scholarly journals Numerical Simulation of Water as Base Fluid Dispersed by Al2O3 Aluminum Oxide Nano-Sized Solid Particles with Various Concentrations

2020 ◽  
Vol 44 (4) ◽  
pp. 231-238
Author(s):  
Chafika Zidani ◽  
Rachid Maouedj ◽  
Mohamed Salmi

Curves of pressure, lines of current, speed of fluid, fields and diagrams of kinetic energy, and plots of viscosity through a H2O/Al2O3 nanofluid-heat exchanger with recirculation promoters are studied by using a computational approach and a two-dimensional algorithm. The simulation used four nanofluid fractions, i.e. ϕ = 0.5, 1, 2 and 4 percent, with four flow rates, i.e. Re = 5, 10, 15 and 20 (× 103). Both the discontinuous-type deflectors and the detached-model bars are considered to reinforce the nanofluid field structure. The discontinuous-situation of these deflectors allows reducing the pressure on its front-corner by passing the fluid between their internal surfaces. In addition, the field is detached from the front-sharp-edge, forcing the creation of recycling-rings on their back-areas. While, the presence of the detached-bar model in both the top and the lower stations of the exchanger allows an improvement in the flow disturbance across the gaps through their interior-surfaces, and the formation of new recycling-cells near their right-sides. These vortices constitute opposite-currents where their strength increases with increasing nanofluid concentration and Reynolds values.

Author(s):  
Ehsan Dehdarinejad ◽  
Morteza Bayareh ◽  
Mahmud Ashrafizaadeh

Abstract The transfer of particles in laminar and turbulent flows has many applications in combustion systems, biological, environmental, nanotechnology. In the present study, a Combined Baffles Quick-Separation Device (CBQSD) is simulated numerically using the Eulerian-Lagrangian method and different turbulence models of RNG k-ε, k-ω, and RSM for 1–140 μm particles. A two-way coupling technique is employed to solve the particles’ flow. The effect of inlet flow velocity, the diameter of the splitter plane, and solid particles’ flow rate on the separation efficiency of the device is examined. The results demonstrate that the RSM turbulence model provides more appropriate results compared to RNG k-ε and k-ω models. Four thousand two hundred particles with the size distribution of 1–140 µm enter the device and 3820 particles are trapped and 380 particles leave the device. The efficiency for particles with a diameter greater than 28 µm is 100%. The complete separation of 22–28 μm particles occurs for flow rates of 10–23.5 g/s, respectively. The results reveal that the separation efficiency increases by increasing the inlet velocity, the device diameter, and the diameter of the particles.


Author(s):  
P. Bhattacharya ◽  
S. Nara ◽  
P. Vijayan ◽  
T. Tang ◽  
W. Lai ◽  
...  

A nanofluid is a fluid containing suspended solid particles, with sizes of the order of nanometers. The nanofluids are better conductors of heat than the base fluid itself. Therefore it is of interest to measure the effective thermal conductivity of such a nanofluid. We use temperature oscillation technique to measure the thermal conductivity of the nanofluid. However, first we evaluate the temperature oscillation technique as a tool to measure thermal conductivity of water. Then we validate our experimental setup by measuring the thermal conductivity of the aluminum oxide-water nanofluid and comparing our results with previously published work. Finally, we do a systematic series of measurements of the thermal conductivities of aluminum oxide-water nanofluids at various temperatures and explain the reasons behind the dependence of the enhancement in thermal conductivity of the nanofluid on temperature.


1999 ◽  
Vol 572 ◽  
Author(s):  
W. L. Samey ◽  
L. Salamanca-Riba ◽  
P. Zhou ◽  
M. G. Spencer ◽  
C. Taylor ◽  
...  

ABSTRACTSiC/Si films generally contain stacking faults and amorphous regions near the interface. High quality SiC/Si films are especially difficult to obtain since the temperatures usually required to grow high quality SiC are above the Si melting point. We added Ge in the form of GeH2 to the reactant gases to promote two-dimensional CVD growth of SiC films on (111) Si substrates at 1000°C. The films grown with no Ge are essentially amorphous with very small crystalline regions, whereas those films grown with GeH2 flow rates of 10 and 15 sccm are polycrystalline with the 3C structure. Increasing the flow rate to 20 sccm improves the crystallinity and induces growth of 6H SiC over an initial 3C layer. This study presents the first observation of spontaneous polytype transformation in SiC grown on Si by MOCVD.


1972 ◽  
Vol 52 (3) ◽  
pp. 437-449 ◽  
Author(s):  
T. C. Adamson

A two-dimensional, unsteady, transonic, irrotational, inviscid flow of a perfect gas with constant specific heats is considered. The analysis involves perturbations from a uniform sonic isentropic flow. The governing perturbation potential equations are derived for various orders of the ratio of the characteristic time associated with a temporal flow disturbance to the time taken by a sonic disturbance to traverse the transonicregime. The case where this ratio is large compared to one is studied in detail. A similarity solution involving an arbitrary function of time is found and it is shown that this solution corresponds to unsteady chimel flows with either stationary or time-varying wall shapes. Numerical computations are presented showing the temporal changes in flow structure as a disturbance dies out exponentially for the following typical nozzle flows: simple accelerating (Meyer) flow and flow with supersonic pockets (Taylor and limiting Taylor flow).


Author(s):  
Simon Szykman ◽  
Jonathan Cagan

Abstract This paper introduces a computational approach to three dimensional component layout that employs simulated annealing to generate optimal solutions. Simulated annealing has been used extensively for two dimensional layout of VLSI circuits; this research extends techniques developed for two dimensional layout optimization to three dimensional problems which are more representative of mechanical engineering applications. In many of these applications, miniaturization trends increase the need to achieve higher packing density and fit components into smaller containers. This research addresses the three dimensional packing problem, which is a subset of the general component layout problem, as a framework in which to solve general layout problems.


Sign in / Sign up

Export Citation Format

Share Document