Development of DPA (Destructive Physical Analysis) Method for Cu Wire Device

2014 ◽  
Author(s):  
Hirohumi Tateyama ◽  
Wataru Shimizu ◽  
Hidehisa Kubota ◽  
Daisuke Murahara ◽  
Tamiko Hattori ◽  
...  
Keyword(s):  
Cross Section ◽  
Current Method ◽  
Alloy Layer ◽  
Strength Test ◽  
Physical Analysis ◽  
Assembly Process ◽  
Analysis Method ◽  
Cross Sectional ◽  
Reliability Level ◽  
Non Destructive

Abstract Destructive physical analysis (DPA) is one of the reliability evaluation methods, which observes defects and faults in a device, and it can classify the reliability level of the device. After a description of the current method for Au wires, this paper explains the DPA for a Cu wire device. The DPA for semiconductor devices is divided roughly into three steps: a non-destructive inspection, an assembly process inspection, and a wafer process inspection. Investigation of DPA for Cu wire device includes wire material identification, optimization of decapsulation for Cu wire device and wire pull strength test, and observation of package cross-section. From the result, novel sample preparation (embedding a sample in molding package and forming the package to be suitable for cross-sectional observation by ion polishing) enables the observation of the thin alloy layer at the wire/pad interface.

Non-Destructive Top Layer Bond Pad Cross Section

2013 ◽  
Vol 2013 (1) ◽  
pp. 000303-000311
Author(s):  
Terence Q. Collier ◽  
Indira Gubeljic
Keyword(s):  
Cross Section ◽  
Thermal Processing ◽  
Quick Response ◽  
Cross Sectional ◽  
Layer Analysis ◽  
Target Layer ◽  
Bond Pads ◽  
Sectional Analysis ◽  
Non Destructive ◽  
Oxidation And Corrosion

Contaminated and corroded aluminum bond pads can lead to a number of reliability failures. Poor wirebondability, false failures at electrical probe due to high contact resistance, opens on RDL layers due to incomplete sputter, and various early life failures during JEDEC testing can all be attributed to excess oxidation and corrosion on aluminum bond pads. Understanding what layers exist on the bond pad surface is critical. Oxides, hydrates, xyfluorides and various soups of materials can be confirmed from combinations of Auger, SIMMS and FTIR but there is a chance the die can be damaged and the spot sizes can be problematic picking up information outside the bond pad target. Layer analysis of the pad can also be difficult since sputtering rates vary based on the contaminants on the pad and any thermal processing. How does one evaluate bond pads without a destructive test? Is there a process for accurate bond pad evaluation while minimizing die damage? Sure. The cycle time and costs of these tests can also be a concern particularly for a customer wanting a quick response from failure analysis. A better method is to bond the die with a gold stud bump followed by selectively etching away the gold. Etching the gold highlights the intermetallics and shows how much of the gold alloyed with aluminum versus blocked oxides. Voiding can be demonstrated, that might be misconstrued as Kirkendall voiding, by cross sectional analysis.

Analysis of 16 QFN Device I/O Pads for Solderability Failures

2015 ◽  
Vol 2015 (1) ◽  
pp. 000675-000684
Author(s):  
Rama Hegde ◽  
Anne Anderson ◽  
Sam Subramanian ◽  
Andrew Mawer ◽  
Ed Hall ◽  
...  
Keyword(s):  
Cross Section ◽  
Printed Circuit Board ◽  
Depth Profiling ◽  
Lessons Learned ◽  
Circuit Board ◽  
Physical Analysis ◽  
Lead Frame ◽  
Cross Sectional ◽  
Root Cause ◽  
Industry Standard

In-process failures were experienced during printed circuit board (PCB) SMT assembly of a 16 Quad Flat No Leads (QFN) device. The failures appeared to be solderability related with QFN unit I/O pads not soldering robustly and sometimes leading to QFN detachment following board mounting. When assembly did take place on affected QFN units, the resulting solder joint was observed to be weak. This paper reports on very systematic analyses of the QFN device I/O pads using optical inspections, AES surface, AES depth profiling, SEM/EDX, SIMS, FIB and TEM cross-sectional measurements to determine the root cause of the failure and the failure mechanism. The detached QFN units, suspect and good unsoldered units, passing and failing units obtained from customers were examined. The industry standard surface mount solderability testing was performed on good and suspect parts, and all were observed to pass as evidenced by >95% coverage of the I/O pads. Optical inspections and a wide variety of physical analysis of the pads on fresh parts showed no anomalies with only the expected Au over Pd over Ni found. AES analysis was performed including depth profiling to look for any issues in the NiPdAu over base Cu plating layers that could be contributing the solderability failures. The AES depth profiling indicated AuPd film on the Ni under layer for the I/O pads as expected. No unexpected elements or oxide layers were observed at any layer. Then, one failing and one passing units were compared by doing FIB cross-section, FIB planar section and TEM cross-section analysis. The cross-sectional analysis showed rough Ni surface for the failing units, while the Ni surface was relatively smooth for the passing unit. Further, finer Cu grains and Ni grains were observed on the passing units. Additionally, the lead frame fabrication process mapping showed rough Cu, Ni “texturing” and use of low electro chemical polishing (ECP) current on the bad units compared to that of the good units. All affected bad units were confirmed coming from a second source Cu supplier with the rough Cu. The weak and irregular NiSn IMC formation on the bad units caused IMC separation and possible spalling during board solder reflow primarily due to the rough base Cu and irregular grain sizes and resulting lower ECP lead frame plating current. A possible final factor was marginally low Pd thickness. In conclusion, the 16 QFN device solderability failure root cause summary and the lessons learned from a wide variety of analysis techniques will be discussed.

Failure Analysis of a Qualification Unit Injector for a Satellite Thruster

1998 ◽  
Author(s):  
M. Lipschutz ◽  
R. Brannam ◽  
T. Nguyentat
Keyword(s):  
Failure Analysis ◽  
Cross Section ◽  
Combustion Products ◽  
Design Parameters ◽  
Cross Sectional ◽  
X Ray ◽  
Root Cause ◽  
Qualification Testing ◽  
Non Destructive ◽  
Unit Injector

Abstract This article details the results of a failure analysis performed on a Qualification Unit injector for a military satellite thrusters and explains that the failure was initially detected due to a shift in performance during qualification testing. Failure analysis involved non-destructive evaluation on the injector using micro-focus X-ray and scanning electron microscopy. Serial cross-sectional metallography was then performed, with each cross-section documented by optical microscopy and SEM. The failure analysis resulted in three main conclusions: (1) the root cause of the failure was attributed to multiple detonations in or around the damaged orifice; these detonations were likely caused by fuel and/or combustion products condensing in the orifice between pulses and then igniting during a subsequent pulse; (2) multiple damage mechanisms were identified in addition to the ZOT detonations; and (3) the material and platelet manufacturing process met all design parameters.

An Image Analysis Method for Studing Yarn Cross-Sectional Structure

2011 ◽  
Vol 301-303 ◽  
pp. 41-44
Author(s):  
Huang Zhen ◽  
Kun Yang
Keyword(s):  
Image Analysis ◽  
Cross Section ◽  
Binary Operation ◽  
Analysis Method ◽  
Image Analysis Method ◽  
Cross Sectional ◽  
Equal Area ◽  
Fiber Area ◽  
Imagej Software ◽  
Sectional Structure

In this paper, we propose an analysis method for examining yarn cross-sectional structure. After obtaing yarn cross section photos, annular equal area yarn model and binary operation were used for image analysis and treatment. Then, statistic method was applied to analyze the distribution of fiber area in equal areas. The centroid position of the fiber and yarn were calculated, and the percentage values of the fiber area in each equal division against its circle (ring) area were obtained by using an ImageJ software. Finally a yarn sample was examined, and results show that this method is useful.

Effect of Ovality on Shakedown of Pipe Bends

2010 ◽  
Author(s):  
Ali Asadkarami ◽  
Wolf Reinhardt ◽  
Nima Zobeiry
Keyword(s):  
Cross Section ◽  
Circular Cross Section ◽  
Peak Stress ◽  
Mean Stress ◽  
Analysis Method ◽  
Pipe Bend ◽  
Cross Sectional ◽  
Cyclic Bending ◽  
Plastic Analysis ◽  
Asme Code

This paper investigates the effect of pipe bend ovality on the shakedown boundary utilizing the cyclic elastic-plastic analysis method. The ASME Code, Section III NB-3653.2 recognizes the effect of the bend ovality on the peak stress only. The manufacturing rules of ASME NB-4223.2 limit the maximum bend cross sectional ovality to 8%. The effect of the bend ovality on the ratcheting boundary has not been well established in the literature. The current study compares the effect of primary mean stress (i.e. pressure) combined with expansion (secondary) cyclic bending on the shakedown boundary of a prototypical pipe bend with ovalized and fully circular cross section.

Mass Determination by Direct Measurement of Electron Scattering

1975 ◽  
Vol 33 ◽  
pp. 240-241
Author(s):  
M. K. Lamvik ◽  
A. V. Crewe
Keyword(s):  
Cross Section ◽  
Electron Scattering ◽  
Mass Density ◽  
Variable Mass ◽  
Scattering Cross Section ◽  
Mass Determination ◽  
Number Density ◽  
Cross Sectional ◽  
Thin Slice ◽  
Scattering Cross

If a molecule or atom of material has molecular weight A, the number density of such units is given by n=Nρ/A, where N is Avogadro's number and ρ is the mass density of the material. The amount of scattering from each unit can be written by assigning an imaginary cross-sectional area σ to each unit. If the current I0 is incident on a thin slice of material of thickness z and the current I remains unscattered, then the scattering cross-section σ is defined by I=IOnσz. For a specimen that is not thin, the definition must be applied to each imaginary thin slice and the result I/I0 =exp(-nσz) is obtained by integrating over the whole thickness. It is useful to separate the variable mass-thickness w=ρz from the other factors to yield I/I0 =exp(-sw), where s=Nσ/A is the scattering cross-section per unit mass.

A tilting high temperature gas reaction chamber for the JEM 7A T.E.M.

1978 ◽  
Vol 36 (1) ◽  
pp. 70-71
Author(s):  
Brian L. Rhoades
Keyword(s):  
Cross Section ◽  
Reaction Chamber ◽  
Objective Lens ◽  
Reduced Cross Section ◽  
Cross Sectional ◽  
Structural Investigations ◽  
Transmission Electron ◽  
Dynamic Experiments ◽  
Successful Design ◽  
Thermocouple Junction

A gas reaction chamber has been designed and constructed for the JEM 7A transmission electron microscope which is based on a notably successful design by Hashimoto et. al. but which provides specimen tilting facilities of ± 15° aboutany axis in the plane of the specimen.It has been difficult to provide tilting facilities on environmental chambers for 100 kV microscopes owing to the fundamental lack of available space within the objective lens and the scope of structural investigations possible during dynamic experiments has been limited with previous specimen chambers not possessing this facility.A cross sectional diagram of the specimen chamber is shown in figure 1. The specimen is placed on a platinum ribbon which is mounted on a mica ring of the type shown in figure 2. The ribbon is heated by direct current, and a thermocouple junction spot welded to the section of the ribbon of reduced cross section enables temperature measurement at the point where localised heating occurs.

Microstructure of laser-irradiated, conducting Kapton polyimide

1995 ◽  
Vol 53 ◽  
pp. 502-503
Author(s):  
D. L. Callahan ◽  
Z. Ball ◽  
H. M. Phillips ◽  
R. Sauerbrey
Keyword(s):  
Electron Microscopy ◽  
Phase Transition ◽  
Transmission Electron Microscopy ◽  
Cross Section ◽  
Film Surface ◽  
Cross Sectional ◽  
General Utility ◽  
Transmission Electron ◽  
Considerable Debate ◽  
Potential Applications

Ultraviolet laser-irradiation can be used to induce an insulator-to-conductor phase transition on the surface of Kapton polyimide. Such structures have potential applications as resistors or conductors for VLSI applications as well as general utility electrodes. Although the percolative nature of the phase transformation has been well-established, there has been little definitive work on the mechanism or extent of transformation. In particular, there has been considerable debate about whether or not the transition is primarily photothermal in nature, as we propose, or photochemical. In this study, cross-sectional optical microscopy and transmission electron microscopy are utilized to characterize the nature of microstructural changes associated with the laser-induced pyrolysis of polyimide.Laser-modified polyimide samples initially 12 μm thick were prepared in cross-section by standard ultramicrotomy. Resulting contraction in parallel to the film surface has led to distortions in apparent magnification. The scale bars shown are calibrated for the direction normal to the film surface only.

Profil Penyakit Malaria Di Rumah Sakit Islam Siti Rahmah Padang Tahun 2018

2020 ◽  
Vol 2 (2) ◽  
pp. 08-15
Author(s):  
Rahma Triyana ◽  
Salmi Salmi
Keyword(s):  
Observational Study ◽  
Frequency Distribution ◽  
Cross Section ◽  
Laboratory Tests ◽  
Age Group ◽  
Normal Range ◽  
Cross Sectional ◽  
West Sumatra ◽  
Severity Of The Disease

Malaria is one of the health problems in Indonesia, especially West Sumatra. Determination of the description of Malaria disease in an area is needed to determine the spread and severity of the disease. This study aims to determine the frequency distribution according to age, sex and place of residence, description of the types of Plasmodium causes of Malaria and hematological features in Malaria patients at Siti Rahmah Padang Hospital in 2018. This type of research is a descriptive observational study with an approach or design cross section (cross sectional). The frequency distribution of Malaria sufferers in Siti Rahmah Padang Hospital in 2018 according to the highest age was in the age group 21-30 years as many as 28 cases (36.8%), the highest sex among men was 46 (60.5%) and the highest number of residences was found in Koto Tangah sub-district there were 31 cases (40.8%). The type of Plasmodium found in Malaria cases in Siti Rahmah Padang Hospital in 2018 was P. vivax (73 cases (96.05%)) and P. falciparum (3 cases (3.95%)). The results of laboratory tests on Hb, hematocrit, platelet and leukocyte levels in Malaria positive patients in Siti Rahmah Padang Hospital in 2018 were in the normal range.

Profil Penyakit Malaria di Rumah Sakit Islam Siti Rahmah Padang Tahun 2018

2020 ◽  
Vol 2 (2) ◽  
pp. 08-15
Author(s):  
Rahma Triyana Y ◽  
Salmi Salmi
Keyword(s):  
Observational Study ◽  
Frequency Distribution ◽  
Cross Section ◽  
Laboratory Tests ◽  
Age Group ◽  
Normal Range ◽  
Cross Sectional ◽  
West Sumatra ◽  
Severity Of The Disease

Malaria is one of the health problems in Indonesia, especially West Sumatra. Determination of the description of Malaria disease in an area is needed to determine the spread and severity of the disease. This study aims to determine the frequency distribution according to age, sex and place of residence, description of the types of Plasmodium causes of Malaria and hematological features in Malaria patients at Siti Rahmah Padang Hospital in 2018. This type of research is a descriptive observational study with an approach or design cross section (cross sectional). The frequency distribution of Malaria sufferers in Siti Rahmah Padang Hospital in 2018 according to the highest age was in the age group 21-30 years as many as 28 cases (36.8%), the highest sex among men was 46 (60.5%) and the highest number of residences was found in Koto Tangah sub-district there were 31 cases (40.8%). The type of Plasmodium found in Malaria cases in Siti Rahmah Padang Hospital in 2018 was P. vivax (73 cases (96.05%)) and P. falciparum (3 cases (3.95%)). The results of laboratory tests on Hb, hematocrit, platelet and leukocyte levels in Malaria positive patients in Siti Rahmah Padang Hospital in 2018 were in the normal range.

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