Ultrasonic Coring of Glass Disks Using Double Core Tool

2011 ◽  
Vol 325 ◽  
pp. 436-441 ◽  
Author(s):  
Shigeomi Koshimizu

Glass disks are used as substrates for the recording media in magnetic disk devices. To mass produce glass disks, a technology is required for machining glass (a material that is difficult to machine) with both high precision and high efficiency. Consequently, this study adopted a method that processes the inner- and outer-diameters simultaneously using a double core tool. In addition, the thrust force in coring process was also reduced using an ultrasonic spindle to apply ultrasonic vibration to the feed direction of the rotating tool. This resulted in high quality machining with less chipping. Furthermore, this study conducted experiments to compare the three methods of stabilizing the stack of glass substrates. As a result, it was found that the method using ultraviolet curable resin was able to limit the chipping to a smaller size.

2016 ◽  
Vol 31 (33) ◽  
pp. 1644023 ◽  
Author(s):  
John Hauptman

The reconstruction and high-precision measurement of the four-vectors of [Formula: see text] and [Formula: see text] decays to quarks, which constitute nearly 70% of their decay branching fractions, are critical to a high efficiency and high quality experiment. Furthermore, it is crucial that the energy resolution, and consequently the resolution on the invariant mass of the two fragmenting quarks, is comparable to the energy–momentum resolution on the other particles of the standard model, in particular, electrons, photons, and muons, at energies around 100 GeV. I show that this “unification of resolutions” on all particles of the standard model is now in sight, and will lead to excellent physics at an electron–positron collider.


2014 ◽  
Vol 1027 ◽  
pp. 331-335
Author(s):  
Xiao Bo Wang ◽  
Chong Yang Zhao

According to the unique advantage of the ultrasonic vibration processing in brittle materials, a new processing method, combining ultrasonic vibration and high-speed milling, was presented in this paper, to investigate an adaptation of high-quality and efficient processing in carbon fiber composites. Based on vibration theory, the special ultrasonic vibration milling device suitable for high speed machining centers was designed. Taking into account of a range of issues existing in contact electrical transport under high-speed processing, the contactless induction power transmission system was developed, and the impacts of load, frequency, air gap size as well as the existence of compensation on the transmission performance was discussed. The study shows that carbon fiber composites processed under ultrasonic vibration with high speed, high quality and high efficiency are adapted. Keywords: ultrasonic vibration milling; carbon fiber composites; contactless induction; tool wear


Procedia CIRP ◽  
2014 ◽  
Vol 14 ◽  
pp. 389-394 ◽  
Author(s):  
Kazuki Noma ◽  
Yu Takeda ◽  
Tojiro Aoyama ◽  
Yasuhiro Kakinuma ◽  
Seiji Hamada

2014 ◽  
Vol 800-801 ◽  
pp. 553-558
Author(s):  
Yu Qing Wang ◽  
Shi Gang Wang

With mechanical processing requirements' development direction translates to highprecision, high efficiency, high quality, intelligence and specialty etc. Wedge-caulking's processinghas a lot of problems in our country energy industry market , the problems mainly show lowefficiency, poor accuracy, product quality and technical indicators are difficult to guarantee. Thispaper developed a high precision, high efficiency, intelligence, high quality and specialty machinetool, the enterprise practice results show that the NC wedge-caulking special machine tool provide thetechnical support and equipment protection for our country motor manufacturing. It has the very goodpractical value.


2021 ◽  
Vol 10 (1) ◽  
Author(s):  
Ziqian He ◽  
Kun Yin ◽  
Shin-Tson Wu

AbstractNon-mechanical beam steerers with lightweight, compact, high-efficiency, high-precision, and/or large-angle are pivotal for light detection and ranging (LiDAR) of autonomous vehicles, eye-tracking for near-eye displays, microscopy, optical tweezers, and high-precision three-dimensional (3D) printing. However, even the most matured optical phased array can only provide quasi-continuous, efficient beam steering within a small angle range. A telescope module with an angle magnification function can be coupled to enlarge the steering range or precision. But obtaining a compact, low-cost, lightweight, high-quality telescope module with conventional optics remains challenging. Patterned liquid crystal-based planar optical elements offer great design freedom for manipulating the phase profile of light in 2D space. Owing to the advantages of high efficiency, thinness, low cost, easy processing, flexibility, and response to environmental stimuli, a plethora of high-quality optical devices have been demonstrated. Here, a miniature planar telescope mediated by liquid crystal polymers is proposed to offer angle magnification independent of incident spatial location. It consists of two cascaded liquid crystal planar optical elements, each performing a predefined mathematical transformation. By this concept, planar optical elements are fabricated using a new exposure method and assembled into planar telescopes with different magnification factors. Within the incident field range, over 84.6% optical efficiency is achieved with small wavefront distortion. Such a miniature planar telescope shows the potential of cascaded liquid crystal planar optical elements for realizing functionalities that cannot be fulfilled by single optical elements, and enables lightweight, low loss, passive optical transmitters for widespread applications.


2019 ◽  
Vol 13 (6) ◽  
pp. 721-721 ◽  
Author(s):  
Hirofumi Suzuki ◽  
Kazuhito Ohashi

The demand for high-precision and high-efficiency machining of hard ceramics such as silicon carbide (SiC) for semiconductors and hardened steel for molding dies has significantly increased for power devices in automobiles, optical devices, and medical devices. Certain types of hard metals can be machined by deterministic precision-cutting processes. However, hard and brittle ceramics, hardened steel for molds, or semiconductor materials have to be machined by precision abrasive technologies such as grinding, polishing, and ultrasonic vibration technologies with diamond super abrasives. The machining of high-precision components and their molds/dies by abrasive processes is much more difficult owing to their complex and nondeterministic nature as well as their complex textured surface. Furthermore, high-energy processes with UV lasers and IR lasers, and ultrasonic vibration can be used to assist abrasive technologies for greater precision and efficiency. In this sense, precision grinding and polishing processes are primarily used to generate high-quality and functional components usually made of hard and brittle materials. The surface quality achieved by precision grinding and polishing processes becomes more important to reduce processing time and costs. This special issue features seven research papers on the most recent advances in precision abrasive technologies for hard materials. These papers cover various abrasive machining processes such as grinding, polishing, ultrasonic-assisted grinding, and laser-assisted technologies. We deeply appreciate the careful work of all the authors and thank the reviewers for their incisive efforts. We also hope that this special issue will encourage further research on abrasive technologies.


Author(s):  
Chuan-Yu Tsui ◽  
Chia-Che Wu ◽  
Ming-Chyuan Lu ◽  
Chi-Feng Huang

This paper presents a study to improve machining quality concerning the method of drilling ceramics and other hard and brittle materials such as silicon wafers. Instead of making the drill vibrate by the ultrasonic actuator, a new design of PZT-driving ultrasonic workpiece wafer holder is proposed to ensure the high quality, high efficiency and longer life for micro tools in drilling the silicon wafer. In this paper, ultrasonic workpiece holders are first designed by FEA and fabricated experimentally. Then, the ultrasonic holders is used for a series of experiments under different vibration conditions to examine the behavior of drilled hole accuracy, and edge chipping on the drilled hold surface. Also, the behavior of tool during ultrasonic vibration of holder is examined experimentally. The result demonstrates the ultrasonic workpiece holder could enhance the quality and efficiency for drilling silicon wafers.


2014 ◽  
Vol 623 ◽  
pp. 108-112
Author(s):  
Yu Qing Wang ◽  
Xi Zhao Li

With the requirements of machining develop towards high precision, high efficiency, intelligentization, combination and greenization, in this paper we develop a NC spherical turning and grinding machine tool with high precision and combination to meet the brisk demand of market for spherical workpieces with large diameter and high precision. According to the enterprises’ practice results ,our machine tool can finish machining of large diameter and high precision sphere quickly, with high quality and low cost, and it has a high practical value.


2013 ◽  
Vol 797 ◽  
pp. 368-373 ◽  
Author(s):  
Shigeomi Koshimizu ◽  
Shigeru Aoki

The purpose of this study was to achieve grooving on glass substrates with high levels of efficiency and precision with the use of a diamond grindstone with a small diameter in the range of 1.0-1.8 mm. Mechanical material removal by grinding has high efficiency and enables process control for creating complicated forms, but has a drawback of generating chippings on the processed surface of the brittle glass material. The study gave ultrasonic vibration of 10 μm at 20 kHz in the thrust direction to the rotating small-diameter diamond grindstone in the grinding process, in order to attain high levels of efficiency and precision in micro-grooving of glass. The grooving approach with ultrasonic vibration did create some minor chippings, but succeeded in meeting the target of reducing the average size of chippings around the groove to 0.1 mm or less.


2022 ◽  
Vol 16 (1) ◽  
pp. 3-4
Author(s):  
Takazo Yamada ◽  
Kazuhito Ohashi ◽  
Hirofumi Suzuki ◽  
Akinori Yui

Demand for the high-precision and high-efficiency machining of hard ceramics, such as silicon carbide for semiconductors and hardened steel for molding dies, has significantly increased for optical and medical devices as well as for powered devices in automobiles. Certain types of hard metals can be machined by deterministic precision-cutting processes. However, hard and brittle ceramics, hardened steel for molds, and semiconductor materials have to be machined using precision abrasive technologies, such as grinding, polishing, and ultrasonic vibration technologies that use diamond super abrasives. The machining of high-precision components and their molds/dies using abrasive processes is very difficult due to their complex and nondeterministic natures as well as their complex textured surfaces. Furthermore, the development of new cutting-edge tools or machining methods and the active use of physicochemical phenomena are key to the development of high-precision and high-efficiency machining. This special issue features 11 research papers on the most recent advances in precision abrasive technologies. These papers cover the following topics: - Characteristics of abrasive grains in creep-feed grinding - Quantitative evaluation of the surface profiles of grinding wheels - ELID grinding using elastic wheels - Nano-topographies of ground surfaces - Novel grinding wheels - Grinding characteristics of turbine blade materials - Polishing mechanisms - Polishing technologies using magnetic fluid slurries - Application of ultrasonic vibration machining - Turning and rotary cutting technologies This issue is expected to help its readers to understand recent developments in abrasive technologies and to lead to further research. We deeply appreciate the careful work of all the authors, and we thank the reviewers for their incisive efforts.


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