Development of Deposition Phase Diagrams for Thin Film Si:H and Si1-xGex:H Using Real Time Spectroscopic Ellipsometry

2005 ◽  
Vol 862 ◽  
Author(s):  
N. J. Podraza ◽  
G. M. Ferreira ◽  
C. R. Wronski ◽  
R. W. Collins

AbstractThe growth of hydrogenated silicon (Si:H) and silicon-germanium alloys (Si1-xGex:H) by plasma-enhanced chemical vapor deposition (PECVD) on crystalline silicon (c-Si) substrates has been studied by real time spectroscopic ellipsometry (RTSE). The motivation is to develop deposition phase diagrams that can provide greater insight into the optimization of amorphous Si1-xGex:H (a-Si1-xGex:H) for multijunction photovoltaics. In initial studies, the phase diagram for bottom cell a-Si1-xGex:H (Eg ˜ 1.4 eV) is found to exhibit fundamental similarities to that for Si:H when both materials are prepared under standard PECVD conditions that optimize pure a-Si:H. These similarities suggest directions for optimizing a-Si1-xGex:H by identifying conditions under which a smooth, stable surface is obtained to the largest possible bulk layer thickness. In phase diagram development for PECVD Si1-xGex:H on c-Si, it has been found that the highest surface stability and smoothest surfaces are obtained using cathodic deposition (self bias: ˜-20 V) with a H2-dilution level just below that of the amorphous-to-(mixed-phase microcrystalline) [→(a+μc)] transition for a thick layer. Due to the promising nature of these results, full phase diagrams are compared for cathodic and anodic Si1-xGex:H as well as for cathodic and anodic Si:H, all on c-Si substrates. The cathodic phase diagram for Si1-xGex:H reveals a narrow range of significant improvement in surface structural evolution near the →(a+μc) transition, and for a-Si:H reveals an extension of the ultrasmooth protocrystalline regime to a much wider range of thickness.

2007 ◽  
Vol 989 ◽  
Author(s):  
Jason Collins ◽  
Nikolas J. Podraza ◽  
Jian Li ◽  
Xinmin Cao ◽  
Xunming Deng ◽  
...  

AbstractPhase diagrams have been established to describe very high frequency (vhf) plasma-enhanced chemical vapor deposition (PECVD) processes for intrinsic hydrogenated silicon (Si:H) and silicon-germanium alloy (Si1-xGex:H) thin films using crystalline Si substrates that have been over-deposited with n-type amorphous Si:H (a-Si:H). The Si:H and Si1-xGex:H processes are applied for the top and middle i-layers of triple-junction a-Si:H-based n-i-p solar cells fabricated at University of Toledo. Identical n/i cell structures were co-deposited on textured Ag/ZnO back-reflectors in order to correlate the phase diagram and the performance of single-junction solar cells, the latter completed through over-deposition of the p-layer and top contact. This study has reaffirmed that the highest efficiencies for a-Si:H and a-Si1-xGex:H solar cells are obtained when the i-layers are prepared under maximal H2 dilution conditions.


2004 ◽  
Vol 808 ◽  
Author(s):  
D.H. Levi ◽  
C.W. Teplin ◽  
E. Iwaniczko ◽  
R.K. Ahrenkiel ◽  
H.M. Branz ◽  
...  

ABSTRACTWe have applied real-time spectroscopic ellipsometry (RTSE) as both an in-situ diagnostic and post-growth analysis tool for hydrogenated amorphous silicon (a-Si:H)/crystalline silicon (c-Si) heterojunction with intrinsic thin-layer (HIT) solar cells grown by hot-wire chemical vapor deposition. RTSE enables precise thickness control of the 5 to 25 nm layers used in these devices, as well as monitoring crystallinity and surface roughness in real time. Utilizing RTSE feedback, but without extensive optimization, we have achieved a photovoltaic energy conversion efficiency of 14.1% on an Al-backed p-type Czochralski c-Si wafer coated with thin i and n layers on the front. Open-circuit voltages above 620 mV indicate effective passivation of the c-Si surface by the a-Si:H intrinsic layer. Lifetime measurements using resonant coupled photoconductive decay indicate that surface recombination velocities can approach 1 cm/s. RTSE and transmission electron microscopy show that the intrinsic a-Si:H i-layers grow as a mixture of amorphous and nano-crystalline silicon.


2008 ◽  
Vol 1066 ◽  
Author(s):  
Nikolas Podraza ◽  
Jing Li ◽  
Christopher R. Wronski ◽  
Mark W. Horn ◽  
Elizabeth C. Dickey ◽  
...  

ABSTRACTSilicon-germanium (Si1−xGex:H) thin films have been prepared by plasma enhanced chemical vapor deposition of SiH4 and GeH4 and measured during growth using real time spectroscopic ellipsometry. A two-layer virtual interface analysis has been applied to study the structural evolution of Si:H films prepared in multistep processes utilizing alternating intermediate and low H2-dilution material layers, which have been designed to produce predominately amorphous films with a controlled distribution of microcrystalline particles. The compositional evolution of alloy-graded a-Si1−xGex:H has been studied as well using similar methods. In each case, depth profiles of microcrystalline content, fμc, or Ge content, x, have been extracted. Additionally, real time spectroscopic ellipsometry has been used to monitor post-deposition exposure of a-Si:H, a-Si1−xGex:H, and a-Ge:H films to a hydrogen plasma in situ in order to determine sub-surface amorphous film modification similar to that which would occur when a highly H2-diluted layer is deposited on a layer prepared with lower dilution. These analyses provide guidance for enhanced performance of Si:H based solar cells, through controlled bandgap grading using compositionally graded amorphous binary alloys (a-Si1−xGex:H) or the incorporation of controlled fractions of microcrystallites into bulk amorphous i-layer materials, and by providing a fundamental understanding of the modification of component layers during the deposition of subsequent layers in multilayer stacks.


2013 ◽  
Vol 4 ◽  
pp. 726-731 ◽  
Author(s):  
Gema López ◽  
Pablo R Ortega ◽  
Cristóbal Voz ◽  
Isidro Martín ◽  
Mónica Colina ◽  
...  

The aim of this work is to study the surface passivation of aluminum oxide/amorphous silicon carbide (Al2O3/a-SiCx) stacks on both p-type and n-type crystalline silicon (c-Si) substrates as well as the optical characterization of these stacks. Al2O3 films of different thicknesses were deposited by thermal atomic layer deposition (ALD) at 200 °C and were complemented with a layer of a-SiCx deposited by plasma-enhanced chemical vapor deposition (PECVD) to form anti-reflection coating (ARC) stacks with a total thickness of 75 nm. A comparative study has been carried out on polished and randomly textured wafers. We have experimentally determined the optimum thickness of the stack for photovoltaic applications by minimizing the reflection losses over a wide wavelength range (300–1200 nm) without compromising the outstanding passivation properties of the Al2O3 films. The upper limit of the surface recombination velocity (S eff,max) was evaluated at a carrier injection level corresponding to 1-sun illumination, which led to values below 10 cm/s. Reflectance values below 2% were measured on textured samples over the wavelength range of 450–1000 nm.


2003 ◽  
Vol 762 ◽  
Author(s):  
A. S. Ferlauto ◽  
G. M. Ferreira ◽  
R.J. Koval ◽  
J.M. Pearce ◽  
C.R. Wronski ◽  
...  

AbstractThe ability to characterize the phase of the intrinsic (i) layers incorporated into amorphous silicon [a-Si:H] and microcrystalline silicon [μc-Si:H] thin film solar cells is critically important for cell optimization. In our research, a new method has been developed to extract the thickness evolution of the μc-Si:H volume fraction in mixed phase amorphous + microcrystalline silicon [(a+μc)-Si:H] i-layers. This method is based on real time spectroscopic ellipsometry measurements performed during plasma-enhanced chemical vapor deposition of the films. In the analysis, the thickness at which crystallites first nucleate from the a-Si:H phase can be estimated, as well as the nucleation density and microcrystallite cone angle. The results correlate well with structural and solar cell measurements.


1999 ◽  
Vol 591 ◽  
Author(s):  
I.M. Vargas ◽  
J.Y. Manso ◽  
J.R. Guzmán ◽  
B.R. Weiner ◽  
G. Morell

ABSTRACTWe employed in situ ellipsometry in the monitoring of surface damage to monocrystalline silicon (Si) substrates under hydrogen plasma conditions. These measurements were complemented with spectroscopic ellipsometry and Raman spectroscopy, in order to characterize the surface conditions. It was found that heating the Si substrate to 700°C in the presence of molecular hydrogen produces etching of the native oxide layer, which is typically 10 Å thick. When the already hot and bare silicon surface is submitted to hydrogen plasma, it deteriorates very fast, becoming rough and full of voids. Modeling of the spectroscopic ellipsometry data was used to obtain a quantitative physical picture of the surface damage, in terms of roughness layer t ickness and void fraction. The results indicate that by the time a thin film starts to grow on these silicon surfaces, like in the chemical vapor deposition of diamond, the roughness produced by the hydrogen plasma has already determined to a large extent the rough nature of the film to be grown.


2004 ◽  
Vol 808 ◽  
Author(s):  
Charles W. Teplin ◽  
Dean H. Levi ◽  
Qi Wang ◽  
Eugene Iwaniczko ◽  
Kim M. Jones ◽  
...  

ABSTRACTWe use in-situ real-time spectroscopic ellipsometry to observe the breakdown of silicon epitaxy during growth by hot-wire chemical vapor deposition (HWCVD) on Si (100) substrates. Representative data is presented for the two types of epitaxy breakdown that we have observed: 1) an immediate transition to hydrogenated amorphous silicon (a-Si:H), and 2) a slower transition where a-Si:H cones nucleate and grow until they eclipse further epitaxial growth. Simple models, consistent with transmission-electron and atomic-force micrographs, describe the evolution of both types of breakdown showing that real-time spectroscopic ellipsometry is a useful tool for monitoring the growth of epitaxial silicon.


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