scholarly journals Harmonic Dual-Band Diode Mixer for the X- and K-Bands

2021 ◽  
Vol 21 (1) ◽  
pp. 64-70
Author(s):  
Jeong Hun Park ◽  
Moon-Que Lee
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Dual Band ◽  
Printed Circuit ◽  
Rf Components ◽  
Reconfigurable Devices ◽  
X Band ◽  
Measurement Results ◽  
K Band

This paper presents a new dual-band diode mixer for the X- and K-bands. The proposed mixer consists of a pair of series-connected diodes and a frequency-dependent delay line that operates at 180° and 360° at the X-band of 10.525 GHz and at the K-band of 24.15 GHz, respectively. Without reconfigurable devices such as switches, the proposed mixer operates as a single-balanced diode mixer at the X-band and a subharmonically pumped antiparallel diode mixer at the K-band simultaneously. The designed circuit was implemented in a hybrid microwave integrated circuit using discretely packaged RF components on a microwave printed circuit board. The measurement results showed conversion losses of 6.5 dB and 16.6 dB at the X- and K-bands, respectively.

scholarly journals Coupling path influence on the conducted emission measurement results by the EMC semiconductor test board

2011 ◽  
Vol 9 ◽  
pp. 303-308
Author(s):  
M. Frick ◽  
R. Eidher ◽  
R. Weigel
Keyword(s):  
Integrated Circuit ◽  
Electromagnetic Compatibility ◽  
Development Time ◽  
Printed Circuit Board ◽  
Development Stage ◽  
Circuit Board ◽  
Emission Measurement ◽  
Specific Test ◽  
Printed Circuit ◽  
Measurement Results

Abstract. The fact of reduced development time in the automotive sector requires a change in the electromagnetic compatibility (EMC) validation of electronic components. To increase the development time of automotive components, e.g. sensors or electronic control units (ECUs), it is mandatory to verify the EMC behavior of the integrated circuit (IC) itself in an early development stage simultaneous to the development process of the entire ECU into which it is embedded. The conducted IC EMC tests emission as well as immunity is realized with a specific test printed circuit board (PCB) which is built according to the guidelines of the Bosch, Infineon, Siemens VDO Specification (BISS, 2007). The measurement results of these EMC tests are affected by the test PCB itself. To deduce the application requirements of the component from the application circuit of the test PCB it is necessary to consider this influence by the printed circuit board. The text at hand gives an overview on how far the emission results are adulterated by the used test PCB. The presented method also grants a validation of the disturbance voltage directly at the IC pin considering the application circuit.

scholarly journals Novel Dual band SIW Filter Using Quad mode Cavity

2019 ◽  
Vol 69 (5) ◽  
pp. 453-457
Author(s):  
Sambaiah Pelluri ◽  
Anmol Jain ◽  
M. V. Kartikeyan
Keyword(s):  
Printed Circuit Board ◽  
Single Layer ◽  
Circuit Board ◽  
Dual Band ◽  
Printed Circuit ◽  
Transmission Zeros ◽  
Measurement Results ◽  
Simulation Results ◽  
Filter Prototype ◽  
Insertion Losses

A dual-band bandpass substrate integrated waveguide (SIW) filter is proposed using a quad-mode cavity in this paper. First two degenerative modes (TE102 and TE201) with via perturbation give the first passband. The second passband is realised by using higher modes (side and diagonal modes of TE202) which are obtained by putting square slot at the center of the cavity. The square slot increases the frequency ratio of the center frequencies of first and second passbands. Moreover, orthogonal feed-lines are used in the proposed design to increase transmission zeros (TZs) which helps to improve the selectivity and out-of-band rejection of the filter. Designed and fabricated a dualband filter prototype using a single layer printed circuit board (PCB) technology, size is only 19 mm × 19 mm. The insertion losses are 2.1 dB and 2.4 dB, and fractional bandwidths of 3.40 per cent and 2.00 per cent at 11.00 and 15.58 GHz, respectively. The measurement results show close agreement with the simulation results.

Application of Lock-in Thermography on PCB for Fault Localization and Validation of Failure Mechanism Due to External Discrete Component Variation

2010 ◽  
Author(s):  
William Ng ◽  
Kevin Weaver ◽  
Zachary Gemmill ◽  
Herve Deslandes ◽  
Rudolf Schlangen
Keyword(s):  
Failure Mechanism ◽  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Hot Spot ◽  
Circuit Board ◽  
Discrete Component ◽  
Printed Circuit ◽  
Thermal Signature ◽  
Lock In

Abstract This paper demonstrates the use of a real time lock-in thermography (LIT) system to non-destructively characterize thermal events prior to the failing of an integrated circuit (IC) device. A case study using a packaged IC mounted on printed circuit board (PCB) is presented. The result validated the failing model by observing the thermal signature on the package. Subsequent analysis from the backside of the IC identified a hot spot in internal circuitry sensitive to varying value of external discrete component (inductor) on PCB.

A K-band delay line based on parasitic reduced artificial left-handed transmission line

2013 ◽  
Vol 5 (6) ◽  
pp. 709-711
Author(s):  
Hyun-Seung Lee ◽  
Eun-Gyu Lee ◽  
Choul-Young Kim
Keyword(s):  
Transmission Line ◽  
Return Loss ◽  
Printed Circuit Board ◽  
Delay Line ◽  
Circuit Board ◽  
Printed Circuit ◽  
Left Handed ◽  
24 Ghz ◽  
K Band ◽  
Interdigital Capacitors

A K-band microstrip delay line based on parasitic reduced left-handed transmission line (LHTL) with interdigital capacitors and shunt inductors is demonstrated with the aid of printed circuit board technology. The proposed delay line has ground slots under the interdigital capacitors to reduce the parasitic capacitance. The time delay of the proposed LHTLs is approximately 2.6 times larger than that of the conventional LHTLs. The input return loss of the proposed LHTL at 24 GHz is −16.9 dB and less than −10 dB from 20.5 to 26.1 GHz.

Estimation Of Complex Permittivity Of Printed Circuit Board Material Using Waveguide Measurements

1996 ◽  
Vol 430 ◽  
Author(s):  
C. J. Reddy ◽  
M. D. Deshpande ◽  
G. A. Hanidu
Keyword(s):  
Dielectric Constant ◽  
Reflection Coefficient ◽  
Complex Permittivity ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
The Finite Element Method ◽  
Printed Circuit ◽  
X Band ◽  
Board Material ◽  
Raphson Method

AbstractA simple waveguide measurement technique is presented to determine the complex permittivity of printed circuit board material. The printed circuit board with metal coating removed from both sides and cut into size which is the same as the cross section of the waveguide is loaded in a short X-band rectangular waveguide. Using a network analyzer, the reflection coefficient of the shorted waveguide(loaded with the sample) is measured. Using the Finite Element Method(FEM) the exact reflection coefficient of the shorted wavguide(loaded with the sample) is determined as a function of dielectric constant. Matching the measured value of the reflection coefficient with the reflection value calculated using FEM and utilizing Newton-Raphson Method, an estimate of the dielectric constant of a printed circuit board material is obtained. A comparison of estimated values of permittivity constant obtained using the present approach with the available data.

scholarly journals Symmetry Two-axis Tilt Angle Capacitive Sensor System

2019 ◽  
Vol 35 (2) ◽  
Author(s):  
Tran Thi Thuy Ha ◽  
Nguyen Dac Hai ◽  
Bui Thanh Tung
Keyword(s):  
Tilt Angle ◽  
Printed Circuit Board ◽  
Capacitive Sensor ◽  
Dielectric Medium ◽  
Circuit Board ◽  
Sensor System ◽  
Angle Sensor ◽  
Printed Circuit ◽  
Measurement Results ◽  
3D Printed

Abstract: This paper presents the design, fabrication and operation of a highly symmetrical two-axis capacitive sensor. The proposed sensor consists of five electrodes, including of an excitation electrode and two pairs of sensing electrodes with exactly the same dimensions, arranged at identified symmetrically locations on a 3D printed hollow sphere, which containing dielectric medium formed by the partly filled oil and the remaining air. The proposed sensor can measure the tilt angle about the x-axis and y-axis with symmetrical outputs. The proposed sensor is fabricated using a rapid prototyping technology and mounted on the surface of a printed circuit board (PCB) for mechanical packaging and signal processing. Experimental measurement results show that the sensor system can measure the tilt angle in both the x- and y-axis with sensitivity of 103 mV/degree and resolution of ±1 degree in the range of -30 degree to +30 degree. This sensor system can be used in many military and consumer applications. Keywords: Capacitive sensor, Fluidic sensor, Two-axis tilt angle sensor.

scholarly journals A DC Circuit Model of Distributed Diodes on Active Substrate Boards for CAD Tools

2021 ◽  
Author(s):  
Pragnan Chakravorty
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Circuit Model ◽  
Circuit Board ◽  
Actual Behavior ◽  
Rf Components ◽  
Active Substrate ◽  
New Type ◽  
Dc Bias ◽  
Ic Technology

In the past few years, a new type of circuit board, named here as active substrate board (ASB), was introduced over circuit applications of diodes. Unlike a traditional printed circuit board (PCB), an ASB has its substrate made of a semiconductor. The inability of the traditional integrated circuit (IC) technology to integrate wavelength dependent radio frequency (RF) components triggered the advent of ASBs. These boards draw desirable features from IC as well as PCB technologies. Unprecedented challenges came up in modeling the different devices fabricated on an ASB owing to their large sizes and the presence of wideband microwaves. So far, modeling the effect of large sizes and ambient microwaves on DC bias of diodes have not been considered in scientific literature. Furthermore, the state of the art numerical simulators are unable to imitate the behavior of such diodes observed over measurements. Here, a semi-analytical, circuit model of distributed diodes on ASB is presented that is fairly accurate in predicting the actual behavior of the diodes. The model also opines a novel phenomenon where microwaves affect the DC characteristics of diodes with added resistances.

scholarly journals A Preliminary Study on Non Contact Thermal Monitoring of Microwave Photonic Systems

Proceedings ◽  
2019 ◽  
Vol 27 (1) ◽  
pp. 19
Author(s):  
Bushra Jalil ◽  
Bilal Hussain ◽  
Maria Pascali ◽  
Giovanni Serafino ◽  
Davide Moroni ◽  
...  
Keyword(s):  
Integrated Circuit ◽  
Printed Circuit Board ◽  
Thermal Fluctuations ◽  
Circuit Board ◽  
Thermal Monitoring ◽  
Photonic Integrated Circuit ◽  
Printed Circuit ◽  
Microwave Photonic ◽  
Preliminary Study ◽  
Arbitrary Location

Microwave photonic systems are more susceptible to thermal fluctuations due to thermo-optic effect. In order to stabilize the performance of photonic components, thermal monitoring is achieved by using thermistors placed at any arbitrary location along the component. This work presents non contact thermography of a fully functional microwave photonic system. The temperature profile of printed circuit board (PCB) and photonic integrated circuit (PIC) is obtained using Fluke FLIR (A65) camera. We performed Otsu’s thresholding to segment heat centers located across PCB as well as PIC. The infrared and visible cameras used in this work have different field of view, therefore, after applying morphological methods, we performed image registration to synchronize both visible and thermal images. We demonstrate this method on the circuit board with active electrical/photonic elements and were able to observe thermal profile of these components.

FTIR analysis of printed-circuit board residue

1996 ◽  
Vol 54 ◽  
pp. 264-265
Author(s):  
Sharon A. Myers ◽  
Troy D. Cognata ◽  
Hugh Gotts
Keyword(s):  
Integrated Circuit ◽  
Isopropyl Alcohol ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Ftir Analysis ◽  
Cotton Swab ◽  
Electrically Conductive ◽  
Printed Circuit ◽  
The Times ◽  
The Individual

Logic boards were failing at Enhanced Mac Minus One (EMMO) test or Integrated Circuit Test (ICT) after printed circuit board (PCB) rework. The failure to boot was originally traced to a suspected bad microcontroller chip. Replacing this chip, or an oscillator tied to the microcontroller circuit, did not consistently solve the boot problem. With further testing, it was found the microcontroller circuit was very sensitive to resistance and was essentially shorted.A resistor in the microcontroller circuit was identified on the flip side of the PCB. Several areas on the board, including the resistor R161, were seen to have a slight white haze/ low gloss appearance on the surface of the PCB. To test if the residue was electrically conductive, five boards were selected whose sole failure was R161. The resistance of the individual resistors was measured with a digital multimeter (DMM). The resistor was then cleaned with isopropyl alcohol and a cotton swab. Each board was retested at ICT and the individual resistors measured again with a DMM. Cleaning the area surrounding the resistor with isopropyl alcohol, corrected the failure four of the times.

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