Room-Temperature bonding of AlN ceramic and Si semiconductor substrates for improved thermal management

2021 ◽  
Author(s):  
Takashi Matsumae ◽  
Yuichi Kurashima ◽  
Hideki Takagi ◽  
Kazunori Nishizono ◽  
Tsutomu Amano ◽  
...  
Keyword(s):  
Thermal Management ◽  
Room Temperature ◽  
Semiconductor Substrates

Vapor grown carbon fiber reinforced aluminum composites with very high thermal conductivity

1995 ◽  
Vol 10 (2) ◽  
pp. 247-250 ◽  
Author(s):  
Jyh-Ming Ting ◽  
Max L. Lake
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
Thermal Management ◽  
Room Temperature ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Aluminum Metal ◽  
Aluminum Metal Matrix Composite ◽  
New Material ◽  
Very High

The first use of continuous vapor grown carbon fiber (VGCF) as reinforcement in aluminum metal matrix composite (Al MMC) is reported. Al MMC represents a new material for thermal management in high-power, high-density electronic devices. Due to the ultrahigh thermal conductivity of VGCF, 1950 W/m-K at room temperature, VGCF-reinforced Al MMC exhibits excellent thermal conductivity that cannot be achieved by using any other carbon fiber as reinforcement. An unprecedented high thermal conductivity of 642 W/m-K for Al MMC was obtained by using 36.5% of VGCF.

Thermal Conductivity Measurement of Individual Polythiophene Nanofibers With Suspended Micro-Resistance Thermometer Devices

2012 ◽  
Author(s):  
Sally A. McMenamin ◽  
Annie Weathers ◽  
Virendra Singh ◽  
Michael T. Pettes ◽  
Baratunde A. Cola ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Room Temperature ◽  
Defect Density ◽  
Conductivity Measurement ◽  
Polymer Chains ◽  
High Thermal Conductivity ◽  
Resistance Thermometer ◽  
Aligned Nanofibers ◽  
Measured Thermal Conductivity

High thermal conductivity, comparable to that of a metal, has been observed in some stretched polyethylene nanofibers due to a decrease in defect density with the alignment of the polymer chains. Such high thermal conductivity may be useful for thermal management applications such as thermal adhesives made of aligned nanofibers. Polythiophene (Pth) is a conducting polymer that can be synthesized electrochemically as aligned nanofiber forests without the need for stretching individual fibers. Here we report the thermal conductivity of individual suspended Pth nanofibers synthesized electrochemically and measured with the use of a microfabricated device in the temperature range of 80 K to 375 K. The measured thermal conductivity increases with temperature. For three single suspended Pth nanofibers with a diameter on the order of 200 nm, the room temperature value between 0.6 and 0.8 W/m K is about four-fold higher than that reported for Pth thin films and comparable to that reported for binder-filler thermal adhesives.

scholarly journals Ultrahigh thermal conductivity in isotope-enriched cubic boron nitride

Science ◽  
2020 ◽  
Vol 367 (6477) ◽  
pp. 555-559 ◽  
Author(s):  
Ke Chen ◽  
Bai Song ◽  
Navaneetha K. Ravichandran ◽  
Qiye Zheng ◽  
Xi Chen ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
Thermal Management ◽  
High Power ◽  
Room Temperature ◽  
Cubic Boron Nitride ◽  
Wide Bandgap ◽  
Boron Isotopes ◽  
Fundamental Interest ◽  
Boron Phosphide

Materials with high thermal conductivity (κ) are of technological importance and fundamental interest. We grew cubic boron nitride (cBN) crystals with controlled abundance of boron isotopes and measured κ greater than 1600 watts per meter-kelvin at room temperature in samples with enriched 10B or 11B. In comparison, we found that the isotope enhancement of κ is considerably lower for boron phosphide and boron arsenide as the identical isotopic mass disorder becomes increasingly invisible to phonons. The ultrahigh κ in conjunction with its wide bandgap (6.2 electron volts) makes cBN a promising material for microelectronics thermal management, high-power electronics, and optoelectronics applications.

Room-temperature Repeatedly Processable Baroplastic/Boron Nitride Thermal Management Composite

2021 ◽  
Author(s):  
Jia-Ning Qiao ◽  
Yu Fan Hu ◽  
Xu Ji ◽  
Jian-Hua Tang ◽  
Jun Lei ◽  
...  
Keyword(s):  
High Temperature ◽  
Boron Nitride ◽  
Thermal Degradation ◽  
Energy Saving ◽  
Thermal Management ◽  
Room Temperature ◽  
High Repeatability

Baroplastics show great superiorities over common polymers that are processed at high temperature, such as energy-saving, less thermal degradation, high repeatability and durability, etc. In this work, we synthesized a...

Atomic Force Microscope Chemically Induced Direct Processing

1996 ◽  
Vol 421 ◽  
Author(s):  
B. N. Shimbo ◽  
S. Komarov ◽  
B. J. Vartanian ◽  
Y. Okada ◽  
J. S. Harris
Keyword(s):  
Room Temperature ◽  
Quantum Effect ◽  
Ambient Atmosphere ◽  
Translation Speed ◽  
Conductive Afm ◽  
Atomic Force ◽  
Chemically Induced ◽  
Semiconductor Substrates ◽  
On Line ◽  
Substrate Doping

AbstractInterest in room-temperature operable quantum effect devices has created a need for simple and inexpensive nanofabrication techniques. By applying a bias to a conductive AFM tip, we have succeeded in fabricating narrow (˜30 nm) oxide lines on a variety of metal and III-V semiconductor substrates. The effects of different drawing parameters such as tip bias, translation speed, ambient atmosphere, and substrate doping on line quality were explored.

Thermal management of GaInNAs/GaAs VECSELs

2013 ◽  
Vol 21 (2) ◽  
Author(s):  
A. Sokół ◽  
R. Sarzała
Keyword(s):  
Thermal Management ◽  
Room Temperature ◽  
Radiation Heat Transfer ◽  
Multiple Quantum Well ◽  
External Cavity ◽  
Cavity Surface ◽  
Multiple Quantum ◽  
Radiation Heat ◽  
Surface Emitting Lasers ◽  
Emitting Lasers

AbstractDifferent methods used to reduce temperature increase within the active region of vertical-external-cavity surface-emitting lasers (VECSELs) are described and compared with the aid of the self-consistent thermal finite-element method. Simulations have been carried out for the GaInNAs/GaAs multiple-quantum-well (MQW) VECSEL operating at room temperature at 1.31 μm. Main results are presented in form of ‘thermal maps’ which can be simply used to determine maximal temperature of different structures at specified pumping conditions. It has been found that these maps are also appropriate for some other GaAs-based VECSELs and can be very helpful especially during structure designing. Moreover, convective and thermal radiation heat transfer from laser walls has been investigated.

Heat Switch to Control the Local Thermal Resistance Using Liquid Pillar Control

2009 ◽  
Author(s):  
Su-Heon Jeong ◽  
Wataru Nakayama ◽  
Sun-Kyu Lee
Keyword(s):  
Thermal Resistance ◽  
Thermal Management ◽  
Room Temperature ◽  
Hydrophobic Surface ◽  
Specific Area ◽  
Flow Regulation ◽  
Channel State ◽  
Stop Valve ◽  
Switch Operation ◽  
Electronics Packages

This paper presents the heat switch for electronic package to be operated at room temperature. The heat switch controls the thermal resistance between two objective plates using liquid pillar. By forming the liquid pillar, the temperature of the specific area can be controlled locally. In order to realize the desired switch operation, the heat switch should be provided with reservoir, switching channel and breathing channel. The channels are carefully designed to control the liquid pillar precisely. The liquid pillar formation depends on the liquid contact angle. The designed channel geometry can generate hydrophobic surface by using suddenly diverging shape like as capillary stop valve. Thus, the liquid pillar can be created at desired point with high stability. To verify the switch operation, the switch panel was designed and experiments were performed on a designed switch for the liquid pillar control and the heat flow regulation. The experiments show that the heat switch is able to work properly. Also, the temperature distribution and thermal resistance was changed in accordance with channel state as desired. As a result, the heat switch can be a good candidate of thermal management in the commercial electronics packages.

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