 50, 100 and 200 kV) (2) high penetration depth of electrons (0.2, 1.5 and 8 μm at 50, 100 and 200 kV). However, image resolution of previous HVSEM was quite low (maximum magnification was less than 100x), because the objective lens cannot be excited for avoiding the application of magnetic field on the specimen.

Low-voltage, high-resolution scanning electron microscopy of polymers

1987 ◽  
Vol 45 ◽  
pp. 466-467 ◽  
Author(s):  
S. J. Krause ◽  
W.W. Adams ◽  
S. Kumar ◽  
T. Reilly ◽  
T. Suziki
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Low Voltage ◽  
Chromatic Aberration ◽  
Image Resolution ◽  
Resolution Limit ◽  
Crossover Point ◽  
New Generation ◽  
Beam Damage ◽  
Scanning Electron

Scanning electron microscopy (SEM) of polymers at routine operating voltages of 15 to 25 keV can lead to beam damage and sample image distortion due to charging. Imaging polymer samples with low accelerating voltages (0.1 to 2.0 keV), at or near the “crossover point”, can reduce beam damage, eliminate charging, and improve contrast of surface detail. However, at low voltage, beam brightness is reduced and image resolution is degraded due to chromatic aberration. A new generation of instruments has improved brightness at low voltages, but a typical SEM with a tungsten hairpin filament will have a resolution limit of about 100nm at 1keV. Recently, a new field emission gun (FEG) SEM, the Hitachi S900, was introduced with a reported resolution of 0.8nm at 30keV and 5nm at 1keV. In this research we are reporting the results of imaging coated and uncoated polymer samples at accelerating voltages between 1keV and 30keV in a tungsten hairpin SEM and in the Hitachi S900 FEG SEM.

Comparison of freeze-fractured yeast replicas using conventional TEM and low-voltage field-emission SEM

1989 ◽  
Vol 47 ◽  
pp. 74-75
Author(s):  
William P. Wergin ◽  
Eric F. Erbe ◽  
Terrence W. Reilly
Keyword(s):  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Field Emission ◽  
Low Voltage ◽  
Objective Lens ◽  
Specimen Preparation ◽  
Lens System ◽  
Air Drying ◽  
Preparation Techniques ◽  
Scanning Electron

Although the first commercial scanning electron microscope (SEM) was introduced in 1965, the limited resolution and the lack of preparation techniques initially confined biological observations to relatively low magnification images showing anatomical surface features of samples that withstood the artifacts associated with air drying. As the design of instrumentation improved and the techniques for specimen preparation developed, the SEM allowed biologists to gain additional insights not only on the external features of samples but on the internal structure of tissues as well. By 1985, the resolution of the conventional SEM had reached 3 - 5 nm; however most biological samples still required a conductive coating of 20 - 30 nm that prevented investigators from approaching the level of information that was available with various TEM techniques. Recently, a new SEM design combined a condenser-objective lens system with a field emission electron source.

Observation of GaAs/AlAs Superlattice Structures in both Secondary and Backscattcred Electron Imaging Modes with an Ultrahigh Resolution Scanning Electron Microscope

1990 ◽  
Vol 48 (1) ◽  
pp. 404-405
Author(s):  
K. Ogura ◽  
A. Ono ◽  
S. Franchi ◽  
P.G. Merli ◽  
A. Migliori
Keyword(s):  
Gaas Layer ◽  
Objective Lens ◽  
Superlattice Structure ◽  
Backscattered Electron ◽  
Instrumental Resolution ◽  
Electron Microscopes ◽  
Superlattice Structures ◽  
Electron Imaging ◽  
Scanning Electron Microscopes ◽  
Scanning Electron

In the last few years the development of Scanning Electron Microscopes (SEM), equipped with a Field Emission Gun (FEG) and using in-lens specimen position, has allowed a significant improvement of the instrumental resolution . This is a result of the fine and bright probe provided by the FEG and by the reduced aberration coefficients of the strongly excited objective lens. The smaller specimen size required by in-lens instruments (about 1 cm, in comparison to 15 or 20 cm of a conventional SEM) doesn’t represent a serious limitation in the evaluation of semiconductor process techniques, where the demand of high resolution is continuosly increasing. In this field one of the more interesting applications, already described (1), is the observation of superlattice structures.In this note we report a comparison between secondary electron (SE) and backscattered electron (BSE) images of a GaAs / AlAs superlattice structure, whose cross section is reported in fig. 1. The structure consist of a 3 nm GaAs layer and 10 pairs of 7 nm GaAs / 15 nm AlAs layers grown on GaAs substrate. Fig. 2, 3 and 4 are SE images of this structure made with a JEOL JSM 890 SEM operating at an accelerating voltage of 3, 15 and 25 kV respectively. Fig. 5 is a 25 kV BSE image of the same specimen. It can be noticed that the 3nm layer is always visible and that the 3 kV SE image, in spite of the poorer resolution, shows the same contrast of the BSE image. In the SE mode, an increase of the accelerating voltage produces a contrast inversion. On the contrary, when observed with BSE, the layers of GaAs are always brighter than the AlAs ones , independently of the beam energy.

A High Resolution Dual Gun Electron Miscroscope for TEM and SEM

1974 ◽  
Vol 32 ◽  
pp. 422-423
Author(s):  
P. S. Ong ◽  
C. L. Gold
Keyword(s):  
Electron Microscope ◽  
High Resolution ◽  
Spot Size ◽  
Resolving Power ◽  
Objective Lens ◽  
Scanning System ◽  
Transmission Electron ◽  
Mode Of Operation ◽  
Electron Microscopes ◽  
Scanning Electron

Transmission electron microscopes (TEM) have the capability of producing an electron spot (probe) with a diameter equal to its resolving power. Inclusion of the required scanning system and the appropriate detectors would therefore easily convert such an instrument into a high resolution scanning electron microscope (SEM). Such an instrument becomes increasingly useful in the transmission mode of operation since it allows the use of samples which are considered too thick for conventional TEM. SEM accessories now available are all based on the use of the prefield of the objective lens to focus the beam. The lens is operated either as a symmetrical Ruska lens or its asymmetrical version. In these approaches, the condensor system of the microscope forms part of the reducing optics and the final spot size is usually larger than 20Å.

Hitachi Scanning Electron Microscope

1968 ◽  
Vol 26 ◽  
pp. 374-375
Author(s):  
T. Fujiyasu ◽  
K. Hara ◽  
H. Tamura
Keyword(s):  
Optical Axis ◽  
Electrical Potential ◽  
Objective Lens ◽  
List Type ◽  
Type Number ◽  
Lens System ◽  
Mechanical Vibrations ◽  
Electron Microscopes ◽  
Scanning Electron Microscopes ◽  
Scanning Electron

The demand for scanning electron microscopes is growing rapidly and exciting new fields of application have developed for this type of instrument. Hitachi, Ltd. has developed this type of instrument the details of which are described in this paper.A three stage demagnification lens system is used in the instrument. External magnetic and electrical disturbances and mechanical vibrations have been reduced.Aperture plates with different bore diameters are located above the condenser lens and deflection coil and the objective lens to reduce contamination by the fixed apertures in these lenses. An electromagnetic stigmator is provided in the objective lens field.The specimen stage permits X-, Y- and Z- axes movements as well as rotational tilting. The rotational tilting is such that its central axis is always coincident with the optical axis independent of the X-, Y- and Z- axes movements. Terminals are also provided which permit voltage measurements and to observe the electrical potential distribution of semi conductors.

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