scholarly journals Graphene Based Thermal Conducting Paste and a Standalone Embedded System for Measurement of Thermal Conductivity

2017 ◽  
Vol V (II) ◽  
pp. 571-585
Author(s):  
Ankur Jyoti Borthakur
Keyword(s):  
Thermal Conductivity ◽  
Embedded System ◽  
Thermal Conducting

scholarly journals Thermal Conducting Properties of Metal-fluoroplastic Material Determined by Tribological Method

2021 ◽  
pp. 378-384
Author(s):  
Vasily N. Kornopoltsev ◽  
Bair B. Damdinov
Keyword(s):  
Thermal Conductivity ◽  
Sheet Metal ◽  
Thermal Conductivity Coefficient ◽  
Steel Substrate ◽  
Approximate Determination ◽  
Fourier Law ◽  
Thermophysical Characteristics ◽  
Friction Zone ◽  
Thermal Conducting

The work is devoted to considering the possibility of using the Fourier law and the data of tribological tests for the approximate determination of the thermophysical characteristics of the sheet metal-fluoroplastic material on a steel substrate. The thermal conductivity coefficient of two different fluoroplastic materials was determined by tribological method using the temperature difference in the friction zone. It was shown that friction conditions change from viscoelastic to plastic

The study on effective thermal conductivity of carbon foam based on fractal theory

e-Polymers ◽  
2007 ◽  
Vol 7 (1) ◽  
Author(s):  
Wang Yong ◽  
An Qingqing ◽  
Cao Lingling ◽  
Si Xiaojuan ◽  
Liu Donghui ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Effective Thermal Conductivity ◽  
Theoretical Basis ◽  
Fractal Theory ◽  
Carbon Foam ◽  
Conducting Property ◽  
Thermal Conductivity Model ◽  
Thermal Conducting ◽  
Temperature And Pressure ◽  
The Relationship

AbstractNovel carbon foam with high thermal conductivity is prepared by thermal treating of mesophase pitch under certain temperature and pressure condition. With fractal theory, the thermal conducting property of this novel porous material is discussed. Then we deduce the area fractal dimension of carbon foam. A thermal conductivity model of carbon foam is proposed. The relationship formula of effective thermal conductivity is presented by using thermal resistance method. Through computation, the effective thermal conductivity of carbon foam is acquired. The value of model forecast is consistent with that of the actual observed for carbon foam. This method has provided the theoretical basis for better using its fine heat conduction performance.

A Shape Memory Polymer with Improved Shape Recovery

2004 ◽  
Vol 855 ◽  
Author(s):  
Changdeng Liu ◽  
Patrick T. Mather
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Shape Memory ◽  
Shape Memory Polymer ◽  
Model Fit ◽  
Mechanical Reinforcement ◽  
Conducting Filler ◽  
Thermal Conducting ◽  
Thermally Actuated ◽  
Triggering Process

ABSTRACTThermally actuated shape memory polymers (SMPs) interest, both academically and industrially, due to their ability to memorize a permanent shape that is set during processing and a temporary shape that is later programmed by manipulation above a critical temperature, either Tg or Tm. However, the thermal triggering process for SMPs is usually retarded compared to that of shape memory alloys, because the thermal conductivity of polymers is much lower (<0.30 W/m.K). In the present study, we incorporated a highly thermal conducting filler into a shape memory matrix to increase its thermal conductivity and therefore, shorten the heat transfer progress. A mathematical was worked out that quantitatively relates the material's thermal conductivity with the heat transfer time, τ, also defined as a shape memory induction time. The model fit nicely with our experimental data. In addition, mechanical reinforcement was observed with the addition of this rigid thermal conducting filler.

scholarly journals Production of high thermal conducting aluminum-graphite composite materials by the press-squeeze method utilizing porous graphite preforms and aluminum alloys

2021 ◽  
pp. 68-74
Author(s):  
Sergei Potapov ◽  
Dmitrii Kozlov
Keyword(s):  
Thermal Conductivity ◽  
Composite Materials ◽  
Aluminum Alloys ◽  
Matrix Alloy ◽  
Thermal Interface ◽  
Graphite Composite ◽  
Porous Graphite ◽  
The Press ◽  
Thermal Conducting ◽  
Interface Heat

Consideration is given to the technological process of producing high thermal conducting aluminum-graphite composite materials by press-squeeze method utilizing porous graphite preforms and aluminum alloys. It is shown that the rate of press-squeeze process, aluminum alloy composition provide dense, defect-free and non-porous thermal interface between graphite and matrix alloy, it is noted the absence of crystal inclusions of third phases, such as SiC, Al4C3. An example of evaluation of thermal conductivity of the sample of composite material is given with consideration of graphite particles orientation and matrix-filler thermal interface heat conductivity.

scholarly journals Ultrathin flexible graphene films with high thermal conductivity and excellent EMI shielding performance using large-sized graphene oxide flakes

RSC Advances ◽  
2019 ◽  
Vol 9 (3) ◽  
pp. 1419-1427 ◽  
Author(s):  
Shaofeng Lin ◽  
Su Ju ◽  
Jianwei Zhang ◽  
Gang Shi ◽  
Yonglyu He ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Graphene Oxide ◽  
Electromagnetic Interference ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Shielding Effectiveness ◽  
Emi Shielding ◽  
Emi Shielding Effectiveness ◽  
Graphene Films ◽  
Thermal Conducting

As the demand for wearable and foldable electronic devices increases rapidly, ultrathin and flexible thermal conducting films with exceptional electromagnetic interference (EMI) shielding effectiveness (SE) are greatly needed.

Preparation and Thermal Properties of Novolac Resin/Graphite Nanosheet Composites

2011 ◽  
Vol 391-392 ◽  
pp. 209-213
Author(s):  
Peng Cao ◽  
Shu Hua Qi ◽  
Sha Sha Li
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
In Situ Polymerization ◽  
Expanded Graphite ◽  
Resin Matrix ◽  
Novolac Resin ◽  
Graphite Nanosheets ◽  
Graphite Nanosheet ◽  
Thermal Conducting

In this study, a high thermal conductivity novolac resin /graphite nanosheet composite have been prepared via in situ polymerization at the presence of sonicated expanded graphite. Graphite nanosheets prepared via powering the expanded graphite had a thickness ranging 10~100 nm and a diameter range 5~10μm and were excellent nanofiller for the fabrication of polymer/graphite nanocomposite. Scanning election microscopy was used to characterize the structure and dispersion of the graphite nanosheets and the composites. The results showed that the structure of the nanosheets played an important role in forming thermal conducting network in the novolac resin matrix.

The Carbon Nanotube Based Nanocomposite with Enhanced Thermal Conductivity

2007 ◽  
Vol 121-123 ◽  
pp. 243-246 ◽  
Author(s):  
Y. Wu ◽  
C.H. Liu ◽  
H. Huang ◽  
S.S. Fan
Keyword(s):  
Thermal Conductivity ◽  
Carbon Nanotube ◽  
Thermal Contact ◽  
Current Collector ◽  
Aluminum Film ◽  
Thermal Interface Material ◽  
Heat Current ◽  
Molding Method ◽  
Aligned Carbon Nanotubes ◽  
Thermal Conducting

We present a prototype of thermal interface material (TIM) by incorporating aligned carbon nanotube arrays (CNA) into polydimethylsiloxane (PDMS). The morphology of CNA was maintained by adopting in-situ injection molding method, and the nanotube-polymer composite film was obtained by curing the PDMS at room temperature. We applied steady-state methods to measure the thermal conductivity of this kind of nanocomposite. Comparing to the pure PDMS, the thermal conductivity of the composite was greatly increased, which can be attributed to the thermal conducting passages formed by vertical aligned carbon nanotubes from one side of the film to the other. We also managed to improve the thermal conducting performance of the composite by evaporating a 1-μm-thick aluminum film on the top of a raw CNA, which serves as a heat current collector to decrease the thermal contact resistance. The experiment results suggest these kinds of composites have broad application prospect for thermal management in the future.

Research on Thermal Conductive and Insulating Material Based on Phosphoric Acid Adhesive

2011 ◽  
Vol 399-401 ◽  
pp. 1184-1187
Author(s):  
Yong De Hao ◽  
Hao Kun Liu ◽  
Xuan Xiong
Keyword(s):  
Thermal Conductivity ◽  
Dielectric Constant ◽  
Dielectric Property ◽  
Thermal Conduction ◽  
Relative Dielectric Constant ◽  
Material Research ◽  
Insulating Material ◽  
Conducting Property ◽  
Thermal Conducting ◽  
Auxiliary Material

A thermal conductive and insulating material with H3PO4 as the adhesive, AlN as the principal material of thermal conduction and Al2O3 as auxiliary material, was researched and developed in this paper. The paper explores the influences of components on density, thermal conducting property and dielectric property of the material. Research results show that as to the block sample of (mol)AlN: (mol)Al2O3=90:10, ω(H3PO4)=12% in the research, its density is 2.51 g/cm3, thermal conductivity is 5.655 W/(m•K), and relative dielectric constant under 10 kHz is 6.207.

Study of Thermal Conductivity due to Spins in One-Dimensional Spin Systems AFeX3 (A=Rb, Cs; X=Cl, Br)

2015 ◽  
Vol 827 ◽  
pp. 243-247
Author(s):  
Riesma Tasomara ◽  
T. Kawamata ◽  
Y. Matsuoka ◽  
H. Sudo ◽  
K. Naruse ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Thermal Conductivity ◽  
Magnetic Fields ◽  
Spin Systems ◽  
Zero Field ◽  
One Dimensional ◽  
Conducting Materials ◽  
Thermal Conducting ◽  
Low Dimensional ◽  
Two Peaks

Large contributions of the thermal conductivity due to spins, κspin, in low-dimensional spin systems are expected to be utilized as highly thermal conducting materials. One-dimensional spin system RbFeCl3 with ferromagnetic chains and CsFeBr3 with antiferromagnetic chains in magnetic fields have been prepared in order to observe the contribution of κspin to the value of thermal conductivity. The temperature dependence of the thermal conductivity parallel to spin chains along the c-axis, κ//c, of RbFeCl3 enhanced around 3 K and 10 K by the application of magnetic field. In the thermal conductivity perpendicular to c-axis, κ⊥c, of RbFeCl3, on the other hand, it has been found that only one peak around 3 K is enhanced by the application of magnetic field. Since κ⊥c is mainly owing to the thermal conductivity due to phonons, κphonon, it has been concluded the peak of κ//c around 10 K in magnetic fields is due to the contribution of κspin. For CsFeBr3, it has been found that κ//c shows two peaks around 3 K and 25 K while κ⊥c shows one peak around 12 K in zero field. This indicates that there is a marked contribution of κspin to κ//c. κ⊥ However, the details of the marked contribution of κspin to κ//c are not yet clear, since κ//c has been suppressed by the application of magnetic field in contrast with the enhancement of the thermal conductivity in RbFeCl3.

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