Since the last two decades, the trend of device miniaturization has increased to get better performance with a smaller area of the logic functions. In deep submicron regime, the demand of fabrication of nanoscale Complementary metal oxide semiconductor (CMOS) VLSI circuits has increased due to evaluation of modern successful portable systems. Leakage power dissipation and reliability issues are major concerns in deep submicron regime for VLSI chip designers. Power supply voltage has been scaled down to maintain the performance yield in future deep submicron regime. The threshold voltage is the critical parameter to trade-off the performance yield and leakage power dissipation in nanoscaled devices. Low threshold voltage improves the device characteristics with large leakage power in nanoscaled devices. Several leakage reduction techniques at different levels are used to mitigate the leakage power dissipation. Lower leakage power increases the reliability by reducing the cooling cost of the portable systems. In this article, we are presenting the explanatory general review of the commonly used leakage reduction techniques at circuit level. We have analyzed the NAND3 gate using HSPICE EDA tool for leakage power dissipation at different technology nodes in active as well as standby modes. Process, voltage and temperature effects are checked for reliability purpose. Our comparative results and discussion of different leakage reduction techniques are very useful to illustrate the effective technique in active and standby modes.
An Efficient Power Optimized 32 bit BCD Adder Using Multi-Channel Technique
