Flake Formation in Phase Layers of a Cutting Ceramic

2018 ◽  
Vol 38 (2) ◽  
pp. 138-142
Author(s):  
V. N. Puchkin ◽  
A. A. Ryzhkin ◽  
V. E. Burlakova ◽  
T. V. Kashcheeva ◽  
I. D. Storozhenko
Keyword(s):  
2019 ◽  
Vol 76 (3-4) ◽  
pp. 99-101
Author(s):  
A. I. Pronin ◽  
V. V. Myl’nikov ◽  
A. A. Rybalkin

2020 ◽  
Vol 46 (11) ◽  
pp. 18241-18255 ◽  
Author(s):  
S.N. Grigoriev ◽  
M.A. Volosova ◽  
A.A. Vereschaka ◽  
N.N. Sitnikov ◽  
F. Milovich ◽  
...  

2002 ◽  
Vol 74 (7) ◽  
pp. 1554-1559 ◽  
Author(s):  
Paweł Rowiński ◽  
Renata Bilewicz ◽  
Marie-José Stébé ◽  
Ewa Rogalska

2008 ◽  
Vol 277 ◽  
pp. 9-20 ◽  
Author(s):  
Yuri S. Kaganovsky ◽  
Lyudmila N. Paritskaya ◽  
V.V. Bogdanov

The kinetics of growth and lateral spreading of intermetallic layers during surface interdiffusion in Cu – Sn system has been studied in a temperature range 160 – 200oC by the methods of optical microscopy, SEM provided with X-ray microprobe, and AFM. Lateral phase spreading over the surface is characterized by competition between two phases: Cu6Sn5 and Cu3Sn. A steady state solution for concentration distribution on the surface of growing intermetallic phases, as well as kinetic equations of lateral spreading of growing phase layers have been obtained. By comparison of experimental data on intermetallic growth kinetics with the proposed theory, the dynamic surface diffusion coefficients have been calculated.


2006 ◽  
Vol 21 (12) ◽  
pp. 3065-3071 ◽  
Author(s):  
Sinn-wen Chen ◽  
Shih-kang Lin

The electromigration effect upon the γ-InSn4/Cu interfacial reactions have been studied by examining the γ-InSn4/Cu/γ-InSn4 couples annealed at 160 °C with and without current stressing. Scallop-type η-Cu6(Sn,In)5 phase layers are formed in the couples without current stressing and at the γ-InSn4/Cu interface where electrons are flowing from the γ-InSn4 to the Cu. The reaction path is Cu/η-Cu6(Sn,In)5/γ-InSn4. However, very large η-Cu6(Sn,In)5 compounds are found at the Cu/γ-InSn4 interface where electrons are from Cu to the γ-InSn4. Although the melting points of both γ-InSn4 and Cu are higher than 160 °C, the liquid phase is formed at 160 °C in the electrified couple at the downstream γ-InSn4 phase near the Cu/γ-InSn4 interface. The reaction path is Cu/η-Cu6(Sn,In)5/liquid/γ-InSn4. The liquid phase propagates along the grain boundaries of the γ-InSn4 matrix. The very large η-Cu6(Sn,In)5 compounds are the coupling results of the liquid phase penetration and the Cu transport enhancement due to electromigration.


2010 ◽  
Vol 41 (5) ◽  
pp. 1006-1017 ◽  
Author(s):  
Klára Vékony ◽  
László I. Kiss
Keyword(s):  

2008 ◽  
Vol 587-588 ◽  
pp. 425-429 ◽  
Author(s):  
Anibal Guedes ◽  
Filomena Viana ◽  
Ana Maria Pires Pinto ◽  
Manuel F. Vieira

A detail study focussing the microstructural evolution of the interfacial zone in the course of the processing of Ti-47Al-2Cr-2Nb joints using Tini 67 as filler alloy was carried out in this investigation. Experiments, aiming the understanding of the mechanisms that promote the melting of the braze alloy, were performed below the solidus temperature of the filler, at 750 and 900°C. Diffusion brazed samples were joined at 1000 and 1100°C, with no dwelling stage and subsequently quenched in water in order to frozen the microstructure formed at the bonding temperature. The interfaces were analysed by scanning electron microscopy (SEM) and by energy dispersive X-ray spectroscopy (EDS), respectively. In the course of the heating stage, several single phase layers were formed within the filler alloy due to the solid state interdiffusion of Ti and Ni atoms. At 900°C, the microstructure of the filler evolved form the initial Ti (α)/(Ni)/Ti/ (α) layers to a Ti (β)/Ti2Ni/TiNi/TiNi3/TiNi/Ti2Ni/Ti (β) layered microstructure. The filler alloy begun to melt due to the eutectic reaction between the contiguous layers composed of Ti (β) and Ti2Ni. After joining, the main phases detected at the interfaces were α2-Ti3Al, Ti-Ni-Al and Ti-Ni intermetallics. For joining at 1000°C, a substantial amount of residual filler (Ti2Ni and Ti (α) particles) was also detected at the central zone of the interface. No marked evidences of residual filler zones were noticed for joining at 1100°C; instead, a mixture α2-Ti3Al with Ti-Ni-Al or Ti2Ni intermetallics was detected at the centre of the interface.


2007 ◽  
Vol 22 (12) ◽  
pp. 3404-3409 ◽  
Author(s):  
Chao-hong Wang ◽  
Sinn-wen Chen

CoSn3 phase is formed in Sn/Co couples reacted at 200 °C. The reaction phase shows a unique cruciform pattern that is observed for the first time in the solid/solid reaction. The reaction phase layers are thick and uniform along the edges of the Co substrate, and there are no reaction phases at the corners. A continuous reaction layer is formed in Sn/Co couples reacted at 180 °C. A metastable CoSn4 phase is formed at the corner, and the reaction phase along the edge of the Co substrate is the CoSn3 phase. The reaction CoSn3 phase region shows a cruciform pattern if the CoSn4 phase region is ignored. It is concluded that the Sn flux is much faster than the Co flux, and the cruciform pattern of the reaction CoSn3 phase layer is formed either by cracking or transformation to the CoSn4 phase at the corners where stresses are most intensified.


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