TEM Sample Fabrication of Sub 22 nm Three-Dimensional Test Structures

2013 ◽  
Author(s):  
James J. Demarest
Keyword(s):  
Sample Preparation ◽  
Semiconductor Device ◽  
Three Dimensional ◽  
Manufacturing Plants ◽  
Transmission Electron ◽  
Device Structures ◽  
Device Integration ◽  
The One ◽  
Device Technology

Abstract With the 14nm technology node becoming a reality at today's state-of-the-art semiconductor manufacturing plants and the 10nm node actively being planned for, device structures have shrunk well beyond the minimum conventional transmission electron microscope (TEM) sample thickness: 50-100nm. This paper addresses the challenges in TEM sample preparation of sub 22nm three-dimensional test structures. As semiconductor device technology continues to shrink and become more complicated with the addition of three-dimensional device integration, unique sample preparation challenges will continue to arise. This opens the door to novel solutions for these problems like the one presented in this paper: an issue that arose where TEM projection effects interfered with proper characterization of a finFET test structure.

convergent-beam diffraction from surfaces

1987 ◽  
Vol 45 ◽  
pp. 30-33
Author(s):  
J. A. Eades ◽  
A. E. Smith ◽  
D. F. Lynch
Keyword(s):  
Reciprocal Lattice ◽  
Three Dimensional ◽  
Grazing Incidence ◽  
Three Dimensions ◽  
Plane Figure ◽  
Transmission Electron ◽  
Convergent Beam ◽  
Beam Patterns ◽  
Beam Diffraction

It is quite simple (in the transmission electron microscope) to obtain convergent-beam patterns from the surface of a bulk crystal. The beam is focussed onto the surface at near grazing incidence (figure 1) and if the surface is flat the appropriate pattern is obtained in the diffraction plane (figure 2). Such patterns are potentially valuable for the characterization of surfaces just as normal convergent-beam patterns are valuable for the characterization of crystals.There are, however, several important ways in which reflection diffraction from surfaces differs from the more familiar electron diffraction in transmission.GeometryIn reflection diffraction, because of the surface, it is not possible to describe the specimen as periodic in three dimensions, nor is it possible to associate diffraction with a conventional three-dimensional reciprocal lattice.

TEM Sample Preparation by Single-Sided Low-Energy Ion Beam Etching

2011 ◽  
Author(s):  
Liew Kaeng Nan ◽  
Lee Meng Lung
Keyword(s):  
Sample Preparation ◽  
Semiconductor Device ◽  
Ion Beam ◽  
Critical Dimension ◽  
Low Energy ◽  
Ex Situ ◽  
Good Image Quality ◽  
Ion Beam Etching ◽  
Device Structures ◽  
Common Technique

Abstract Conventional FIB ex-situ lift-out is the most common technique for TEM sample preparation. However, the scaling of semiconductor device structures poses great challenge to the method since the critical dimension of device becomes smaller than normal TEM sample thickness. In this paper, a technique combining 30 keV FIB milling and 3 keV ion beam etching is introduced to prepare the TEM specimen. It can be used by existing FIBs that are not equipped with low-energy ion beam. By this method, the overlapping pattern can be eliminated while maintaining good image quality.

scholarly journals Detection Limits of DLS and UV-Vis Spectroscopy in Characterization of Polydisperse Nanoparticles Colloids

2013 ◽  
Vol 2013 ◽  
pp. 1-10 ◽  
Author(s):  
Emilia Tomaszewska ◽  
Katarzyna Soliwoda ◽  
Kinga Kadziola ◽  
Beata Tkacz-Szczesna ◽  
Grzegorz Celichowski ◽  
...  
Keyword(s):  
Light Scattering ◽  
Dynamic Light Scattering ◽  
Point Of View ◽  
Spectroscopy Analysis ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Vis Spectroscopy ◽  
The One

Dynamic light scattering is a method that depends on the interaction of light with particles. This method can be used for measurements of narrow particle size distributions especially in the range of 2–500 nm. Sample polydispersity can distort the results, and we could not see the real populations of particles because big particles presented in the sample can screen smaller ones. Although the theory and mathematical basics of DLS technique are already well known, little has been done to determine its limits experimentally. The size and size distribution of artificially prepared polydisperse silver nanoparticles (NPs) colloids were studied using dynamic light scattering (DLS) and ultraviolet-visible (UV-Vis) spectroscopy. Polydisperse colloids were prepared based on the mixture of chemically synthesized monodisperse colloids well characterized by atomic force microscopy (AFM), transmission electron microscopy (TEM), DLS, and UV-Vis spectroscopy. Analysis of the DLS results obtained for polydisperse colloids reveals that several percent of the volume content of bigger NPs could screen completely the presence of smaller ones. The presented results could be extremely important from nanoparticles metrology point of view and should help to understand experimental data especially for the one who works with DLS and/or UV-Vis only.

Synthesis of Layered Titanate Micro/nano-materials for Efficient Pollutant Treatment in Aqueous Media

2011 ◽  
Vol 1309 ◽  
Author(s):  
Y. X. Tang ◽  
Y. K. Lai ◽  
D. G. Gong ◽  
Zhili Dong ◽  
Z. Chen
Keyword(s):  
Aqueous Media ◽  
Three Dimensional ◽  
High Specific Surface Area ◽  
Nano Materials ◽  
Raman Scattering Spectroscopy ◽  
Micro Particles ◽  
Transmission Electron ◽  
Composition And Structure ◽  
Layered Titanate ◽  
The One

ABSTRACTIn this work, the one dimensional (1D) titanate nanotubes (TNT)/nanowires (TNW), bulk titanate micro-particles (TMP), and three dimensional (3D) titanate microsphere particles (TMS) with high specific surface area were synthesized via different approaches. The chemical composition and structure of these products have been characterized by field emission scanning electron microscopy (FESEM), transmission electron microscope (TEM) study and Raman scattering spectroscopy. The as-prepared TMS shows excellent adsorption performance compared with TMP, TNW and TNT when methylene blue (MB) and PbII ions are used as representative organic and inorganic pollutants.

Electronic Characterization of Compound Semiconductor Surfaces And Interfaces

1982 ◽  
Vol 18 ◽  
Author(s):  
Winfred MÖnch
Keyword(s):  
Semiconductor Device ◽  
Surface States ◽  
Surfaces And Interfaces ◽  
Semiconductor Contacts ◽  
P Type ◽  
Induced Defects ◽  
Chemical Trends ◽  
Thick Layers ◽  
Device Technology

Metal-semiconductor contacts and semiconductor heterojunctions are wellestablished concepts in semiconductor device technology. The key parameters characterizing such junctions are the barrier height and valence band discontinuity at the interface and the electronic interface states. Clean cleaved GaAs(110) surfaces exhibit no intrinsic surface states in the bulk band gap but do exhibit extrinsic cleavage-induced states. Furthermore, local segregates of arsenic were detected. The chemisorption of metals, semiconductors, hydrogen and oxygen causes depletion layers to form on both n-and p-type crystals. The surface states responsible for these band bendings, which persist even under thick layers of metals and semiconductors, are thought to be related to chemisorption-induced defects. Possible candidates are discussed. Chemical trends are also considered.

On the Role of Characterization in the Design of Interfaces in Nanoscale Materials Technology

2004 ◽  
Vol 10 (3) ◽  
pp. 324-335 ◽  
Author(s):  
S.P. Ringer ◽  
K.R. Ratinac
Keyword(s):  
Three Dimensional ◽  
Atom Probe ◽  
Turbine Rotor ◽  
Clay Nanocomposites ◽  
Multimodal Approach ◽  
Transmission Electron ◽  
Different Types ◽  
And Control

This work reviews recent research on the design and control of interfaces in engineering nanomaterials. Four case studies are presented that demonstrate the power of a multimodal approach to the characterization of different types of interfaces. We have used a combination of conventional, high resolution, and analytical transmission electron microscopy, microbeam electron diffraction, and three-dimensional atom probe to study polymer–clay nanocomposites, turbine rotor steels used for power generation, multicomponent aluminum alloys, and nanocrystalline magnetic materials.

scholarly journals Damage Mechanics of Carbon Nanotubes

2020 ◽  
Vol 03 (02) ◽  
pp. 1-1
Author(s):  
George Z. Voyiadjis ◽  
◽  
Peter I. Kattan ◽  
Keyword(s):  
Carbon Nanotubes ◽  
Damage Mechanics ◽  
Three Dimensional ◽  
Damage Variable ◽  
Dimensional Case ◽  
Third Order ◽  
Cross Sectional ◽  
Energy Equivalence ◽  
The One

A robust mathematical method for the characterization of damage in carbon nanotubes is presented the presentation here is limited to elasticity. In this regard, the second and third order elastic stiffnesses are employed. All this is based on damage mechanics. The hypotheses of elastic strain equivalence and elastic energy equivalence are utilized. A new damage variable is proposed that is defined in terms of the surface area. This is in contrast to the classical damage variable which is defined in terms of the cross-sectional area. In the presentation, both the one-dimensional case (scalars) and the three-dimensional case (tensors) are illustrated.

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