scholarly journals Efficacy of auxiliary devices for removal of fluorescent residue after bracket debonding

2016 ◽  
Vol 87 (3) ◽  
pp. 440-447 ◽  
Author(s):  
Rafael Santos Rocha ◽  
Fabio Martins Salomão ◽  
Lucas Silveira Machado ◽  
Renato Herman Sundfeld ◽  
Ticiane Cestari Fagundes
Keyword(s):  
Sample Thickness ◽  
White Led ◽  
Final Thickness ◽  
Enamel Thickness ◽  
Fluorescent Materials ◽  
Analyze Sample ◽  
Bovine Enamel ◽  
Superficial Area

ABSTRACT Objective: To evaluate four protocols for removal of fluorescent materials after bracket debonding. Materials and Methods: Resin removal from 40 bovine enamel surfaces was performed according to groups (n = 10): conventional (C), white LED (W), LED that evidenced fluorescence (F), and fluorescent lens (FL). The following analyses were performed: sample thickness, superficial area of resin residue, and areas of resin residue or worn enamel in depth. ANOVA and Tukey tests were used to analyze sample thickness (P ≤ .05). Area measurements were analyzed by Kruskal-Wallis and Dunn's tests (P ≤ .05). Results: The FL group showed the highest reduction in enamel thickness. F group final thickness was similar to that of other groups. The largest superficial areas of resin residue were found for the C and W groups, while the FL group had the greatest removal of resin residue. The C group exhibited the largest area in depth of resin residue. The FL and F groups exhibited the most loss of enamel with the least amount of resin residue; in contrast, the C and W groups presented the fewest areas of worn enamel and the most areas of resin residue. Conclusion: Auxiliary devices were useful for removal of fluorescent residue after bracket debonding.

SEM evaluation of the TEM cold-stage double-film specimen

1984 ◽  
Vol 42 ◽  
pp. 272-273
Author(s):  
Jayesh Bellare
Keyword(s):  
Spatial Distribution ◽  
Sample Preparation ◽  
Sample Thickness ◽  
Specimen Preparation ◽  
Preparation Technique ◽  
Liquid Sample ◽  
Thin Specimen ◽  
Sample Preparation Technique ◽  
Cold Stage ◽  
Film Specimen

Seeing is believing, but only after the sample preparation technique has received a systematic study and a full record is made of the treatment the sample gets.For microstructured liquids and suspensions, fast-freeze thermal fixation and cold-stage microscopy is perhaps the least artifact-laden technique. In the double-film specimen preparation technique, a layer of liquid sample is trapped between 100- and 400-mesh polymer (polyimide, PI) coated grids. Blotting against filter paper drains excess liquid and provides a thin specimen, which is fast-frozen by plunging into liquid nitrogen. This frozen sandwich (Fig. 1) is mounted in a cooling holder and viewed in TEM.Though extremely promising for visualization of liquid microstructures, this double-film technique suffers from a) ireproducibility and nonuniformity of sample thickness, b) low yield of imageable grid squares and c) nonuniform spatial distribution of particulates, which results in fewer being imaged.

Slip traces caused by plastic deformation during recrystallization of thin metal sheets

1994 ◽  
Vol 52 ◽  
pp. 620-621
Author(s):  
H. Lin ◽  
D. P. Pope
Keyword(s):  
Grain Size ◽  
Grain Boundaries ◽  
Sample Thickness ◽  
List Type ◽  
Metal Sheets ◽  
Second Phases ◽  
Slip Traces ◽  
Series Of Experiments ◽  
Cold Rolled ◽  
Individual Grains

During a study of mechanical properties of recrystallized B-free Ni3Al single crystals, regularly spaced parallel traces within individual grains were discovered on the surfaces of thin recrystallized sheets, see Fig. 1. They appeared to be slip traces, but since we could not find similar observations in the literature, a series of experiments was performed to identify them. We will refer to them “traces”, because they contain some, if not all, of the properties of slip traces. A variety of techniques, including the Electron Backscattering Pattern (EBSP) method, was used to ascertain the composition, geometry, and crystallography of these traces. The effect of sample thickness on their formation was also investigated.In summary, these traces on the surface of recrystallized Ni3Al have the following properties:1.The chemistry and crystallographic orientation of the traces are the same as the bulk. No oxides or other second phases were observed.2.The traces are not grooves caused by thermal etching at previous locations of grain boundaries.3.The traces form after recrystallization (because the starting Ni3Al is a single crystal).4.For thicknesses between 50 μm and 720 μm, the density of the traces increases as the sample thickness decreases. Only one set of “protrusion-like” traces is visible in a given grain on the thicker samples, but multiple sets of “cliff-like” traces are visible on the thinner ones (See Fig. 1 and Fig. 2).5.They are linear and parallel to the traces of {111} planes on the surface, see Fig. 3.6.Some of the traces terminate within the interior of the grains, and the rest of them either terminate at or are continuous across grain boundaries. The portion of latter increases with decreasing thickness.7.The grain size decreases with decreasing thickness, the decrease is more pronounced when the grain size is comparable with the thickness, Fig. 4.8.Traces also formed during the recrystallization of cold-rolled polycrystalline Cu thin sheets, Fig. 5.

A Study of Optical Properties of a Glass Composition of a ZnO-Bi2O3-P2O5 Glass/Phosphor Composite for a White LED

2015 ◽  
Vol 48 (6) ◽  
pp. 145-150
Author(s):  
Bong-Ki Ryu ◽  
Il-Gu Kim ◽  
Young-Seok Kim ◽  
Jong-Hwan Kim ◽  
Jae-Yeop Jung ◽  
...  
Keyword(s):  
Optical Properties ◽  
Glass Composition ◽  
White Led ◽  
Glass Phosphor

The Model for Calculation the Hall Effect Parameter

2004 ◽  
Vol 9 (2) ◽  
pp. 129-138
Author(s):  
J. Kleiza ◽  
V. Kleiza
Keyword(s):  
Magnetic Field ◽  
Field Effect ◽  
Magnetic Field Effect ◽  
Mapping Method ◽  
Sample Thickness ◽  
System Of Nonlinear Equations ◽  
Specific Resistivity ◽  
Conformal Mapping Method ◽  
Effect Parameter ◽  
The Magnetic Field

A method for calculating the values of specific resistivity ρ as well as the product µHB of the Hall mobility and magnetic induction on a conductive sample of an arbitrary geometric configuration with two arbitrary fitted current electrodes of nonzero length and has been proposed an grounded. During the experiment, under the constant value U of voltage and in the absence of the magnetic field effect (B = 0) on the sample, the current intensities I(0), IE(0) are measured as well as the mentioned parameters under the effect of magnetic fields B1, B2 (B1 ≠ B2), i.e.: IE(β(i)), I(β(i)), i = 1, 2. It has been proved that under the constant difference of potentials U and sample thickness d, the parameters I(0), IE(0) and IE(β(i)), I(β(i)), i = 1, 2 uniquely determines the values of the product µHB and specific resistivity ρ of the sample. Basing on the conformal mapping method and Hall’s tensor properties, a relation (a system of nonlinear equations) between the above mentioned quantities has been found.

A transient macro model of GGNMOS used in white LED driver ESD protection simulation

2014 ◽  
Author(s):  
Yu-xi Jiang ◽  
Mao-ze Li ◽  
Jiao Li ◽  
Gao-chuang Bai ◽  
Yuan-zhang Guo ◽  
...  
Keyword(s):  
White Led ◽  
Led Driver ◽  
Macro Model ◽  
Esd Protection ◽  
White Led Driver

Methodology for TEM Analysis of Barrier Profiles

2002 ◽  
Author(s):  
Tan-Chen Lee ◽  
Jui-Yen Huang ◽  
Li-Chien Chen ◽  
Ruey-Lian Hwang ◽  
David Su
Keyword(s):  
Sample Preparation ◽  
Profile Analysis ◽  
Image Interpretation ◽  
Sample Thickness ◽  
Image Resolution ◽  
Specimen Preparation ◽  
Tem Analysis ◽  
Preparation Methods ◽  
High Image Resolution ◽  
Common Technique

Abstract Device shrinkage has resulted in thinner barriers and smaller vias. Transmission Electron Microscopy (TEM) has become a common technique for barrier profile analysis because of its high image resolution. TEM sample preparation and image interpretation becomes difficult when the size of the small cylindrical via is close to the TEM sample thickness. Effects of different sample thickness and specimen preparation methods, therefore, have been investigated. An automatic FIB program has been shown to be useful in via sample preparation. Techniques for imaging a TEM specimen will be discussed in the paper. Conventional TEM bright field (BF) image is adequate to examine the barrieronly via; however, other techniques are more suitable for a Cu filled via.

Silicon Fringe Sample Metrology—A Thickness Measurement Technique

2013 ◽  
Author(s):  
Mark Kimball
Keyword(s):  
Temperature Dependence ◽  
Temperature Coefficient ◽  
Measurement Technique ◽  
Thickness Measurement ◽  
Sample Thickness ◽  
Index Of Refraction ◽  
Interference Fringes ◽  
Noncontact Method ◽  
Thickness Variations

Abstract Silicon’s index of refraction has a strong temperature coefficient. This temperature dependence can be used to aid sample thinning procedures used for backside analysis, by providing a noncontact method of measuring absolute sample thickness. It also can remove slope ambiguity while counting interference fringes (used to determine the direction and magnitude of thickness variations across a sample).

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