Characterization of Wide Bandgap Device for Cryogenically-Cooled Power Electronics in Aircraft Applications

Author(s):  
Zheyu Zhang ◽  
Handong Gui ◽  
Ren Ren ◽  
Fred Wang ◽  
Leon Tolbert ◽  
...  
2005 ◽  
Vol 900 ◽  
Author(s):  
Claudiu I. Muntele ◽  
Sergey Sarkisov ◽  
Iulia Muntele ◽  
Daryush Ila

ABSTRACTSilicon carbide is a promising wide-bandgap semiconductor intended for use in fabrication of high temperature, high power, and fast switching microelectronics components running without cooling. For hydrogen sensing applications, silicon carbide is generally used in conjunction with either palladium or platinum, both of them being good catalysts for hydrogen. Here we are reporting on the temperature-dependent surface morphology and depth profile modifications of Au, Ti, and W electrical contacts deposited on silicon carbide substrates implanted with 20 keV Pd ions.


Author(s):  
А.И. Печников ◽  
С.И. Степанов ◽  
А.В. Чикиряка ◽  
М.П. Щеглов ◽  
М.А. Одноблюдов ◽  
...  

This paper reports on epitaxial film growth and characterization of α-Ga2O3, a novel wide bandgap semiconducting material. The films were deposited by halide vapour phase epitaxy on basal plane sapphire substrates. The films were from 0.5 μm to over 10 μm in thickness, the latter being the record value by now. Structural and optical properties of the specimens were studied. All specimens were structurally uniform, single phase, and had a corundum-like r3c structure similar to that of sapphire substrate. It was found that the full width at half maximum for the (0006) α-Ga2O3 reflection varies with layer thickness and approaches 240 arcsec for the thickest layer. Both thin and thick layers were transparent in the visible and UV spectral range up to the absorption edge at 5.2 eV.


2021 ◽  
Vol MA2021-02 (32) ◽  
pp. 953-953
Author(s):  
Mark S. Goorsky ◽  
Michael Evan Liao ◽  
Kenny Huynh ◽  
Yekan Steven Wang ◽  
Brandon Carson ◽  
...  

2019 ◽  
Author(s):  
L.J. Brillson ◽  
H. Gao ◽  
C.H. Lin ◽  
G. Foster ◽  
J. Cox
Keyword(s):  

2019 ◽  
Vol 28 (01n02) ◽  
pp. 1940010
Author(s):  
Dong Ji ◽  
Srabanti Chowdhury

Silicon technology enabled most of the electronics we witness today, including power electronics. However, wide bandgap semiconductors are capable of addressing high-power electronics more efficiently compared to Silicon, where higher power density is a key driver. Among the wide bandgap semiconductors, silicon carbide (SiC) and gallium nitride (GaN) are in the forefront in power electronics. GaN is promising in its vertical device topology. From CAVETs to MOSFETs, GaN has addressed voltage requirements over a wide range. Our current research in GaN offers a promising view of GaN that forms the theme of this article. CAVETs and OGFETs (a type of MOSFET) in GaN are picked to sketch the key achievements made in GaN vertical device over the last decade.


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