Development of Woven Fabric-based Electrical Circuits

2002 ◽  
Vol 736 ◽  
Author(s):  
Anuj Dhawan ◽  
Tushar K. Ghosh ◽  
Abdelfattah M. Seyam ◽  
John Muth
Keyword(s):  
Signal Integrity ◽  
Electronic Devices ◽  
Electrical Circuit ◽  
Woven Fabric ◽  
Circuit Boards ◽  
Electrical Networks ◽  
Electrical Circuits ◽  
Conductive Yarns ◽  
Point Of Intersection ◽  
Efficient Transfer

ABSTRACTThis paper describes the development of woven electrical circuits, which are formed by interlacing conducting and non-conducting threads into a woven fabric. Conductive threads in these electrical networks are arranged and woven such that they follow desired electrical circuit designs. Electronic devices can be attached to these electrical networks, which can serve as flexible circuit boards. In these woven circuits, an efficient transfer of current from one conductive yarn to an orthogonal one is achieved by the formation of an effective electrical interconnect at the point of intersection of these yarns. Formation of woven conductive networks also involves disconnect formation or cutting of conductive yarns at certain specified points. Different methods and processes were identified and applied in order to form interconnects and disconnects at specified points of these fabrics. Efficacy of these interconnects was evaluated by DC resistance and AC Signal measurements. The results of these evaluations are reported. The conductive threads woven into these fabric-based circuits were also evaluated for signal integrity issues.

scholarly journals Fabric Circuit Board Connecting to Flexible Sensors or Rigid Components for Wearable Applications

Sensors ◽  
2019 ◽  
Vol 19 (17) ◽  
pp. 3745 ◽  
Author(s):  
Li ◽  
Ran ◽  
Ding ◽  
Wang
Keyword(s):  
Helical Structure ◽  
Circuit Board ◽  
Woven Fabric ◽  
Wearable Electronics ◽  
Circuit Boards ◽  
Electronic Textiles ◽  
Flexible Sensors ◽  
New Family ◽  
Conductive Yarns ◽  
Rigid Component

Electronic textiles demand a new family of flexible circuit boards in the construction of fiber or fiber assemblies. This paper presents a stretchable woven fabric circuit board (FCB) with permanent as well as detachable electrical connections to sensors or other wearable electronics components. The woven FCB was created by integrating conductive yarns into an elastic woven fabric. Permanent connection was designed between the conductive tracks and flexible sensors; detachable connection was achieved by the helical structure of conductive yarns wrapping around the rigid component electrode encapsulated within elastomeric layer. The developed FCB, with its connections to flexible sensors or rigid components, is porous, flexible, and capable of stretching to 30% strain. The woven FCB with permanent connection to temperature sensors has a large fatigue life of more than 10,000 cycles while maintaining constant electrical resistance due to crimped configurations of the conductive track in the elastic fabric substrate and stable contact resistance. A prototype of the FCB assembly, with independent light-emitting diodes electrically linked and mechanically supported by the woven FCB, is also demonstrated for wearable applications.

Mathematical views of the fractional Chua's electrical circuit described by the Caputo-Liouville derivative

2021 ◽  
Vol 67 (1 Jan-Feb) ◽  
pp. 91
Author(s):  
N. Sene
Keyword(s):  
Caputo Derivative ◽  
Local Stability ◽  
Numerical Scheme ◽  
Equilibrium Points ◽  
Electrical Circuit ◽  
Maximal Lyapunov Exponent ◽  
Electrical Circuits ◽  
Adaptive Controls ◽  
Liouville Derivative

This paper revisits Chua's electrical circuit in the context of the Caputo derivative. We introduce the Caputo derivative into the modeling of the electrical circuit. The solutions of the new model are proposed using numerical discretizations. The discretizations use the numerical scheme of the Riemann-Liouville integral. We have determined the equilibrium points and study their local stability. The existence of the chaotic behaviors with the used fractional-order has been characterized by the determination of the maximal Lyapunov exponent value. The variations of the parameters of the model into the Chua's electrical circuit have been quantified using the bifurcation concept. We also propose adaptive controls under which the master and the slave fractional Chua's electrical circuits go in the same way. The graphical representations have supported all the main results of the paper.

scholarly journals Signal Processing and Analysis of Electrical Circuit

Electronics ◽  
2019 ◽  
Vol 9 (1) ◽  
pp. 17
Author(s):  
Adam Glowacz ◽  
Jose Alfonso Antonino Daviu
Keyword(s):  
Signal Processing ◽  
Electrical Circuit ◽  
Electrical Circuits ◽  
Electrical Systems

The analysis of electrical circuits is an essential task in the evaluation of electrical systems [...]

An Active-Passive Piezoelectric Vibration Absorber for Structural Control Under Harmonic Excitations With Time-Varying Frequency

2000 ◽  
Author(s):  
Ronald A. Morgan ◽  
K. W. Wang
Keyword(s):  
Active Control ◽  
Structural Control ◽  
High Performance ◽  
Piezoelectric Materials ◽  
Negative Resistance ◽  
Electrical Circuit ◽  
Superior Performance ◽  
Electrical Networks ◽  
Harmonic Excitations ◽  
Time Varying Frequency

Abstract It has been shown that piezoelectric materials can be used as passive electromechanical vibration absorbers when shunted by electrical networks. Semi-active piezoelectric absorbers have also been proposed for suppressing harmonic excitations with varying frequency. However, these semi-active devices have limitations that restrict their applications. The design presented here is a high performance active-passive alternative to semi-active absorbers that uses a combination of a passive electrical circuit and active control actions. The active control consists of three parts: an adaptive inductor tuning action, a negative resistance action, and a coupling enhancement action. A formulation for the optimal tuning of the piezoelectric absorber inductance on a multiple degree of freedom (MDOF) structure is derived. The effectiveness of the proposed system is demonstrated experimentally on a system under a variable frequency excitation. Extensive parameter studies are also carried out to show that the proposed design offers superior performance and efficiency compared to other state-of-the-art control methods.

Approximation and the point of flicker-noise formation

2021 ◽  
Author(s):  
A.S. Matsaev
Keyword(s):  
Spectral Density ◽  
Flicker Noise ◽  
Electronic Devices ◽  
Electrical Circuit ◽  
Maximum Magnitude ◽  
Noise Characteristics ◽  
Exponential Increase ◽  
Accurate Definition ◽  
Definition Of ◽  
Flat Section

The article refers to the field of research of noise fluctuations or flicker noise in electronic amplifiers and is devoted to the exact definition of the magnitude and shape of the spectral density of flicker-noise. The 1/f approximation of flicker noise is analyzed and the problem of its non-constructiveness in analyzing the noise characteristics of electronic amplifiers is shown. To eliminate this problem, the mechanism of physical formation of the envelope, a form of spectral density flicker-noise is defined. The physics of flicker-noise is detailed by accurate definition of the place of its formation. An accurate definition of the maximum difference of the amplifier flickernoise on the flat section of noise characteristics is given, using an explanation of the physics of flicker noise. The mechanism and conditions of the exponential increase of flicker noise and its subsequent exponential desire for maximum magnitude are explained. A simple physical approximation is given to determine the processes of forming the envelope form of the spectral density of flickernoise. The physical understanding of the formation of spectral density of flicker-noise tension in the internal structure of the transistor with the participation of external circuits of the amplifier electrical circuit is detailed. The results of the study will help developers to solve many problems of building electronic devices and optimizing their characteristics at a qualitatively new level.

Advanced Build-up Materials and Processes for Packages with Fine Line and Space

2014 ◽  
Vol 2014 (1) ◽  
pp. 000444-000447 ◽  
Author(s):  
Yoshio Nishimura ◽  
Hirohisa Narahashi ◽  
Shigeo Nakamura ◽  
Tadahiko Yokota
Keyword(s):  
Printed Circuit Boards ◽  
Coefficient Of Thermal Expansion ◽  
High Reliability ◽  
Electronic Devices ◽  
Circuit Boards ◽  
Additive Process ◽  
Fine Line ◽  
Printed Circuit ◽  
Low Dielectric ◽  
Line Space

Printed circuit boards manufactured by a semi-additive process are widely used for packaging substrates. Along with increasing demands of downsizing electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to be miniaturized with high density of circuit wirings. We report our insulation build-up materials and processes for advanced packages with fine line/space and high reliability. The insulation materials we developed show low coefficient of thermal expansion (CTE), low dielectric loss tangent and good thinner insulation reliability. They can produce fine line and space (FLS) under 10μm pitch by a semi-additive process.

scholarly journals Minimum energy control of fractional positive electrical circuits

2016 ◽  
Vol 65 (2) ◽  
pp. 191-201 ◽  
Author(s):  
Tadeusz Kaczorek
Keyword(s):  
Control Problem ◽  
Minimum Energy ◽  
Sufficient Conditions ◽  
Electrical Circuit ◽  
Existence Of Solution ◽  
Energy Control ◽  
Electrical Circuits ◽  
Minimum Energy Control

Abstract Minimum energy control problem for the fractional positive electrical circuits is formulated and solved. Sufficient conditions for the existence of solution to the problem are established. A procedure for solving of the problem is proposed and illustrated by an example of fractional positive electrical circuit.

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