Effect of Copper-Induced Recrystallization on the Piezoresistivity of Germanium Films

2000 ◽  
Vol 618 ◽  
Author(s):  
A. Khakifirooz ◽  
S. S. Mohajerzadeh ◽  
S. Haji ◽  
E. Asl Soleimani
Keyword(s):  
Grain Growth ◽  
Cantilever Beam ◽  
Crystalline Structure ◽  
Considerable Increase ◽  
Hole Mobility ◽  
Gauge Factor ◽  
Amorphous Precursor ◽  
Beam Bending ◽  
Germanium Films ◽  
Effect Of Copper

ABSTRACTEffect of copper-induced recrystallization on the piezoresistivity of germanium films is reported. SEM and XRD are used to study the crystalline structure of the films, while RBS, PIXE, and EDX are utilized to investigate their composition. Significant grain growth is observed in Ge films, upon annealing a Cu/Ge bilayer at 400°C for 30 minutes. Also a dominant orientation of Ge(111) is observable when amorphous precursor films are used. Hall measurements and cantilever beam bending show a considerable increase in hole mobility and longitudinal gauge factor, respectively

The piezoresistive properties research of SiC thin films prepared by RF magnetron sputtering

2019 ◽  
Vol 33 (15) ◽  
pp. 1950152 ◽  
Author(s):  
Jing Wu ◽  
Xiaofeng Zhao ◽  
Chunpeng Ai ◽  
Zhipeng Yu ◽  
Dianzhong Wen
Keyword(s):  
Thin Films ◽  
Magnetron Sputtering ◽  
Cantilever Beam ◽  
Photoelectron Spectroscopy ◽  
Film Surface ◽  
Rf Magnetron Sputtering ◽  
Micro Electro Mechanical System ◽  
Gauge Factor ◽  
X Ray ◽  
Sputtering Power

To research the piezoresistive properties of SiC thin films, a testing structure consisting of a cantilever beam, SiC thin films piezoresistors and a Cr/Pt electrode is proposed in this paper. The chips of testing structure were fabricated by micro-electro-mechanical system (MEMS) technology on a silicon wafer with [Formula: see text]100[Formula: see text] orientation, in which SiC thin films were deposited by using radio-frequency (13.56 MHz) magnetron sputtering method. The effect of sputtering power, annealing temperature and time on the microstructure and morphology of the SiC thin films were investigated by the X-ray diffraction (XRD) and scanning electron microscopy (SEM). It indicates that a good continuity and uniform particles on the SiC thin film surface can be achieved at sputtering power of 160 W after annealing. To verify the existence of Si–C bonds in the thin films, X-ray photoelectron spectroscopy (XPS) was used. Meanwhile, the piezoresistive properties of SiC thin films piezoresistors were measured using the proposed cantilever beam. The test result shows that it is possible to achieve a gauge factor of 35.1.

scholarly journals Size effect in micro-scale cantilever beam bending

2011 ◽  
Vol 219 (3-4) ◽  
pp. 291-307 ◽  
Author(s):  
S. H. Chen ◽  
B. Feng
Keyword(s):  
Size Effect ◽  
Cantilever Beam ◽  
Micro Scale ◽  
Beam Bending

EFFECT OF COPPER OXIDE ON THE GRAIN GROWTH AND INITIAL PERMEABILITY OF Mg–Cu–Zn FERRITES

2010 ◽  
Vol 24 (02) ◽  
pp. 169-182
Author(s):  
M. MANJURUL HAQUE ◽  
M. HUQ ◽  
SYED FARID UDDIN FARHAD ◽  
JASIM UDDIN KHAN ◽  
M. A. HAKIM
Keyword(s):  
Grain Size ◽  
Magnetic Properties ◽  
Grain Growth ◽  
Spinel Phase ◽  
Initial Permeability ◽  
Cu Content ◽  
Average Grain Size ◽  
Zn Ferrite ◽  
Effect Of Copper ◽  
Microstructure And Magnetic Properties

The microstructure and magnetic properties of Mg – Cu – Zn ferrites prepared by using solid-state reaction method have been investigated. X-ray diffraction (XRD), a scanning electron microscope (SEM), impedance analyzer and a vibrating sample magnetometer (VSM) were utilized in order to study the effect of copper substitution and its impact on the crystal structure, grain size, microstructure and magnetic properties of the Mg – Cu – Zn ferrite. The formation of cubic spinel phase was identified using XRD technique. The microstructures of the samples show that the grain growth is greatly enhanced by the addition of CuO which is attributed to the liquid phase during sintering. The average grain size (Dm) increases significantly with increasing Cu content. The initial permeability (μ') of the samples increases appreciably with increasing Cu content which is attributed to the increase of grain size and density of the samples. The resonance frequency (fr) of the samples shifts toward the lower frequency as the Cu content increases. The sharp fall of μ' in μ'-T curves is observed for all the samples which indicate the homogeneity of the samples. The saturation magnetization (Ms) of the Mg – Cu – Zn ferrites increases slightly with increasing Cu concentration.

Thickness Dependence of the Crystalline Structure and Hole Mobility in Thin Films of Low Molecular Weight Poly(3-hexylthiophene)

2008 ◽  
Vol 41 (18) ◽  
pp. 6800-6808 ◽  
Author(s):  
Siddharth Joshi ◽  
Souren Grigorian ◽  
Ullrich Pietsch ◽  
Patrick Pingel ◽  
Achmad Zen ◽  
...  
Keyword(s):  
Thin Films ◽  
Molecular Weight ◽  
Crystalline Structure ◽  
Hole Mobility ◽  
Thickness Dependence ◽  
Low Molecular Weight

Grain growth and grain size distributions in thin germanium films

1987 ◽  
Vol 62 (6) ◽  
pp. 2492-2497 ◽  
Author(s):  
J. E. Palmer ◽  
C. V. Thompson ◽  
Henry I. Smith
Keyword(s):  
Grain Size ◽  
Grain Growth ◽  
Size Distributions ◽  
Grain Size Distributions ◽  
Germanium Films

Influence of side chain length and bifurcation point on the crystalline structure and charge transport of diketopyrrolopyrrole-quaterthiophene copolymers (PDQTs)

2014 ◽  
Vol 2 (12) ◽  
pp. 2183-2190 ◽  
Author(s):  
Shaoyun Chen ◽  
Bin Sun ◽  
Wei Hong ◽  
Hany Aziz ◽  
Yuezhong Meng ◽  
...  
Keyword(s):  
Charge Transport ◽  
Chain Length ◽  
Crystalline Structure ◽  
Bifurcation Point ◽  
Hole Mobility ◽  
Side Chain ◽  
Polymer Backbone ◽  
Side Chain Length

Increasing the side chain length and positioning the bifurcation point away from the polymer backbone improve the hole mobility of a DPP polymer to 6.90 cm2 V−1 s−1.

The Effect of Copper Content on the Dynamic Grain Growth in AL-Cu-Zr Systems

2007 ◽  
Vol 558-559 ◽  
pp. 803-809 ◽  
Author(s):  
Kasra Sotoudeh ◽  
Pete S. Bate ◽  
John F. Humphreys
Keyword(s):  
Strain Rate ◽  
Grain Growth ◽  
Copper Content ◽  
Texture Evolution ◽  
Uniaxial Tensile ◽  
Sensitivity Index ◽  
High Angle ◽  
Initial Microstructure ◽  
Dynamic Grain Growth ◽  
Effect Of Copper

The effect of copper content on dynamic grain growth in Al-Cu-Zr system was investigated by studying the microstructural development and texture evolution during uniaxial tensile deformation of Al-2wt%Cu-0.3wt.%Zr and Al-4wt%Cu-0.4wt.%Zr alloys at 450°C with a strain rate of 10-3s-1, with a similar initial microstructure in both materials. The initial microstructure consisted of layers of different orientations, the layers being separated by high-angle grain boundaries with low-angle boundaries separating grains within the layers. The initial grain spacing was about 5m and the texture was typical of rolled aluminium alloys. The 4wt.%Cu alloy gave a higher strain rate sensitivity index, m, and a greater ductility compared to the low copper content alloy. An increase in grain size occurred in both materials due to deformation, but this dynamic grain growth (DGG) was much greater in the material with the higher copper content. This was associated with a more rapid conversion of low-angle boundaries to high angle ones in the 4wt%Cu material which is consistent with changes in crystallographic texture occurring during deformation.

Effect of post annealing on hole mobility of pseudo-single-crystalline germanium films on glass substrates

2017 ◽  
Vol 70 ◽  
pp. 68-72 ◽  
Author(s):  
Kenji Kasahara ◽  
Hidenori Higashi ◽  
Mario Nakano ◽  
Yuta Nagatomi ◽  
Keisuke Yamamoto ◽  
...  
Keyword(s):  
Hole Mobility ◽  
Single Crystalline ◽  
Glass Substrates ◽  
Post Annealing ◽  
Germanium Films ◽  
Crystalline Germanium
Sign in / Sign up

Export Citation Format

Share Document