Growth of Cu-Ni-Sn Alloys in Pb Free CuSnAg Solder/Au-Ni Metallization Reactions

2000 ◽  
Vol 652 ◽  
Author(s):  
Anis Zribi ◽  
Peter Borgesen ◽  
Lubov Zavalij ◽  
Eric J. Cotts
Keyword(s):  
Mechanical Properties ◽  
Melting Temperature ◽  
Ternary Compound ◽  
Ternary Alloy ◽  
Thermal Aging ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Flip Chips

ABSTRACTDiffusion and phase formation were monitored in solder joints consisting of flip chips with Ni(V) under-bump metallizations bumped with Ag3.8Cu1.85Sn94.35 (atomic percentage) solder reflowed on printed circuit boards with Cu/Ni/Au metallizations. A ternary alloy, (CuNi)6Sn5, was observed to form during reflow at solder/Ni interfaces in these Ag3.8Cu1.85Sn94.35/Au/Ni solder joints. After extended thermal aging at 150 oC, a second ternary compound, (CuNi)3Sn4 forms at the Ni/(CuNi)6Sn5 interface. The growth of these alloys depletes the solder of essentially all Cu, changing its mechanical properties and melting temperature.

scholarly journals Interfacial Reactions and Mechanical Properties of Sn–58Bi Solder Joints with Ag Nanoparticles Prepared Using Ultra-Fast Laser Bonding

Materials ◽  
2021 ◽  
Vol 14 (2) ◽  
pp. 335
Author(s):  
Gyuwon Jeong ◽  
Dong-Yurl Yu ◽  
Seongju Baek ◽  
Junghwan Bang ◽  
Tae-Ik Lee ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Low Temperature ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Interfacial Reactions ◽  
Circuit Boards ◽  
Ag Nps ◽  
Laser Bonding ◽  
Laser Soldering ◽  
Low Temperature Bonding

The effects of Ag nanoparticle (Ag NP) addition on interfacial reaction and mechanical properties of Sn–58Bi solder joints using ultra-fast laser soldering were investigated. Laser-assisted low-temperature bonding was used to solder Sn–58Bi based pastes, with different Ag NP contents, onto organic surface preservative-finished Cu pads of printed circuit boards. The solder joints after laser bonding were examined to determine the effects of Ag NPs on interfacial reactions and intermetallic compounds (IMCs) and high-temperature storage tests performed to investigate its effects on the long-term reliabilities of solder joints. Their mechanical properties were also assessed using shear tests. Although the bonding time of the laser process was shorter than that of a conventional reflow process, Cu–Sn IMCs, such as Cu6Sn5 and Cu3Sn, were well formed at the interface of the solder joint. The addition of Ag NPs also improved the mechanical properties of the solder joints by reducing brittle fracture and suppressing IMC growth. However, excessive addition of Ag NPs degraded the mechanical properties due to coarsened Ag3Sn IMCs. Thus, this research predicts that the laser bonding process can be applied to low-temperature bonding to reduce thermal damage and improve the mechanical properties of Sn–58Bi solders, whose microstructure and related mechanical properties can be improved by adding optimal amounts of Ag NPs.

Intelligent detection of solder joints on printed circuit boards

2011 ◽  
Vol 19 (9) ◽  
pp. 2154-2162 ◽  
Author(s):  
谢宏威 XIE Hong-wei ◽  
张宪民 ZHANG Xian-min ◽  
邝泳聪 KUANG Yong-cong ◽  
欧阳高飞 OUYANG Gao-fei
Keyword(s):  
Printed Circuit Boards ◽  
Solder Joints ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Intelligent Detection

Influence of the cavities on the PCB mechanical properties

Circuit World ◽  
2015 ◽  
Vol 41 (2) ◽  
pp. 76-79
Author(s):  
Boleslav Psota ◽  
Alexandr Otáhal ◽  
Ivan Szendiuch
Keyword(s):  
Mechanical Properties ◽  
Resonant Frequency ◽  
Design Methodology ◽  
Printed Circuit Boards ◽  
Measured Data ◽  
Circuit Boards ◽  
Frequency Range ◽  
Content Type ◽  
Printed Circuit ◽  
Acceleration Amplitude

Purpose – The main aim of this paper is to investigate the influence of the cavity coverage on the printed circuit boards (PCB) to the resonant frequency, acceleration and displacement. Design/methodology/approach – Tests were realized on four PCBs with different cavity areas. Frequency range of tests was between 10 and 2,000 Hz with 0.3 g acceleration amplitude. In addition, more simulations were performed to check different setups of the boards. Findings – From the calculated and measured data, it is clear that with the larger cavity area the resonance frequency drops. In case a greater number of components placed in cavities are needed on board, it is appropriate to use multiple smaller cavities than the bigger ones. Originality/value – Results in this paper could be very useful for PCB manufacturers and designers during designing of the new PCBs with cavities for dipped components.

Distribution and physico-mechanical properties of copper electrodeposits in small-diameter through holes of printed circuit boards

2019 ◽  
pp. 55-61
Author(s):  
А. А. Kosarev ◽  
◽  
А. А. Kalinkina ◽  
D. V. Mazurova ◽  
Т. А. Vagramyan ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Printed Circuit Boards ◽  
Small Diameter ◽  
Circuit Boards ◽  
Printed Circuit

Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach

1996 ◽  
Vol 118 (2) ◽  
pp. 87-93
Author(s):  
K. X. Hu ◽  
Y. Huang ◽  
C. P. Yeh ◽  
K. W. Wyatt
Keyword(s):  
Stress Analysis ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Effective Properties ◽  
Mechanical Analysis ◽  
Computational Effort ◽  
Circuit Boards ◽  
Element Analysis ◽  
Printed Circuit ◽  
Board Level

The single most difficult aspect for thermo-mechanical analysis at the board level lies in to an accurate accounting for interactions among boards and small features such as solder joints and secondary components. It is the large number of small features populated in a close neighborhood that proliferates the computational intensity. This paper presents an approach to stress analysis for boards with highly populated small features (solder joints, for example). To this end, a generalized self-consistent method, utilizing an energy balance framework and a three-phase composite model, is developed to obtain the effective properties at board level. The stress distribution inside joints and components are obtained through a back substitution. The solutions presented are mostly in the closed-form and require a minimum computational effort. The results obtained by present approach are compared with those by finite element analysis. The numerical calculations show that the proposed micromechanics approach can provide reasonably accurate solutions for highly populated printed circuit boards.

Impact of Immersion Cooling on Thermo-mechanical Properties of Low-loss Material Printed Circuit Boards

2021 ◽  
Author(s):  
Tushar Chauhan ◽  
Rabin Bhandari ◽  
Krishna Bhavana Sivaraju ◽  
A S M Raufur Chowdhury ◽  
Dereje Agonafer
Keyword(s):  
Mechanical Properties ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Low Loss ◽  
Printed Circuit ◽  
Immersion Cooling
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