scholarly journals Special Issue on High Performance Abrasive Technologies

2022 ◽  
Vol 16 (1) ◽  
pp. 3-4
Author(s):  
Takazo Yamada ◽  
Kazuhito Ohashi ◽  
Hirofumi Suzuki ◽  
Akinori Yui

Demand for the high-precision and high-efficiency machining of hard ceramics, such as silicon carbide for semiconductors and hardened steel for molding dies, has significantly increased for optical and medical devices as well as for powered devices in automobiles. Certain types of hard metals can be machined by deterministic precision-cutting processes. However, hard and brittle ceramics, hardened steel for molds, and semiconductor materials have to be machined using precision abrasive technologies, such as grinding, polishing, and ultrasonic vibration technologies that use diamond super abrasives. The machining of high-precision components and their molds/dies using abrasive processes is very difficult due to their complex and nondeterministic natures as well as their complex textured surfaces. Furthermore, the development of new cutting-edge tools or machining methods and the active use of physicochemical phenomena are key to the development of high-precision and high-efficiency machining. This special issue features 11 research papers on the most recent advances in precision abrasive technologies. These papers cover the following topics: - Characteristics of abrasive grains in creep-feed grinding - Quantitative evaluation of the surface profiles of grinding wheels - ELID grinding using elastic wheels - Nano-topographies of ground surfaces - Novel grinding wheels - Grinding characteristics of turbine blade materials - Polishing mechanisms - Polishing technologies using magnetic fluid slurries - Application of ultrasonic vibration machining - Turning and rotary cutting technologies This issue is expected to help its readers to understand recent developments in abrasive technologies and to lead to further research. We deeply appreciate the careful work of all the authors, and we thank the reviewers for their incisive efforts.

2019 ◽  
Vol 13 (6) ◽  
pp. 721-721 ◽  
Author(s):  
Hirofumi Suzuki ◽  
Kazuhito Ohashi

The demand for high-precision and high-efficiency machining of hard ceramics such as silicon carbide (SiC) for semiconductors and hardened steel for molding dies has significantly increased for power devices in automobiles, optical devices, and medical devices. Certain types of hard metals can be machined by deterministic precision-cutting processes. However, hard and brittle ceramics, hardened steel for molds, or semiconductor materials have to be machined by precision abrasive technologies such as grinding, polishing, and ultrasonic vibration technologies with diamond super abrasives. The machining of high-precision components and their molds/dies by abrasive processes is much more difficult owing to their complex and nondeterministic nature as well as their complex textured surface. Furthermore, high-energy processes with UV lasers and IR lasers, and ultrasonic vibration can be used to assist abrasive technologies for greater precision and efficiency. In this sense, precision grinding and polishing processes are primarily used to generate high-quality and functional components usually made of hard and brittle materials. The surface quality achieved by precision grinding and polishing processes becomes more important to reduce processing time and costs. This special issue features seven research papers on the most recent advances in precision abrasive technologies for hard materials. These papers cover various abrasive machining processes such as grinding, polishing, ultrasonic-assisted grinding, and laser-assisted technologies. We deeply appreciate the careful work of all the authors and thank the reviewers for their incisive efforts. We also hope that this special issue will encourage further research on abrasive technologies.


2011 ◽  
Vol 325 ◽  
pp. 436-441 ◽  
Author(s):  
Shigeomi Koshimizu

Glass disks are used as substrates for the recording media in magnetic disk devices. To mass produce glass disks, a technology is required for machining glass (a material that is difficult to machine) with both high precision and high efficiency. Consequently, this study adopted a method that processes the inner- and outer-diameters simultaneously using a double core tool. In addition, the thrust force in coring process was also reduced using an ultrasonic spindle to apply ultrasonic vibration to the feed direction of the rotating tool. This resulted in high quality machining with less chipping. Furthermore, this study conducted experiments to compare the three methods of stabilizing the stack of glass substrates. As a result, it was found that the method using ultraviolet curable resin was able to limit the chipping to a smaller size.


2005 ◽  
Vol 291-292 ◽  
pp. 207-212 ◽  
Author(s):  
Hitoshi Ohmori ◽  
Shao Hui Yin ◽  
Wei Min Lin ◽  
Yoshihiro Uehara ◽  
Shinya MORITA ◽  
...  

Metal bonded diamond grinding wheels are widely used in the grinding process, especial in ELID grinding. However, truing is difficult owing to the high toughness of metal bond materials and high hardness of diamond abrasives. To realize high precision and high-efficiency truing, we propose a new micro-truing method consisting of electro-discharge truing and electrolysis-assisted mechanical truing in this paper. The process principle and fundamental experimental results are introduced, and the truing performance is discussed. Research results show that the proposed new method is effective for truing metal bonded diamond grinding wheels.


2018 ◽  
Vol 12 (6) ◽  
pp. 861-861
Author(s):  
Hirofumi Suzuki ◽  
Kazuhito Ohashi

The demand for high-precision hard components and their molds/dies have increased in various industries such as in the optical, automotive, and communication industries, as well as in life and medical sciences. Some difficult-to-machine materials can be reliably machined using deterministic precision cutting processes. On the other hand, hard and brittle materials such as ceramics, carbides, hardened steel of molds, glassy materials, or semiconductor materials have to be machined using precision abrasive technologies with super abrasives of diamond or cBN. However, the machining of high-precision components and their molds/dies by abrasive processes, is much more difficult because of their complex and non-deterministic nature and textured surface. Furthermore, high-energy processes such as laser technology can assist abrasive technologies for ensuring higher precision and efficiency. In this sense, precision grinding and polishing process are primarily used to generate high-quality and functional components usually made of difficult-to-machine materials. The surface quality achievable by precision grinding and polishing processes becomes more important for reducing machining time and costs. This special issue features five research articles – five papers – related to the most recent advances in precision abrasive technology of difficult-to-machine materials. Their subjects cover various abrasive machining processes of grinding, polishing, abrasive flow machining, tooling technology, and laser technologies. We deeply appreciate the careful work of all authors and thank the reviewers for their incisive efforts. We also hope this special issue will trigger further research on abrasive technologies.


2013 ◽  
Vol 690-693 ◽  
pp. 3307-3311
Author(s):  
Jian Zhong Zhang ◽  
Nian Cheng Zhang ◽  
Yue Zhang

It has been one of the difficulties that high-precision thin hole is machined. The supersonic vibration reaming acoustic system is installed in the lathe. The supersonic wave energy applies to reamer to create pulse power on the cutting process. The separating vibration cutting is achieved to make the pulse force. The tests on reaming surface quality and precision are carried. The quality of surface and accuracy machined by this method is more than that by grinding. The reaming process is stability. The cutting force is greatly reduced. The cutting temperature is at room temperature. The tool life is greatly increased. Surface quality and shape precision is greatly improved. The regulations of the ultrasonic vibration reaming thin hole in hardened steel are also summarized. The test results show that the ultrasonic vibration reaming by reamer is of very superior cutting mechanism. It is efficient cutting methods for high-precision thin-hole machining of hardened materials.


Procedia CIRP ◽  
2014 ◽  
Vol 14 ◽  
pp. 389-394 ◽  
Author(s):  
Kazuki Noma ◽  
Yu Takeda ◽  
Tojiro Aoyama ◽  
Yasuhiro Kakinuma ◽  
Seiji Hamada

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