60 GHz Millimeter-Wave CMOS Integrated On-Chip Open Loop Resonator Bandpass Filters on Patterned Ground Shields

2013 ◽  
Vol E96.C (2) ◽  
pp. 270-276
Author(s):  
Ramesh K. POKHAREL ◽  
Xin LIU ◽  
Dayang A.A. MAT ◽  
Ruibing DONG ◽  
Haruichi KANAYA ◽  
...  
2011 ◽  
Vol 58 (7) ◽  
pp. 1837-1845 ◽  
Author(s):  
Huey-Ru Chuang ◽  
Lung-Kai Yeh ◽  
Pei-Chun Kuo ◽  
Kai-Hsiang Tsai ◽  
Han-Lin Yue

2011 ◽  
Vol 3 (2) ◽  
pp. 179-188 ◽  
Author(s):  
Christophe Calvez ◽  
Romain Pilard ◽  
Christian Person ◽  
Jean-Philippe Coupez ◽  
François Gallée ◽  
...  

Antenna on chip (AoC) and antenna in package (AiP) solutions for millimeter-wave (mmWave) applications and their characterization are presented in this paper. Antenna integration on low resistivity (LR) and high resistivity (HR) silicon substrate are expected. And, in a packaging approach, the combination of antenna on silicon with a material, which has the effect of a “lens”, allowing increasing gain is presented. In a second part, to satisfy beamforming capabilities, a hybrid integration of the antenna on silicon and glass substrates is proposed.


2016 ◽  
Vol 5 (3) ◽  
pp. 98 ◽  
Author(s):  
M. A. Matin

The millimeter wave (mmWave) band is considered as the potential candidate for high speed communication services in 5G networks due to its huge bandwidth. Moreover, mmWave frequencies lead to miniaturization of RF front end including antennas. In this article, we provide an overview of recent research achievements of millimeter-wave antenna design along with the design considerations for compact antennas and antennas in package/on chip, mostly in the 60 GHz band is described along with their inherent benefits and challenges. A comparative analysis of various designs is also presented. The antennas with wide bandwidth, high-gain, compact size and low profile with easiness of integration in-package or on-chip with other components are required for 5G enabled applications. 


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